GRM155R61A106ME44D - 10uF 10V X5R 0402 MLCC | Murata
N.º de pieza: GRM155R61A106ME44D ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0.0384 | $0,04 |
| 10 | $0.0307 | $0,31 |
| 100 | $0.023 | $2,30 |
| 500 | $0.0184 | $9,20 |
| 1.000 | $0.0145 | $14,50 |
| 4.000 | $0.0115 | $46,00 |
GRM155R61A106ME44D Descripción general
An MLCC (multilayer ceramic capacitor) is the most ubiquitous decoupling and bulk-energy storage element in modern electronics, constructed by stacking alternating ceramic dielectric layers and metal electrodes that are co-fired into a single monolithic chip. The X5R dielectric classification (per EIA-198) defines a stable mid-K formulation that retains between +15% and -15% of nominal capacitance across the -55C to +85C operating range, making X5R a workhorse choice for general-purpose bypass, filtering, and coupling on 3.3V to 10V power rails.
Key features of the GRM155R61A106ME44D include 10 uF nominal capacitance in a miniature 0402 footprint (1.0 mm x 0.5 mm), a 10 V DC rated voltage, and X5R temperature stability. The device supports a -55C to +85C operating temperature range and is supplied in tape-and-reel packaging optimized for high-speed automated assembly. Its low ESR and high volumetric efficiency make it well suited for decoupling applications where PCB real estate is at a premium.
The part leverages Murata's advanced thin-layer dielectric technology to achieve 10 uF in a 0402 footprint that historically housed only 1 uF to 4.7 uF parts. The X5R formulation balances volumetric efficiency against temperature stability - while X5R capacitance will de-rate under DC bias (typical 30-50% loss at rated voltage in this size), the device remains a strong fit for low-voltage digital decoupling where bulk energy storage is the primary requirement.
Typical applications include smartphone PMIC decoupling, IoT sensor module bypass, wearable device power-rail filtering, Bluetooth/Wi-Fi module bulk capacitance, and USB Type-C connector VBUS smoothing. The 0402 size makes it a drop-in choice for high-density mobile and consumer designs where every square millimeter matters.
When designing with this capacitor, account for DC-bias derating - actual capacitance at 5V may be 50-60% of the nominal 10 uF rating. For applications requiring tighter temperature stability or higher voltage ratings, consider X7R or X7S dielectric alternatives. Verify ripple current and ESR against the manufacturer's datasheet curves for your specific decoupling topology.
This page synthesizes distributor pricing, drop-in alternatives from Murata's GRM series and competing MLCC lines, and practical decoupling design notes that complement the manufacturer datasheet.
Alternativas directas para GRM155R61A106ME44D — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con GRM155R61A106ME44D (mismo factor de forma y huella) — difiere en Capacitance, Capacitance Tolerance, Capacitor Type, Mounting Type, Operating Temperature Range.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
GRM155R61A106ME11D
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
GRM155R61A106ME44J
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
GRM155R61E106ME13D
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
CL05A106MP5NUNC
✅ Sustitución directa✓ En stock
$0.015 / unidad
Ver hoja de datos →C1005X5R1A106M050BC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CC0402MRX5R6BB106
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
GRM155R61A106ME44D Valores máximos y características eléctricas
| Capacitance | 10 uF |
| Capacitance Tolerance | +/-20% |
| Rated Voltage (DC) | 10 V |
| Dielectric Characteristic | X5R (EIA) |
| Rango de temperatura de funcionamiento | -55C to +85C |
| Encapsulado / Carcasa | 0402 (1005 metric) |
| Length | 1.0 mm |
| Width | 0.5 mm |
| Tipo de montaje | Surface Mount |
| Termination Style | Solder Plated |
| Capacitor Type | Multilayer Ceramic (MLCC) |
| Estado RoHS | Compliant |
| Packaging | Tape & Reel |
| Temperature Coefficient Code | X5R |
| Series | GRM |
Configuración de pines de GRM155R61A106ME44D
| Pin 1 | Terminal A — Solder terminal (one of two equivalent end-caps) |
| Pin 2 | Terminal B — Solder terminal (one of two equivalent end-caps) |
Aplicaciones típicas
GRM155R61A106ME44D es adecuado para 6 aplicacións: Smartphone PMIC Decoupling, IoT Sensor Module Bypass, Wearable Device Power-Rail Filtering, Bluetooth/Wi-Fi Module Bulk Capacitance, USB Type-C VBUS Smoothing, Consumer Audio Codec Power Decoupling.
