EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
N.º de pieza: EPF10K100EBC356-2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $92.72 | $92,72 |
| 10 | $85.5 | $855,00 |
| 100 | $76.8 | $7.680,00 |
| 500 | $68.4 | $34.200,00 |
| 1.000 | $59.95 | $59.950,00 |
EPF10K100EBC356-2 Descripción general
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed to implement custom digital logic. The FLEX-10KE family introduced by Altera pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding dedicated array blocks (EABs) alongside the general-purpose logic fabric, providing on-chip RAM and DSP megafunctions. In the broader hierarchy, the EPF10K100EBC356-2 sits within: programmable logic device -> CPLD/FPGA -> SRAM-based FPGA -> embedded-array FPGA.
Key features of the EPF10K100EBC356-2 include its 2.5 V core supply (speed grade -2), 0.5 ns internal propagation delay, CMOS process technology, and full JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The 356-ball LBGA package provides high I/O density (274 user I/O) for multi-bank designs, while the 12 EABs deliver 49,152 bits of true dual-port RAM suitable for FIFOs, lookup tables, and small buffer memories. The -2 speed grade represents Altera's mid-tier timing bin, suitable for designs targeting up to 250 MHz internal performance.
Typical applications include telecommunications line cards, industrial control and factory automation controllers, military/aerospace signal processing, medical imaging back-end processing, and legacy ASIC prototyping. The embedded array blocks make the FLEX 10KE particularly well-suited to designs requiring on-chip memory integration alongside glue logic, eliminating external SRAM in many mid-complexity designs.
When designing with this part, ensure that the 2.5 V core supply is decoupled with 0.1 uF ceramic capacitors placed within 5 mm of every VCC/GND pair. Configuration data must be loaded from a serial or parallel PROM at power-up via the dedicated configuration pins. The commercial temperature grade (0 to 70 C) limits deployment to non-automotive, non-extended-temperature environments.
Alternativas directas para EPF10K100EBC356-2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K100EBC356-2 (mismo factor de forma y huella) — difiere en Operating Temperature, Process Technology, Logic Array Blocks (LABs), Family, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K100EBC356-2N
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EPF10K100EBC356-2X
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EPF10K100EBC356-1
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EPF10K100EBC356-1N
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$108 / unidad
Ver hoja de datos →EPF10K100EBC356-1X
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EPF10K100EBC356-2 Valores máximos y características eléctricas
| Series | FLEX-10KE |
| Family | Embedded Programmable Logic Device (PLD) |
| Typical Gates | 100,000 |
| Maximum System Gates | 158,000 |
| Logic Elements (LEs) | 4,992 |
| Number of LABs/CLBs | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 49,152 |
| User I/O Pins | 274 |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | 0.5 ns |
| Internal Operating Frequency | up to 250 MHz |
| Process Technology | CMOS, SRAM-based |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Temperatura de funcionamiento | 0 C to 70 C (Commercial) |
| Tipo de montaje | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Speed Grade | -2 |
Guía de configuración de pines de EPF10K100EBC356-2 356-lbga (35 x 35 mm, 1.27 mm pitch)
Configuración de pines para EPF10K100EBC356-2 (encapsulado 356-lbga (35 x 35 mm, 1.27 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K100EBC356-2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K100EBC356-2 es adecuado para 6 aplicacións: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Design Verification, Military and Aerospace Avionics (Legacy Programs), Medical Imaging Back-End Processing, Legacy Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K100EBC356-2 fits mid-complexity telecom line-card designs where its 4,992 logic elements, 49,152 RAM bits across 12 EABs, and 274 user I/O are sufficient for glue logic, protocol adaptation, and small packet buffers. Its 250 MHz internal frequency and 0.5 ns propagation delay support TDM bus interfacing and serial-link state machines. The 356-LBGA's high I/O count accommodates multi-standard PHY interfaces (T1/E1, Ethernet MAC glue) within a single device.
Recomendado
Industrial Control and Factory Automation
The EPF10K100EBC356-2 suits industrial controllers that require deterministic glue logic, custom interface bridging, and small on-chip FIFOs. Its 12 embedded array blocks deliver 49,152 bits of true dual-port RAM, eliminating external SRAM in many PLC, motor-control, and process-instrumentation designs. The commercial 0 to 70 C temperature range and 2.5 V core are compatible with industrial 3.3 V rails via a linear regulator, while 274 I/O handle multi-protocol industrial buses.
