EP4SGX360KF40I3 - Stratix IV GX FPGA, 353600 LEs, 1517-FCBGA | Intel
N.º de pieza: EP4SGX360KF40I3 ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2645 | $26.450,00 |
| 100 | $2395 | $239.500,00 |
| 500 | $2150 | $1.075.000,00 |
| 1.000 | $1925 | $1.925.000,00 |
EP4SGX360KF40I3 Descripción general
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), interconnect, and I/O cells that engineers can program after manufacturing to implement custom digital circuits. Stratix IV GX sits within Intel's high-end FPGA hierarchy (Stratix IV > Stratix family > FPGA > programmable logic > semiconductor), targeting applications requiring the highest logic density and serial transceiver bandwidth available.
Key features include 36 embedded transceivers supporting protocols such as PCI Express Gen2, Serial RapidIO, and 10 Gbps backplanes, along with variable-precision DSP blocks for high-performance arithmetic. The KF40 designation indicates a 1517-pin FC-FBGA package rated for industrial temperature grade (-40C to +100C), and the I3 speed grade indicates a specific transceiver/performance bin suitable for most mid-tier applications.
The architecture leverages dedicated hardware for memory interfaces (DDR3 up to 1066 Mbps), dynamic reconfiguration via Partial Reconfiguration, and advanced clocking networks. Power efficiency is achieved through the 40 nm process and programmable power technology that allows unused blocks to enter low-quiescent states, distinguishing Stratix IV from competing FPGAs at higher process nodes.
Typical applications include high-end wireless baseband processing, radar and software-defined radio systems, high-speed serial backplane aggregation, ASIC prototyping, and high-performance computing accelerators. The combination of high-density logic, embedded transceivers, and DSP blocks makes EP4SGX360KF40I3 particularly suited to communication infrastructure and defense/aerospace signal-processing platforms.
When designing with this device, prioritize Quartus II design software and the Stratix IV GX transceiver toolkit. Note that 1517-FCBGA packages require advanced PCB manufacturing capability (substrate via-in-pad, microvia stack-up), and thermal dissipation should be modeled using the published junction-to-theta_JA values before committing to a board stack-up.
This page synthesizes distributor pricing, Stratix IV GX family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EP4SGX360KF40I3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4SGX360KF40I3 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Operating Temperature, Transceivers.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4SGX360KF40I3N
✅ Sustitución directa✓ En stock
$5120 / unidad
Ver hoja de datos →EP4SGX360KF40I4N
✅ Sustitución directa✓ En stock
$3100 / unidad
Ver hoja de datos →EP4SGX360KF40C3
✅ Sustitución directa✓ En stock
$8200 / unidad
Ver hoja de datos →EP4SGX360KF40C4N
✅ Sustitución directa✓ En stock
$3360 / unidad
Ver hoja de datos →EP4SGX360KF40C4
✅ Sustitución directa✓ En stock
$2080 / unidad
Ver hoja de datos →EP4SGX360KF40C3N
✅ Sustitución directa✓ En stock
$1320 / unidad
Ver hoja de datos →EP4SGX360KF40C2N
✅ Sustitución directa✓ En stock
$1850 / unidad
Ver hoja de datos →EP4SGX360KF40C2
✅ Sustitución directa✓ En stock
$10400 / unidad
Ver hoja de datos →EP4SGX360KF40I3 Valores máximos y características eléctricas
| Family | Stratix IV GX |
| Series | EP4SGX360 |
| Logic Elements (LEs) | 353600 |
| Embedded Memory | 23105536 bits (approx 17.5 Mbits / 22838 Kb) |
| Maximum User I/Os | 744 |
| Transceivers | 24 channels (up to 8.5 Gbps) |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| Encapsulado | 1517-ball FCBGA (FC-FBGA) |
| Speed Grade | I3 (industrial performance grade) |
| Temperatura de funcionamiento | -40C to +100C (industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| DSP Blocks | 48-bit variable-precision multipliers |
| Design Software | Quartus II (legacy) / Quartus Prime |
Guía de configuración de pines de EP4SGX360KF40I3 1517-ball fcbga (fc-fbga)
Configuración de pines para EP4SGX360KF40I3 (encapsulado 1517-ball fcbga (fc-fbga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4SGX360KF40I3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4SGX360KF40I3 es adecuado para 6 aplicacións: Wireless Baseband Signal Processing, Radar and Software-Defined Radio, High-Speed Serial Backplane Aggregation, ASIC Prototyping and Emulation, High-Performance Computing Accelerators, Industrial Test and Measurement Equipment.
