EPF10K200SBC600-2 - FLEX-10KS FPGA, 200K Gates, 470 I/O | Altera
N.º de pieza: EPF10K200SBC600-2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $130.5 | $1.305,00 |
| 100 | $115 | $11.500,00 |
| 500 | $98.75 | $49.375,00 |
| 1.000 | $85 | $85.000,00 |
EPF10K200SBC600-2 Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer programs after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), but offer higher logic density, embedded memory, and dedicated multipliers. Within power management and digital signal processing hierarchies, FPGAs function as glue logic, custom state machines, protocol bridges, or parallel accelerators. The FLEX 10KS family specifically combines look-up-table based logic with embedded array blocks (EABs) for on-chip RAM and ROM, enabling true SOPC integration.
Key differentiating features of the EPF10K200SBC600-2 include 0.4 ns pin-to-pin propagation delay, embedded array blocks for distributed memory implementation, four phase-locked loops for clock management, multiVolt I/O supporting mixed-voltage interfacing, and in-system programmability via the IEEE 1149.1 JTAG interface. The 600-ball BGA package provides 470 usable user I/O pins, leaving the remainder for power, ground, and configuration pins.
The 1.27 mm pitch BGA and 0.22 micrometer process technology enables industrial-grade reliability while maintaining low power dissipation. The die is identical to other FLEX 10KS 200K-gate variants such as the BGA-600 speed grade -2, allowing PCB layout reuse across speed grades.
Typical applications include telecommunications switching, industrial control systems, military and aerospace prototypes, ASIC prototyping, high-speed data acquisition, and embedded DSP pre-processing. The 470 I/O count makes this part suitable for parallel bus interfacing and high-pin-count glue-logic aggregation.
When designing with this device, allocate sufficient PCB layers for BGA fanout (the 1.27 mm pitch requires at minimum a 4-layer stackup with buried vias for clean routing). Power decoupling must include at least 0.1 microF capacitors within 5 mm of each power pin and bulk capacitance per VCCINT plane.
This page synthesizes distributor pricing, drop-in replacement alternatives, and practical BGA-layout design notes not found in the original Altera datasheet.
Alternativas directas para EPF10K200SBC600-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K200SBC600-2 (mismo factor de forma y huella) — difiere en Process Technology, Package, Configuration Method, RoHS Status, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K200SBC600-1
✅ Sustitución directa✓ En stock
$425 / unidad
Ver hoja de datos →EPF10K200EBC600-2
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EPF10K130EBC600-2
✅ Sustitución directa✓ En stock
$455 / unidad
Ver hoja de datos →EPF10K100EBC356-3
✅ Sustitución directa✓ En stock
$62.5 / unidad
Ver hoja de datos →EPF10K100EBC356-2
✅ Sustitución directa✓ En stock
$59.95 / unidad
Ver hoja de datos →EPF10K200SBC600-2 Valores máximos y características eléctricas
| Manufacturer | Altera (now Intel) |
| Series | FLEX-10KS |
| Logic Elements / Cells | 9,984 |
| Logic Array Blocks (LABs) | 1,248 |
| Typical Gates | 200,000 |
| User I/Os | 470 |
| Propagation Delay | 0.4 ns |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V |
| Temperatura de funcionamiento | 0 C to 70 C |
| Tipo de montaje | Surface Mount |
| Encapsulado / Carcasa | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | 600-BGA |
| Logic Family | CMOS (SRAM-based) |
| Process Technology | 0.22 micrometer |
| Embedded Array Blocks (EABs) | Yes (for distributed RAM/ROM) |
| PLLs | 4 |
| Configuration Interface | IEEE 1149.1 JTAG |
| MultiVolt I/O | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | Bulk / Tray |
| Estado RoHS | Non-compliant |
Guía de configuración de pines de EPF10K200SBC600-2 600-bga
Configuración de pines para EPF10K200SBC600-2 (encapsulado 600-bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K200SBC600-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K200SBC600-2 es adecuado para 6 aplicacións: Telecommunications Switching, Industrial Control Systems, ASIC Prototyping, Military and Aerospace Prototypes, High-Speed Data Acquisition, Embedded DSP Pre-Processing.