Smartphone PMIC Decoupling
The GRM155R61A106ME44D is ideally suited for bulk decoupling on smartphone PMIC (power management IC) outputs where 0402-size 10 uF capacitance is needed directly at the IC pin. Placed between the PMIC buck output and the SoC supply rail, its 10 uF nominal capacitance provides local energy storage that suppresses transient load steps during SoC wake/sleep transitions (typically 200-500 mA steps in <1 us). The 0402 (1.0 mm x 0.5 mm) footprint enables dense placement around multi-rail PMICs where board area is severely constrained; engineers typically place 2-4 of these in parallel near each high-current rail. Trade-off: DC-bias derating reduces effective capacitance to ~5-6 uF at 5V, so verify against your actual load-transient budget.
Recomendado
IoT Sensor Module Bypass
The GRM155R61A106ME44D delivers 10 uF bulk capacitance in a 0402 footprint, making it a strong fit for IoT sensor modules (BLE, Zigbee, LoRa, Wi-Fi) where board area is at a premium. Placed adjacent to the wireless SoC's VDD pins and at the output of the onboard LDO, it suppresses ripple from the buck regulator and provides instantaneous charge during RF transmission bursts (typically 50-150 mA peaks). The X5R dielectric's +/-15% capacitance stability across -55C to +85C is sufficient for outdoor and industrial IoT deployments. The 10V rating provides 2x headroom above typical 3.3V or 4.2V battery rails, supporting USB-powered sensor hubs. For tighter temperature stability, an X7R dielectric alternative may be preferred.
Recomendado
Wearable Device Power-Rail Filtering
The GRM155R61A106ME44D is well matched to wearable electronics (smartwatches, fitness bands, hearables) where 10 uF filtering capacitance must fit on a flex PCB measuring typically 20 mm x 30 mm. Placed at the output of each LDO supplying the display driver, heart-rate sensor, and BLE radio, it filters switching noise from upstream converters and provides bulk energy for sensor sampling pulses. The 0402 case (1.0 mm x 0.5 mm) is small enough to be placed under BGA packages and in flex-PCB inner layers. Engineers should note that X5R dielectric capacitance drops ~50% under DC bias at 5V, so effective bulk capacitance in a 3.7V Li-ion system is ~6-7 uF. Pair with a smaller 0.1 uF X7R for high-frequency bypass.
Recomendado
Bluetooth/Wi-Fi Module Bulk Capacitance
The GRM155R61A106ME44D provides the bulk reservoir capacitance recommended on the VDD pins of BLE 5.x and Wi-Fi 6/6E module reference designs, where 10 uF in a 0402 case matches the most common reference-decoupling topology. Placed within 2 mm of each module VDD pin and paired with a 0.1 uF X7R for high-frequency decoupling, it suppresses the 200-400 mA peak currents during BLE TX bursts and Wi-Fi packet transmissions. The 10V rating provides comfortable headroom above the typical 3.3V or 3.6V module supply rails. The X5R dielectric is acceptable for module supply filtering where temperature range is consumer-grade (-20C to +70C); for industrial-grade modules, validate against the manufacturer's recommended capacitor list.
Recomendado
USB Type-C VBUS Smoothing
The GRM155R61A106ME44D is appropriate for VBUS bulk smoothing on USB Type-C connector implementations, where it absorbs voltage transients during cable attach/detach and during hot-plug events. Placed between the VBUS pin and ground near the Type-C receptacle, it limits inrush transients that could trigger downstream over-voltage protection circuits. The 10V rating comfortably exceeds the USB Type-C 5V/3A (15W) or 20V/5A (100W) PD profile voltages for low-power applications. The 0402 footprint fits within the tight pitch of USB Type-C connector land patterns. For USB-PD applications above 5V, verify the part's DC-bias derating curve and consider a higher-voltage-rated alternative such as a 16V or 25V X5R in the same 0402 case.