Wireless Baseband Signal Processing
The EP4SGX360KF40I3 is well suited for wireless baseband processing in 4G/LTE and small-cell infrastructure where high logic density and parallel DSP throughput are required. Its 353,600 logic elements and variable-precision DSP blocks enable implementation of multi-antenna MIMO processing, channel coding (Turbo/LDPC), and FFT/iFFT engines on a single die. The 24 transceivers operating at up to 8.5 Gbps support CPRI/OBSAI fronthaul links between baseband units and remote radio heads, eliminating the need for external PHY chips and reducing BOM cost. The 744 user I/Os provide ample parallel connectivity for backhaul interfaces, timing references, and inter-FPGA synchronization.
Recomendado
Radar and Software-Defined Radio
The EP4SGX360KF40I3 is a strong fit for radar signal processing and software-defined radio (SDR) platforms, where the combination of high-density logic, embedded transceivers, and parallel DSP is critical. The 8.5 Gbps transceivers can digitize and stream ADC samples directly into the FPGA at multi-gigasample rates, while the variable-precision DSP blocks perform pulse compression, MTI filtering, and FFT-based spectral analysis in real time. The KF40 1517-ball FC-FBGA package supports extended -40C to +100C operation, making it suitable for outdoor and airborne radar installations where commercial-grade parts would fail. Military and aerospace designers rely on Stratix IV GX for its combination of high performance and established long-term reliability in harsh environments.
Recomendado
High-Speed Serial Backplane Aggregation
The EP4SGX360KF40I3 is ideal for high-speed serial backplane aggregation in switches, routers, and ATCA/uTCA platforms where multiple 10 Gbps lanes must be combined and processed. With 24 transceivers supporting PCI Express Gen2, Serial RapidIO, XAUI, and 10 Gigabit Ethernet, the device can serve as a flexible aggregation/switching node between line cards. The KF40 package provides sufficient I/O count for inter-FPGA parallel connections across the backplane fabric, while the 17.5 Mbits of embedded memory buffer packet bursts during congestion. Designers typically pair this part with external PHYs for additional SFP+/QSFP cages, but the integrated transceivers reduce board complexity and BOM cost.
Recomendado
ASIC Prototyping and Emulation
The EP4SGX360KF40I3 is widely deployed in ASIC prototyping and logic-emulation systems where its 353,600 logic elements can implement multi-million-gate ASIC designs partitioned across multiple FPGAs. The 8.5 Gbps transceivers support high-speed chip-to-chip inter-FPGA connections required to bridge partition boundaries without throughput bottlenecks. The KF40 package exposes enough user I/Os for prototype target connectors, debug headers, and stimulus/response interfaces. Quartus II design flows allow seamless migration of RTL between the FPGA prototype and the final ASIC tape-out, reducing overall verification time. Emulation vendors rely on this part family for production prototyping of networking, graphics, and processor ASICs.
Recomendado
High-Performance Computing Accelerators
The EP4SGX360KF40I3 is used in high-performance computing (HPC) accelerators where its high-density logic and embedded transceivers enable low-latency coprocessing alongside CPUs and GPUs. The variable-precision DSP blocks accelerate floating-point and fixed-point matrix arithmetic, signal transforms, and financial Monte Carlo simulations with deterministic latency. The 8.5 Gbps transceivers support direct CPU-FPGA interconnects via Intel QPI-compatible protocols or proprietary low-latency links such as NVIDIA Mellanox-based messaging. Embedded memory of 17.5 Mbits provides fast on-chip data caches, reducing external memory accesses during pipelined computations. The industrial -40C to +100C temperature range allows deployment in dense server racks without thermal derating.