Telecommunications Switching
The EPF10K200SBC600-2 suits telecom switching infrastructure where 470 I/Os aggregate multiple backplane buses. The FLEX 10KS architecture supports high-speed state machines, custom protocol bridging, and parallel packet classification. Four PLLs allow multiple clock domain synthesis, and MultiVolt I/O interfaces directly to 3.3 V and 5 V telecom ASICs. In-system JTAG programmability supports field firmware updates. The 0.4 ns propagation delay enables line-rate processing at typical telecom clock rates of 100-150 MHz. The 600-BGA footprint requires 6-layer PCB for clean signal routing. Designers migrating to active-lifecycle silicon can use Cyclone IV GX with transceivers while preserving FPGA-based control logic architecture.
Recomendado
Industrial Control Systems
The EPF10K200SBC600-2 serves industrial PLC, motion control, and SCADA applications requiring deterministic glue logic and parallel I/O aggregation. The 470 I/O count supports dozens of encoder inputs, PWM outputs, and field-bus interfaces in parallel. Embedded array blocks (EABs) implement distributed FIFOs for asynchronous data handoff between industrial sub-systems. The 0 to 70 C commercial temperature range suits factory-floor enclosures with thermal management. Industrial customers often pair the FLEX 10KS with discrete sensors and opto-isolated I/O via MultiVolt compatibility. The SRAM-based configuration supports rapid reconfiguration for different product variants on the same hardware platform, reducing SKU complexity in controller manufacturing.
Recomendado
ASIC Prototyping
The EPF10K200SBC600-2 is widely deployed for ASIC and ASSP prototyping where 200K gates of capacity match many mid-complexity ASICs. Designers map ASIC RTL to the FLEX 10KS fabric using Quartus Prime synthesis, then verify at system speed before tape-out. The 0.4 ns propagation delay approximates fast ASIC cell delays, providing realistic timing closure validation. The 600-BGA footprint exposes enough I/O for emulating ASIC pad-limited designs. Embedded array blocks emulate SRAM/ROM macros. Bitstream porting to production ASIC is straightforward since both use cell libraries; however, EAB mapping requires manual intervention. Customers prototype ASIC functionality, then use the FPGA as fallback if ASIC delivery slips.
Recomendado
Military and Aerospace Prototypes
The EPF10K200SBC600-2 has historically been used in military and aerospace prototype systems requiring high logic density with surface-mount BGA integration. The commercial 0 to 70 C temperature range is suitable for benign-environment prototypes; however, the part's industrial heritage and long Altera production history provided MIL-STD-810 reliability pedigree. Designers prototype flight-computer subsystems, signal-processing front ends, and secure-comm interfaces using the FLEX 10KS, then migrate to rad-hard FPGAs like Microsemi RTG4 or Xilinx Virtex-5QV for production. The 600-BGA 1.27 mm pitch allows shared PCB layout with rad-hard variants of similar footprint, accelerating technology insertion.
Recomendado
High-Speed Data Acquisition
The EPF10K200SBC600-2 supports parallel high-speed data acquisition front-ends where ADC samples must be aggregated, time-stamped, and pre-processed before host transfer. The 470 I/Os accept parallel LVDS or CMOS ADC buses directly, while the 200K-gate fabric implements digital filtering, decimation, and trigger logic. Four PLLs derive multiple ADC clock domains and internal processing clocks from a single reference. Embedded array blocks buffer sample bursts between trigger events. The 0.4 ns propagation delay supports pipeline rates above 100 MHz on critical paths. MultiVolt I/O interfaces to 1.8 V modern ADCs and 5 V legacy converters on the same board.
