EPF10K40RC208-4 - Flex 10K FPGA, 40K Gates, 147 I/O, RQFP-208 | Intel
N.º de pieza: EPF10K40RC208-4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $30.8 | $3.080,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $22.15 | $22.150,00 |
EPF10K40RC208-4 Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), occupying the high-density end above SPLDs and CPLDs. The FLEX 10K family pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding dedicated memory (EABs) alongside the logic fabric, a design pattern later scaled by every subsequent high-density FPGA family.
Key features of the EPF10K40RC208-4 include 147 user I/O pins, 288 LABs (Logic Array Blocks), 0.42 µm CMOS process technology, support for in-system programmability via SRAM configuration cells, and 6 ns propagation delay. The exposed-pad 208-pin RQFP package aids thermal dissipation while keeping the package compatible with existing FLEX 10K board designs.
Architecturally, the FLEX 10K device combines a fine-grained logic fabric with coarse-grained EABs that double as 256×8 or 512×4 dual-port RAM blocks. This hybrid approach allows efficient implementation of both random logic and datapath/memory functions on a single chip, reducing the typical two-chip (FPGA + SRAM) solution to one. Configuration is loaded from a serial or parallel PROM at power-up via the built-in SRAM-based logic.
Typical applications include telecommunications line cards, industrial control logic replacement, glue logic for legacy systems, ASIC prototyping, and embedded controllers. The wide gate count also suits digital signal processing front-ends and bus-interface bridging between microprocessors and peripherals.
When designing with the EPF10K40RC208-4, ensure proper decoupling (0.1 µF + 10 µF bulk near each VCC pin) and verify JTAG chain integrity. The 5 V supply rail and 0.42 µm process mean the device is not directly pin-compatible with 3.3 V Cyclone or MAX families; a level-shifting interface is required when bridging to modern logic.
This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10K family, and design notes not collected in the manufacturer datasheet.
Alternativas directas para EPF10K40RC208-4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K40RC208-4 (mismo factor de forma y huella) — difiere en Package, Typical Gates, Logic Elements / Cells, Mounting Type, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K40RC208-3N
✅ Sustitución directa✓ En stock
$12.95 / unidad
Ver hoja de datos →EPF10K30RC208-4N
✅ Sustitución directa✓ En stock
$24.9 / unidad
Ver hoja de datos →EPF10K30RC208-4N
✅ Sustitución directa✓ En stock
$24.9 / unidad
Ver hoja de datos →EPF10K20RC208-4
✅ Sustitución directa✓ En stock
$19.85 / unidad
Ver hoja de datos →EPF10K20RC208-4N
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →EPF10K40RC208-4 Valores máximos y características eléctricas
| Family | FLEX 10K |
| Logic Elements / Cells | 2,304 |
| Typical Gates | 40,000 |
| Logic Array Blocks (LABs) | 288 |
| Embedded Memory Bits (EAB) | 16,384 bits |
| User I/O Pins | 147 |
| Número de pines | 208 |
| Package Type | 208-BFQFP / RQFP with exposed pad |
| Technology / Process | 0.42 µm CMOS |
| Tensión de alimentación | 5 V |
| Maximum Internal Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Configuration Method | SRAM-based, serial/parallel |
| Temperatura de funcionamiento | 0 °C to 70 °C (commercial) |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EPF10K40RC208-4 208-bfqfp / rqfp with exposed pad
Configuración de pines para EPF10K40RC208-4 (encapsulado 208-bfqfp / rqfp with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K40RC208-4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K40RC208-4 es adecuado para 6 aplicacións: Telecommunications Line Cards, Industrial Control Logic Replacement, ASIC Prototyping, Embedded Controller Glue Logic, DSP Front-End Datapath, Legacy Bus Interface Bridging.
Telecommunications Line Cards
The EPF10K40RC208-4's 40K-gate capacity and 16,384 bits of embedded EAB memory make it well suited for legacy telecom line-card glue logic, where it bridges parallel backplane buses, performs ATM/E1 framing, and runs small state machines. Its 5 V supply tolerance interfaces directly to legacy line-interface units without level shifting. The 147 I/Os give enough headroom for multi-port TDM bus concentration. Designers pair the device with external SRAM for protocol lookup tables and use the EABs as on-chip FIFO buffers.
Recomendado
Industrial Control Logic Replacement
Industrial retrofits that need to replace aging discrete TTL/CMOS glue logic frequently use the EPF10K40RC208-4 because its 5 V I/O tolerance and 208-RQFP surface-mount package fit directly onto legacy control board footprints. The device implements glue logic between PLC CPUs and I/O modules, including address decoding, interrupt steering, and timing-critical handshake sequencing. With 288 LABs and 0.6 ns propagation delay, deterministic sub-microsecond response is achievable for high-speed encoder counters and PWM-driven motor-control glue.
