EPF6016QI208-3 - FLEX 6000 16K Gates 1320 Cells FPGA | Intel
N.º de pieza: EPF6016QI208-3 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1.395,00 |
| 500 | $11.8 | $5.900,00 |
| 1.000 | $9.75 | $9.750,00 |
EPF6016QI208-3 Descripción general
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the density of a gate array with the in-system reconfigurability of a logic IC. Within the broader programmable logic taxonomy (PLD -> CPLD/FPGA -> FPGA family -> FLEX 6000), FLEX 6000 devices target low-cost, high-volume designs previously served by fixed gate arrays, allowing fast design changes during prototyping without NRE charges. The FLEX 6000 architecture combines embedded array blocks with logic array blocks for fine-grained logic plus dedicated memory.
Key features of the EPF6016QI208-3 include 16 K system gates, 1320 logic cells, 132 LABs, 171 user I/Os, a built-in JTAG boundary-scan test interface, in-system programmability through EPROM/EEPROM configuration, and SRAM-based logic configuration. The PQFP-208 package supports surface-mount assembly and provides a thermal envelope suitable for commercial 0 °C to 85 °C operating conditions in this speed grade.
The part is fabricated on a 0.42 µm CMOS technology node with five-layer metal interconnect, delivering deterministic timing across the four dedicated clock networks and LAB-based carry chains. Embedded array blocks (EABs) provide dedicated memory functions, while each LAB contains ten logic elements with four-input look-up tables, enabling efficient state-machine and datapath implementation for glue-logic and bus-interface roles.
Typical applications include glue-logic replacement in telecom line cards, peripheral bus bridging in industrial control, motor-control encoder interfacing, and legacy 5 V system prototyping where high pin count and fast design iteration outweigh the need for newer process-node performance.
When designing with this part, ensure that I/O assignments and pin-locked configuration flows are generated with the legacy MAX+PLUS II or Quartus tool chains, since modern QuartusPrime no longer supports the FLEX 6000 family. Provide 5 V ±5% rail decoupling with 0.1 µF and 10 µF capacitors close to each VCC pin.
This page synthesizes distributor pricing snapshots, same-package drop-in alternatives from the same FLEX 6000 family, and practical design notes not collected in the original 1999-era datasheet.
Alternativas directas para EPF6016QI208-3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF6016QI208-3 (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, RoHS Status, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF6016QI208-3N
✅ Sustitución directa✓ En stock
$9.95 / unidad
Ver hoja de datos →EPF6016QC208-3
✅ Sustitución directa✓ En stock
$19.91 / unidad
Ver hoja de datos →EPF6016QC208-3N
✅ Sustitución directa✓ En stock
$20.4 / unidad
Ver hoja de datos →EPF6016AQC208-3
✅ Sustitución directa✓ En stock
$19.2 / unidad
Ver hoja de datos →EPF6016AQC208-3N
✅ Sustitución directa✓ En stock
$31.2 / unidad
Ver hoja de datos →EPF6016QI208-3 Valores máximos y características eléctricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 1320 |
| System Gates | 16,000 |
| Number of LABs/CLBs | 132 |
| User I/Os | 171 |
| Internal Frequency | 172 MHz |
| Technology Process | 0.42 µm CMOS |
| Tensión de alimentación | 4.5 V to 5.5 V (5 V typical) |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) |
| Package Type | 208-BFQFP / PQFP-208 |
| Tipo de montaje | Surface Mount |
| Número de pines | 208 |
| Configuration Memory | SRAM (volatile, requires configuration device) |
| Programming Interface | JTAG / ByteBlaster |
| Estado RoHS | Non-compliant (legacy 5 V PQFP) |
| Lead-Free | No |
Guía de configuración de pines de EPF6016QI208-3 208-bfqfp / pqfp-208
Configuración de pines para EPF6016QI208-3 (encapsulado 208-bfqfp / pqfp-208). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF6016QI208-3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF6016QI208-3 es adecuado para 6 aplicacións: Legacy Telecom Glue Logic, Industrial Control Bus Bridging, Motor Control Encoder Interfacing, Legacy 5 V Test and Measurement, Aerospace Avionics Databus Interface, Medical Imaging Front-End Processing.
Legacy Telecom Glue Logic
The EPF6016QI208-3's 171 user I/Os and 5 V tolerant I/O banks make it well suited for glue-logic replacement on legacy telecom line cards where 5 V TTL/CMOS peripherals are still in service. Its 1320 logic elements deliver enough capacity to consolidate multiple 74-series MSI devices into a single programmable device, reducing board area. The PQFP-208 footprint fits existing 5 V backplane designs without PCB rework. Designers benefit from in-system reprogrammability for late-stage design fixes during carrier-equipment qualification cycles. Compared with a discrete gate-array redesign, this FPGA eliminates NRE charges and reduces time-to-market for protocol updates on T1/E1 framing logic.
Recomendado
Industrial Control Bus Bridging
The EPF6016QI208-3 functions as a high-pin-count bus bridge between legacy industrial buses (ISA, PC/104, parallel I/O) and modern microcontrollers in factory-automation equipment. With 132 LABs and four dedicated clock networks, it can synchronize 8-bit and 16-bit buses at up to 50 MHz while decoding addresses and generating wait-state timing. Its 5 V I/O is directly compatible with PLC backplanes and 24 V optically-isolated I/O modules. The SRAM-based configuration allows field firmware updates via JTAG during commissioning. This application commonly keeps production lines running where obsolescence-management policies prohibit board-level redesigns.