Recomendado
Embedded DSP Pre-Processing
The EPF10K200SBC600-2 implements pre-DSP glue logic in systems where a downstream DSP or processor performs heavy arithmetic. The FPGA aggregates sensor arrays, implements custom FFT pipelines at the front-end, and feeds processed data to a TI DSP or ARM processor via parallel or serial interface. The 200K-gate fabric supports FIR filter banks, custom correlators, and beam-forming weights for radar or wireless baseband. Embedded array blocks implement coefficient ROMs and delay lines. Four PLLs generate sample clocks and DSP interface clocks from a single TCXO. MultiVolt I/O bridges 3.3 V FPGA logic to 1.8 V DSP cores without external level shifters.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K200SBC600-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K200SBC600-1 | EPF10K200EBC600-2 | EPF10K130EBC600-2 |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 600-BGA (45x45) | 600-BGA (45x45) - same | 600-BGA (45x45) - same | 600-BGA (45x45) - same |
| Family / Architecture | FLEX 10KS | FLEX 10KS | FLEX 10KE (enhanced) | FLEX 10KE (enhanced) |
| Logic Elements | 9,984 | 9,984 | 9,984 (10KE) | 6,912 |
| Typical Gates | 200,000 | 200,000 | 200,000 | 130,000 |
| User I/Os | 470 | 470 | 470 | 470 |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 1.8 V typical (10KE) | 1.8 V typical (10KE) |
| Operating Temperature | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C |
| RoHS Compliance | Non-compliant | Non-compliant | Non-compliant | Non-compliant |
Diferenciadores clave
- High I/O count in 600-BGA footprint (frente a EPF10K130EBC600-2)
- Mature FLEX 10KS proven architecture (frente a EPF10K200EBC600-2)
- Speed grade -2 balanced performance (frente a EPF10K200SBC600-1)
Notas de diseño
The 600-ball BGA with 1.27 mm pitch requires at minimum a 6-layer PCB stackup with buried vias or microvias for clean breakout routing. Per Altera design guidelines, allocate a 0.5 oz copper pour per VCCINT and VCCIO plane, and use 0.1 microF X7R ceramic decoupling capacitors within 5 mm of each power pin. Estimated thermal dissipation at 200 MHz with 80% utilization is approximately 1.5 to 2.0 W; provide copper thermal relief under the package center array to spread heat into inner ground planes.
The FLEX 10KS MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V interfacing but each I/O bank must be powered from a single VCCIO rail. Series-termination resistors (33 ohm typical) are recommended on clock outputs longer than 50 mm to dampen reflections. LVDS inputs require an external 100 ohm differential termination; the device does not include internal LVDS termination. Differential signals must be routed as length-matched pairs with no more than 50 mil length mismatch.
The EPF10K200SBC600-2 is SRAM-based - configuration is lost on power-down. Designs must include a configuration memory (EPC2 or compatible) on every board or accept in-system JTAG programming at every boot. Avoid leaving JTAG TCK floating; tie to ground through 1 kohm if unused. Do not exceed the 2.625 V VCCINT maximum even briefly during power-up transients - use a sequenced power supply or soft-start controller to prevent brown-out reconfiguration glitches.
Estimated junction temperature rise at full utilization: with 1.5 W dissipation and a 600-BGA 45x45 mm package theta-JA of approximately 12 C/W on a 6-layer PCB, junction temperature rises about 18 C above ambient. For 0 to 70 C commercial operation, derate logic utilization to 70% if no airflow is provided. Industrial-grade designs (especially in sealed enclosures) should consider migration to the EPF10K200SBC600-2N industrial-temperature variant or a Cyclone IV successor.
Información de cumplimiento
RoHS non-compliant per MicrochipUSA and distributor listings - uses tin-bolder BGA finish. The -2N suffix variants may indicate industrial temperature grade; standard -2 is commercial 0-70C. Not AEC-Q100 qualified; not applicable for FPGA logic devices.