Recomendado
ASIC Prototyping
The EPF10K40RC208-4 served as a popular ASIC prototyping vehicle in the late 1990s and early 2000s because its FLEX 10K architecture maps cleanly to gate-array and standard-cell ASIC designs of similar gate count. Designers port gate-level netlists from ASIC synthesis tools to MAX+PLUS II and validate functionality before committing to NRE (Non-Recurring Engineering) silicon. The 147 I/Os accommodate most ASIC pad-ring pin counts up to that density, and the exposed-pad 208-RQFP provides repeatable thermal behavior at full 1.5 W internal power dissipation.
Recomendado
Embedded Controller Glue Logic
In embedded systems based on PowerPC, 68K, or MIPS microprocessors, the EPF10K40RC208-4 provides bus-interface logic between the CPU and peripherals: address decoding, DMA control, and peripheral chip-select generation. Its 5 V-tolerant I/Os directly drive the 5 V peripheral ecosystem common in 1990s designs without extra buffers. The EABs implement small dual-port FIFOs for inter-processor messaging and high-speed data buffering. Compared to discrete 74-series logic, the EPF10K40 reduces board area by 60-70%.
Recomendado
DSP Front-End Datapath
The EPF10K40RC208-4's EABs can be configured as 256×8 or 512×4 RAM, and combined with the 288 LABs they form useful FIR/IIR filter datapaths for audio-band DSP front-ends. Designers implement MAC (multiply-accumulate) operations using the on-chip logic plus parallel multipliers, and use EABs as coefficient ROM and data delay lines. With 125 MHz maximum internal frequency, the device can process 20+ MHz sample rates in moderate-complexity filters, matching typical audio codec and baseband processing demands.
Recomendado
Legacy Bus Interface Bridging
When modern FPGAs use 1.5 V or 1.8 V cores but must interface to 5 V legacy buses (ISA, PC/104, VME), the EPF10K40RC208-4 acts as a level-translating bridge with its 5 V-tolerant I/Os. The 147 user I/Os are partitioned into multiple I/O banks, allowing mixed-voltage operation when combined with external level shifters. Common bridges implemented include ISA-to-Local Bus, VME-to-PCI legacy converters, and PC/104 to PCI-104 adapters for industrial backplane upgrades.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K40RC208-4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K40RC208-3N | EPF10K30RC208-4 | EPF10K30RC208-4N | EPF10K20RC208-4 | EPF10K20RC208-4N |
|---|---|---|---|---|---|---|
| Package | 208-RQFP (exposed pad) | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K |
| Typical Gates | 40,000 | 40,000 | 30,000 (-25%) | 30,000 (-25%) | 20,000 (-50%) | 20,000 (-50%) |
| Logic Elements | 2,304 | 2,304 | 1,728 (-25%) | 1,728 (-25%) | 1,152 (-50%) | 1,152 (-50%) |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -4 (0.6 ns propagation delay) | -3 (slower) | -4 (same) | -4 (same) | -4 (same) | -4 (same) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Diferenciadores clave
- Highest-capacity FLEX 10K in 208-RQFP pinout (frente a EPF10K30RC208-4)
- Faster speed grade (0.6 ns propagation delay) (frente a EPF10K40RC208-3N)
- Same-footprint 5V tolerance eliminates level shifters (frente a Cyclone EP1C6Q240)
Notas de diseño
The EPF10K40RC208-4 requires a clean 5 V supply; place a 10 µF bulk tantalum capacitor and a 0.1 µF ceramic decoupling capacitor on each VCCINT pin pair (typically 2-3 VCC pins per device side). Estimated: at 100% utilization at 125 MHz, internal core power reaches 1.5 W; insufficient decoupling will cause VCC droop during fast logic transitions, leading to intermittent JTAG configuration failures. Add a ferrite bead in series with the 5 V rail if the supply is shared with high-current motors or relays.
Route configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) as short, parallel traces kept clear of switching I/O nets. Long configuration paths pick up noise that latches the device into a misconfigured state at boot. JTAG chain signals (TCK, TMS, TDI, TDO) should be terminated with 10 kΩ pull-ups to VCCIO for clean boundary-scan operation. The exposed thermal pad must be soldered to a copper pour of at least 1 square inch with thermal vias to the inner ground plane.
Estimated: configuration failure mode is the most common board bring-up issue with the EPF10K40RC208-4. Verify that CONF_DONE goes high within 100 ms after nCONFIG pulse, and that the EPC2 (or compatible) configuration PROM is correctly programmed. Connecting MSEL pins per the datasheet (typically all high for fast parallel configuration) is critical — floating MSEL causes the device to enter an unsupported configuration mode. Do not drive any I/O pin until CONF_DONE goes high or output contention will occur during configuration.
Información de cumplimiento
FLEX 10K family was originally released before RoHS compliance was mandatory for all components; RoHS and lead-free status marked as unknown because the Verified Web Data and Internal Database Data do not explicitly state compliance. AEC-Q100 not applicable (commercial-grade FPGA). For lead-free requirements, choose the EPF10K40RC208-3N or EPF10K30RC208-4N suffix variants which are lead-free per Altera ordering information.