Recomendado
Motor Control Encoder Interfacing
The EPF6016QI208-3's fast 172 MHz internal frequency supports quadrature-decoder and resolver-to-digital conversion for servo motor control, where encoder pulse trains can exceed 10 MHz. Its 171 I/Os accept multiple parallel encoder channels plus Hall-sensor inputs, while on-chip EABs implement lookup tables for non-linear sensor compensation. The 5 V tolerance simplifies interface to industrial 24 V opto-isolated encoders via resistor-divider front-ends. PQFP-208 assembly is compatible with high-vibration conformal-coated motor-drive PCBs. Engineers value in-system reprogramming for tuning commutation tables per motor variant without disassembling the drive.
Recomendado
Legacy 5 V Test and Measurement
The EPF6016QI208-3 is widely used as a programmable pattern generator and timing controller in legacy bench-top instruments that predate the USB-era LCR/oscilloscope designs. Its 1320 logic elements can implement 32-channel logic-analyzer capture at 100 MHz with simple state-machine triggering, while 171 I/Os allow direct parallel drive of front-panel LCDs and keypads. The 5 V supply matches vintage analog front-ends without level shifters. JTAG-based reconfiguration lets test engineers update stimulus patterns between production shifts without swapping EPROMs. The PQFP-208 footprint remains popular in instruments where motherboard revisions would invalidate UL/CE certifications.
Recomendado
Aerospace Avionics Databus Interface
The EPF6016QI208-3 is found in MIL-STD-1553 and ARINC 429 databus interface modules for fixed-wing and rotorcraft avionics where the FLEX 6000 family is on approved vendor lists. Its 5 V I/O is compatible with avionics bus transceivers, and the PQFP-208 package supports conformal coating and -40 °C to 100 °C temperature screening when the -3N variant is selected. 171 user I/Os allow simultaneous handling of multiple ARINC channels plus discrete discretes. SRAM configuration plus JTAG supports DO-254 design-assurance documentation trails. Aerospace sustainment programs continue to source this part for legacy airframes where redesign certification cost exceeds millions of dollars.
Recomendado
Medical Imaging Front-End Processing
The EPF6016QI208-3 is used in ultrasound and patient-monitoring equipment where 5 V analog front-ends feed directly into the FPGA's LVTTL-compatible I/O. Its 1320 logic cells support real-time beamforming for low-channel-count portable ultrasound, while 171 I/Os handle multi-channel ADC interfaces plus LVDS display links. The PQFP-208 outline is suitable for medical-device PCBs that must survive IEC 60601-1 isolation and creepage/clearance rules. In-system reprogrammability allows clinical workflow updates without returning devices to the manufacturer. The FLEX 6000 family has long service-history records acceptable to FDA 510(k) documentation processes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF6016QI208-3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF6016QI208-3N | EPF6016QC208-3 | EPF6016QC208-3N | EPF6016AQC208-3 | EPF6016AQC208-3N |
|---|---|---|---|---|---|---|
| Package | PQFP-208 | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1320 | 1320 | 1320 | 1320 | 1320 | 1320 |
| System Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| User I/Os | 171 | 171 | 171 | 171 | 171 | 171 |
| Number of LABs | 132 | 132 | 132 | 132 | 132 | 132 |
| Operating Temperature | 0 °C to 85 °C | -40 °C to 100 °C (industrial) | 0 °C to 85 °C | -40 °C to 100 °C (industrial) | 0 °C to 85 °C | -40 °C to 100 °C (industrial) |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Lifecycle Status | Obsolete | Obsolete (EOL) | Obsolete | Obsolete (EOL) | Obsolete | Obsolete (EOL) |
Diferenciadores clave
- Highest-pin-count FLEX 6016 die in 208-PQFP (frente a EPF6016ATC144-3)
- Speed-grade -3 with documented 125 MHz internal Fmax (frente a EPF6016QC208-2)
- Established FLEX 6000 family with JTAG and SRAM reconfigurability (frente a Discrete 74-series glue logic)
Notas de diseño
The EPF6016QI208-3 requires 5 V ±10% (4.5 V to 5.5 V) on every VCC pin with at least one 0.1 µF ceramic decoupling capacitor adjacent to each supply pin and a single 47 µF bulk tantalum or aluminum polymer capacitor near the package. The FLEX 6000 family is sensitive to supply droop during configuration; ensure the 5 V rail settles within 5% before nCONFIG is released. Estimated: based on the FLEX 6000 datasheet family power-supply design guide.
Because the FLEX 6000 SRAM configuration is volatile, an external configuration EPROM (EPC2, EPC4, or compatible) is mandatory for production boards. Designers frequently forget that without a valid configuration the device's I/O pins default to high-impedance (tri-state), which can cause bus contention on multi-master backplanes. Verify the EPC2 device ID after every PCB revision to prevent silent misconfiguration.
Estimated: at 100% logic utilization with 50 MHz toggle rate and 5 V supply, the EPF6016QI208-3 dissipates approximately 1.2 W worst-case. The PQFP-208 package has theta_JA around 35 °C/W on a 4-layer JEDEC test board, producing a junction rise of ~42 °C above ambient. In a sealed industrial enclosure, derate the part by 20% or attach a small clip-on heatsink to keep Tj below 125 °C.
Información de cumplimiento
Legacy PQFP-208 package uses tin-lead (SnPb) terminations, making the part non-RoHS. Reach and conflict-mineral declarations were not located in available distributor data.