Recomendado
Industrial Test and Measurement Equipment
The EP4SGX360KF40I3 is deployed in industrial test and measurement instruments where its high-speed transceivers and parallel DSP enable real-time waveform capture, protocol analysis, and bit-error-rate testing. The 24 transceivers at 8.5 Gbps support simultaneous acquisition of multiple high-speed serial lanes for protocol analyzers and oscilloscopes with deep memory. The 744 user I/Os are well suited for parallel LVDS interfaces, timing references, and synchronization between multiple instrument modules. The -40C to +100C industrial temperature grade supports outdoor and factory-floor deployments where controlled environments are not available. Design teams pair this part with high-speed ADCs and DACs to build modular test platforms with FPGA-based real-time processing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4SGX360KF40I3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4SGX360KF40I3N | EP4SGX360KF40I4N | EP4SGX360KF40C3 | EP4SGX360KF40C4N | EP4SGX360KF40C3N |
|---|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA (KF40) | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same | 1517-ball FC-FBGA (KF40) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | I3 | I3 | I4 (faster) | C3 (commercial grade) | C4 (commercial grade, faster) | C3 (commercial grade) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Elements | 353600 | 353600 | 353600 | 353600 | 353600 | 353600 |
| Embedded Memory | 23105536 bits | 23105536 bits | 23105536 bits | 23105536 bits | 23105536 bits | 23105536 bits |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Transceivers / Max Data Rate | 24 channels / 8.5 Gbps | 24 channels / 8.5 Gbps | 24 channels / 8.5 Gbps | 24 channels / 8.5 Gbps | 24 channels / 8.5 Gbps | 24 channels / 8.5 Gbps |
| RoHS / Lead-Free Verified | Yes (I3 suffix) | Yes (N suffix) | Yes (N suffix) | Not N-suffixed | Yes (N suffix) | Yes (N suffix) |
Diferenciadores clave
- Highest-density Stratix IV GX variant in the KF40 1517-ball FC-FBGA package (frente a EP4SGX230KF40I3N)
- Industrial temperature grade for harsh-environment deployments (frente a EP4SGX360KF40C3)
- I3 speed grade offers mid-tier timing margin at typical cost savings vs I4 (frente a EP4SGX360KF40I4N)
- RoHS/lead-free verified by I3 suffix (frente a EP4SGX360KF40I3 (without explicit RoHS marking in older datasheet revisions))
Notas de diseño
The 1517-ball FC-FBGA (KF40) package uses a 0.8 mm ball pitch, which requires HDI PCB stack-up with microvia (laser-drilled) vias for signal escape. Standard 4-layer FR-4 stack-ups will not provide sufficient routing density; use a 6-8 layer HDI substrate with via-in-pad construction. All power and ground balls must be connected to internal planes with low-impedance stitching vias placed within 0.5 mm of each pad. Power plane islands should be sized to handle the device's estimated transient current at transceiver switching events — refer to the Stratix IV GX PDN design guide for decoupling capacitor selection and placement.
Estimated: at typical Stratix IV GX utilization (60-80% LEs, all 24 transceivers active at 8.5 Gbps, 50% DSP utilization), the EP4SGX360KF40I3 dissipates approximately 15-22 W of power. The FC-FBGA KF40 package has a published theta_JB (junction-to-board) of approximately 0.6 C/W, meaning a heatsink with low thermal resistance is required. Without forced airflow, the junction can exceed 100C in industrial-temperature environments. A heatsink with thermal interface material, combined with a top-side airflow of at least 200 LFM, is recommended for reliable long-term operation in industrial deployments. Use the Stratix IV PowerPlay Early Power Estimator to validate thermal design before committing to the PCB stack-up.
Do not assume all Stratix IV KF40 package variants are drop-in compatible across temperature and speed grades without validating against the design's required operating envelope. The I-suffix is industrial (-40C to +100C), C-suffix is commercial (0C to +85C). Also note that the speed-grade letter (I3 vs I4 vs C3 vs C4) directly affects timing closure — using a slower speed grade (e.g., I4 -> I3) may force a Quartus fitter redesign and may fail timing. Always pin your Quartus design files to a specific device variant and avoid generic KF40 board designs that swap parts post-fabrication.
Place transceiver reference clock inputs and the corresponding transceiver channels within 1 inch of each other on the PCB to minimize reference-clock distribution skew. Use 100-ohm differential routing for all transceiver signals with matched lengths within 5 mils. Keep high-speed transceiver channels away from noisy power regions and isolated by a continuous ground guard trace. For multi-FPGA designs using the EP4SGX360KF40I3, inter-FPGA links should use matched-length SERDES channels and identical routing topology on both devices. Refer to the Stratix IV GX Transceiver Signal Integrity Guide for pre-emphasis and equalization settings.
The EP4SGX360KF40I3 requires multiple supply rails: 0.9 V core, 1.1 V/1.2 V transceiver analog supplies, 1.5 V/1.8 V/2.5 V/3.3 V I/O supplies, and 3.0 V configuration supply. Use a Power Management IC with sequenced soft-start to meet Intel's power-rail sequencing requirements — failure to sequence rails correctly can damage the device or cause configuration failures. Decoupling capacitors should be placed as close to each power ball as possible: 0.1uF X7R ceramic for high-frequency noise and 10-100uF bulk tantalum/polymer for low-frequency decoupling. The Stratix IV PDN design guide provides exact capacitor count and placement requirements for the KF40 package.
Información de cumplimiento
RoHS and lead-free compliance confirmed by Intel (formerly Altera) for Stratix IV GX product line. AEC-Q100 not applicable as FPGAs are not automotive-grade certified. Last-time-buy lifecycle as of 2026-09-10 — design teams should plan migration to Stratix 10 or Cyclone V for new production.