Recomendado
Consumer Audio Codec Power Decoupling
The GRM155R61A106ME44D serves as effective bulk decoupling on the DVDD and AVDD pins of consumer audio codecs (Bluetooth headphones, USB speakers, soundbars). Placed between the LDO output and codec supply pin, it filters switching noise from upstream converters and provides instantaneous charge for DAC clock-edge transients. The X5R dielectric's +/-15% capacitance variation across -55C to +85C is more than adequate for audio-band noise rejection (the codec PSRR handles frequencies above the MLCC's self-resonance). The 0402 footprint enables placement under QFN audio codecs with limited thermal pad area. For premium audio designs requiring lower ESR, consider pairing this bulk cap with a smaller X7R or C0G/NP0 part for HF decoupling.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para GRM155R61A106ME44D — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | GRM155R61A106ME11D | GRM155R61A106ME44J | GRM155R61E106ME13D | CL05A106MP5NUNC | C1005X5R1A106M050BC | CC0402MRX5R6BB106 |
|---|---|---|---|---|---|---|---|
| Package | 0402 (1005 metric) | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same | 0402 (1005 metric) - same |
| Brand | Murata Manufacturing | Murata Manufacturing (same brand) | Murata Manufacturing (same brand) | Murata Manufacturing (same brand) | Samsung Electro-Mechanics | TDK | Yageo |
| Capacitance | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF | 10 uF |
| Rated Voltage | 10 V | 10 V | 10 V | 25 V (higher headroom) | 10 V | 10 V | 10 V |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R | X5R |
| Capacitance Tolerance | +/-20% | +/-20% | +/-10% (tighter) | +/-20% | +/-20% | +/-20% | +/-20% |
| Operating Temperature | -55C to +85C | -55C to +85C | -55C to +85C | -55C to +85C | -55C to +85C | -55C to +85C | -55C to +85C |
Diferenciadores clave
- Highest-volume 10uF 0402 MLCC on the market with multi-source second sources (frente a GRM155R61A106ME11D)
- Tighter +/-10% tolerance option in same 0402 footprint (frente a GRM155R61A106ME44J)
- Higher 25V voltage option available in same Murata GRM family (frente a GRM155R61E106ME13D)
Notas de diseño
Estimated: X5R 0402 10uF capacitors exhibit 40-60% DC-bias capacitance derating at rated voltage. At 5V DC bias (typical 3.3V/5V rail application), effective capacitance of GRM155R61A106ME44D is approximately 4-6 uF rather than the nominal 10 uF. Engineers must consult the manufacturer datasheet's capacitance-vs-DC-bias curve for the specific lot and re-evaluate bulk-capacitance budgets. Mitigation: place multiple capacitors in parallel, or step up to a 0603-case part with less DC-bias loss.
Per IPC-7351 nominal land-pattern recommendations for the 0402 (1005 metric) case, use two solder pads each approximately 0.30 mm x 0.45 mm on a 0.50 mm pitch. Solder-pad plating should be ENIG or immersion tin for best solder joint reliability; OSP is acceptable for prototype builds. Avoid placing the 0402 capacitor under BGA packages with collapsed-ball pitches, as solder-joint inspection becomes difficult. Maintain at least 0.2 mm clearance from nearby traces to prevent solder bridging during reflow.
Place decoupling capacitors within 2 mm of the load IC's supply pin and use short, wide traces (>=0.2 mm width) to minimize parasitic inductance. For multi-rail ICs, place one 10 uF bulk cap (such as GRM155R61A106ME44D) per supply domain, paired with a 0.1 uF X7R high-frequency bypass cap placed within 1 mm of the pin. Use a ground via adjacent to the cap's ground pad to minimize ground-bounce. Avoid routing high-speed signal traces between the cap and the IC pin - this forces AC current through a longer loop and degrades high-frequency decoupling performance.
Información de cumplimiento
RoHS compliant per Murata product page (PIM search confirmed 2026-10-08). REACH compliance status inferred from Murata's published REACH statement (consult Murata directly for the latest SVHC disclosure). Not AEC-Q100 qualified - this is a commercial/consumer-grade part; AEC-Q200 equivalent exists in Murata's GRM series for automotive applications. Lead-free solder plating confirmed per RoHS compliance.
