CL05A226MQ5QUNC - 22µF 6.3V X5R MLCC 0402 | Samsung Electro-Mechanics
N.º de pieza: CL05A226MQ5QUNC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0.0252 | $0,03 |
| 10 | $0.023 | $0,23 |
| 100 | $0.018 | $1,80 |
| 500 | $0.0145 | $7,25 |
| 1.000 | $0.0115 | $11,50 |
| 5.000 | $0.0092 | $46,00 |
CL05A226MQ5QUNC Descripción general
An MLCC (multilayer ceramic capacitor) is a passive surface-mount component constructed by stacking alternating metal-electrode and ceramic-dielectric layers in a single monolithic body, then sintering and terminating the stack with nickel-barrier solder lands. The X5R dielectric is a Class-2 (mid-stability) formulation balancing volumetric efficiency against temperature and DC-bias performance; X5R sits in the ceramic capacitor family hierarchy MLCC > ceramic capacitor > capacitor > passive component, and is the standard choice for general-purpose decoupling, bulk bypass, and filtering in 5V-or-less rails.
Key features of the CL05A226MQ5QUNC include a 22 µF capacitance in the smallest common SMD case (0402), a ±20% capacitance tolerance, X5R temperature characteristic (EIA standard), nickel-barrier solder terminations with matte-tin plating for excellent solderability, and compliance with RoHS3. The terminations support reflow soldering up to 260 °C peak and the device is rated MSL 1 (unlimited floor life). According to the manufacturer datasheet, designers should evaluate capacitance behavior in the actual system because X5R capacitance varies with applied DC voltage (DC bias) and temperature.
Typical applications include bulk decoupling of low-voltage IC rails (PMIC, SoC core supplies), bypass on portable/wearable electronics, smoothing on audio codec supplies, and general-purpose filtering on 3.3V and 5V power domains. Designers using this part should derate for DC-bias losses (effective capacitance drops as DC voltage approaches rated voltage) and verify in-system ripple current. The Samsung CL series shares identical land patterns across the family, allowing flexibility to step down to 10 µF or up to 47 µF in the same 0402 footprint when the BOM or sourcing requires it.
Alternativas directas para CL05A226MQ5QUNC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
CL05A226MP5QUNC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CL05A226MQ5NUNC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CL05A226KQ5QUNC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
GRM155R60J226ME44D
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
C1005X5R0J226M050BC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CC0402MRX5R5B226
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
CL05A226MQ5QUNC Valores máximos y características eléctricas
| Capacitance | 22 µF |
| Capacitance Tolerance | ±20% |
| Rated Voltage | 6.3 V |
| Dielectric (Temperature Characteristic) | X5R (EIA) |
| Encapsulado / Carcasa | 0402 (1005 metric) |
| Package Dimensions | 1.0 mm × 0.5 mm |
| Tipo de montaje | Surface Mount (SMD/SMT) |
| Rango de temperatura de funcionamiento | -55 °C to +85 °C |
| Termination Style | Nickel barrier with matte-tin plating |
| Nivel MSL | MSL 1 (Unlimited floor life) |
| Capacitor Class | Class 2 MLCC (mid-stability) |
| Estado RoHS | RoHS3 Compliant |
| REACH Status | REACH Unaffected |
| Reflow Soldering Peak | 260 °C peak (compatible) |
| Application Category | General Purpose / Consumer |
| Manufacturer Series | Samsung CL series MLCC |
Guía de configuración de pines de CL05A226MQ5QUNC 1.0 mm × 0.5 mm
Configuración de pines para CL05A226MQ5QUNC (encapsulado 1.0 mm × 0.5 mm). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para CL05A226MQ5QUNC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
CL05A226MQ5QUNC es adecuado para 6 aplicacións: Smartphone SoC Power Decoupling, Wearable Device Battery Rail Filtering, Audio Codec Power Supply Bypass, IoT Sensor Module Power Conditioning, PMIC Output Bulk Capacitor, USB Type-C VBUS Local Decoupling.
Smartphone SoC Power Decoupling
The CL05A226MQ5QUNC is well suited as a bulk decoupling capacitor on smartphone SoC power rails operating at 3.3V to 5V. With 22 µF nominal capacitance in the ultra-compact 0402 case, it provides a local reservoir of charge adjacent to the SoC power pins, suppressing instantaneous voltage droops when core logic blocks switch. The X5R dielectric maintains ±15% capacitance variation from -55 °C to +85 °C, which covers typical handset thermal environments. Place one CL05A226MQ5QUNC per SoC supply domain plus smaller 100 nF MLCCs in parallel for high-frequency decoupling; the X5R part will handle bulk transients while the smaller caps handle >10 MHz switching noise.
Recomendado
Wearable Device Battery Rail Filtering
Battery-powered wearables such as fitness bands and smartwatches benefit from the CL05A226MQ5QUNC's 0402 footprint that fits within space-constrained PCBs while delivering 22 µF of bulk capacitance. The 6.3V rated voltage comfortably derates for 3.7V Li-ion battery rails, and the X5R temperature characteristic ensures stable performance against body-worn thermal swings. Place this MLCC at the output of LDO regulators that supply low-power MCUs, BLE radios, and sensor hubs. Its sub-10 mΩ ESR at audio frequencies reduces output ripple to negligible levels, keeping noise-sensitive analog front-ends clean.