Recomendado
ASIC Prototyping and Design Verification
Engineers used the EPF10K100EBC356-2 extensively as an ASIC prototype vehicle because its 4,992 LEs and 49,152 embedded RAM bits approximate mid-range gate-array densities. The 356-LBGA package provides generous I/O for emulating ASIC pad-ring layouts. Quartus II synthesis and the IEEE 1149.1 JTAG interface allow rapid design iteration. This remains a useful application for legacy ASIC verification flows still in production.
Recomendado
Military and Aerospace Avionics (Legacy Programs)
The EPF10K100EBC356-2 served many legacy military and aerospace platforms where its SRAM-based programmability enabled field upgrades of mission logic. The 100K-gate density, 274 I/O, and embedded RAM made it suitable for radar signal preprocessing, navigation interface glue logic, and flight-control instrumentation. While the commercial temperature grade limits new programs, existing defense platforms continue to use this part via Rochester Electronics' long-term support.
Recomendado
Medical Imaging Back-End Processing
The EPF10K100EBC356-2's 12 EABs providing 49,152 RAM bits make it well-suited to medical imaging back-end pipelines where it implements line buffers, lookup tables for gamma correction, and small FIFO queues between image sensors and DSPs. The 250 MHz internal frequency supports real-time pixel-rate processing for ultrasound and endoscopy front-ends. Its low-power 2.5 V core (versus 3.3 V alternatives) reduces thermal load in compact patient-adjacent equipment.
Recomendado
Legacy Test and Measurement Instrumentation
The EPF10K100EBC356-2 is used in legacy test-and-measurement instruments such as logic analyzers, protocol exercisers, and bench-top signal generators where its 4,992 LEs provide ample capacity for custom stimulus generation and protocol decoding. The 274 user I/O support parallel bus capture and pattern generation. Many of these instruments remain in service, driving continued demand for the part on the secondary market via distributors like Rochester Electronics.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K100EBC356-2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K100EBC356-2N | EPF10K100EBC356-2X | EPF10K100EBC356-1 | EPF10K100EBC356-1N | EPF10K100EBC356-1X |
|---|---|---|---|---|---|---|
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | -2 (mid tier) | -2 (mid tier) | -2 (mid tier) | -1 (slower) | -1 (slower) | -1 (slower) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/O | 274 | 274 | 274 | 274 | 274 | 274 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| Lifecycle Status | Obsolete | Obsolete (Rochester authorized) | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Drop-in pin-compatible with -1 and -N speed/finish variants (frente a EPF10K100EBC356-1)
- 12 embedded array blocks with 49,152 RAM bits (frente a EPF10K130EBC356-2)
- 274 user I/O in a 356-LBGA (frente a EPF10K100BFC256-2 (256-BGA))
Notas de diseño
The EPF10K100EBC356-2 requires a low-noise 2.5 V core supply (2.375 V to 2.625 V) capable of delivering peak inrush current during SRAM configuration. Decouple with at least one 10 uF tantalum or polymer bulk capacitor plus four 0.1 uF ceramic capacitors placed within 5 mm of the VCC/GND ball pairs around the 356-LBGA perimeter. Power sequencing is not required because the device is SRAM-based - however, ramp time should not exceed the datasheet limit to avoid latch-up. A dedicated linear regulator (e.g., LT1764 or TPS7A45) is recommended over a switching regulator to minimize core noise on PLL inputs.
The 356-LBGA package has 1.27 mm ball pitch requiring 0.6 mm via land and microvia technology on the BGA fan-out layer. Route all high-speed signals on inner layers with controlled impedance (50 ohm single-ended, 100 ohm differential). Maintain at least 8 mil clearance from adjacent BGA balls to avoid solder-bridge defects at assembly. The exposed die-attach paddle improves thermal performance; connect it to a continuous ground plane with at least 16 thermal vias to the bottom layer.
Configuration data loss is the most common failure mode: SRAM-based FLEX 10KE devices lose all logic contents on power-down and must be reconfigured at every power-up from a serial or parallel configuration PROM (EPC1, EPC2, EPC4, EPC8, or EPC16 family). Do not attempt to use a non-Altera PROM - the FLEX 10KE configuration timing is proprietary. When migrating designs, verify that the new bitstream is recompiled for the exact speed grade (-1 vs -2) and silicon revision, otherwise hold-time violations may occur in high-speed paths.
Información de cumplimiento
RoHS/REACH/lead-free status not present in verified web data; the EPF10K100EBC356-2N suffix per Altera's ordering code typically denotes Pb-free finish. AEC-Q100 not applicable (commercial-grade FPGA).