Recomendado
Audio Codec Power Supply Bypass
Audio codecs and DACs require clean, low-ripple supply rails to preserve signal-to-noise ratio and avoid audible artifacts. The CL05A226MQ5QUNC serves as a bulk bypass capacitor on 3.3V AVDD or 5V DVDD rails feeding audio CODECs, where its X5R dielectric provides low ESR (<10 mΩ at 1 kHz to 100 kHz) and high capacitance density. Combined with smaller 100 nF and 1 nF MLCCs in parallel, it suppresses both low-frequency supply ripple and high-frequency switching noise. Designers should account for DC-bias loss: at 3.3V applied, the effective capacitance may be 30-50% lower than the 22 µF nominal, so two parallel parts may be needed for critical audio rails.
Recomendado
IoT Sensor Module Power Conditioning
IoT sensor modules integrating MEMS accelerometers, gyroscopes, or environmental sensors require clean, stable supply rails for accurate readings. The CL05A226MQ5QUNC provides 22 µF of bulk capacitance in a 0402 footprint, ideal for sensor module PCBs where every square millimeter matters. At 6.3V rated and operating at typical 1.8V to 3.3V sensor supply levels, the part has substantial voltage derating margin, extending long-term reliability. Combined with a 100 nF decoupling cap, it suppresses ripple from upstream DC-DC converters and minimizes cross-talk between adjacent sensor channels on shared power domains.
Recomendado
PMIC Output Bulk Capacitor
Power management ICs (PMICs) that supply multiple low-voltage rails to a host SoC benefit from local bulk capacitance at each output. The CL05A226MQ5QUNC is well matched as a 22 µF / 6.3V X5R bulk capacitor at PMIC outputs of 1.0V to 5V. The 0402 footprint lets engineers place the cap directly at the PMIC output pin, minimizing parasitic inductance. Designers should pair it with a smaller 1 µF or 100 nF MLCC for high-frequency decoupling; the CL05A226MQ5QUNC handles bulk load transients while the smaller cap suppresses switching ripple from the PMIC's internal FETs.
Recomendado
USB Type-C VBUS Local Decoupling
USB Type-C ports deliver 5V VBUS to connected devices, and the CL05A226MQ5QUNC is a compact bulk-decoupling option on the VBUS rail downstream of the source-side protection FET. At 6.3V rated voltage, it has appropriate derating margin above 5V nominal. Its 22 µF capacitance in 0402 footprint handles inrush during USB Type-C attach/detach events, providing local charge to downstream loads and reducing voltage droop. Place it close to the CC controller or VBUS switch output, and pair with an ESD protection diode for a complete USB Type-C front-end.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para CL05A226MQ5QUNC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | CL05A226MP5QUNC | CL05A226MQ5NUNC | GRM155R60J226ME44D | C1005X5R0J226M050BC | CC0402MRX5R5B226 |
|---|---|---|---|---|---|---|
| Brand | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Samsung Electro-Mechanics | Murata Manufacturing | TDK | YAGEO |
| Package | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) | 0402 (1005 metric) |
| Capacitance | 22 µF | 22 µF | 22 µF | 22 µF | 22 µF | 22 µF |
| Rated Voltage | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V | 6.3 V |
| Capacitance Tolerance | ±20% | ±20% | ±20% | ±20% | ±20% | ±20% |
| Dielectric | X5R | X5R | X5R | X5R | X5R | X5R |
| Operating Temperature | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C | -55 °C to +85 °C |
| RoHS Compliance | RoHS3 Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
Diferenciadores clave
- Industry-standard 22µF 6.3V X5R 0402 with multi-source second-source ecosystem (frente a GRM155R60J226ME44D (Murata))
- RoHS3 and REACH unaffected for global market compliance (frente a C1005X5R0J226M050BC (TDK))
- MSL 1 unlimited floor-life simplifies handling (frente a CC0402MRX5R5B226 (YAGEO))
Notas de diseño
The CL05A226MQ5QUNC is a 0402 (1005 metric) MLCC requiring a land pattern of approximately 0.5 mm × (0.5 to 0.6 mm) per pad with a 0.4 mm solder-gap. Use NSMD (non-solder mask defined) pads for better solder-joint reliability on small ceramic components. Place the cap as close as physically possible to the IC power pin it decouples - trace length above 1 mm adds parasitic inductance that defeats the purpose of a bulk decoupling cap. For multi-layer boards, place at least one via-in-pad or two adjacent vias to the inner ground/power plane to minimize loop inductance.
X5R MLCCs exhibit significant DC-bias capacitance loss. The CL05A226MQ5QUNC at 22 µF nominal may drop to roughly 30-50% of that value (7-11 µF effective) when 5V DC is applied. Designers must verify in-system capacitance with the actual rail voltage, not the open-circuit nominal. Always check the manufacturer's DC-bias curve for the specific part family before committing to a single part for a tight-ripple design. For 3.3V rails or below, DC-bias loss is much smaller and the part delivers close to its rated capacitance.
MLCCs are sensitive to mechanical flex because the ceramic dielectric cracks under board strain. The CL05A226MQ5QUNC 0402 body has no flex mitigation beyond the standard PCB design rules. Place the part away from high-strain areas such as board edges, screw mounting points, and connector keep-out zones. Do not place large ceramic-only MLCCs directly under a BGA package that experiences CTE mismatch with the PCB during thermal cycling - the resulting shear stress can crack the MLCC. Distribute multiple smaller caps rather than relying on one large one when board flex is a concern.
Información de cumplimiento
RoHS3 Compliant and REACH Unaffected per manufacturer product page (PartGenie aggregation of Samsung Electro-Mechanics data). AEC-Q100 is not applicable - this is a passive component, not an active semiconductor. Halogen-free status and conflict-minerals compliance not stated in the verified data; set to 'unknown' rather than guess.
