IIS3DWBTR - Ultra-Wide Bandwidth 3-Axis Digital Vibration Sensor | STMicroelectronics
N.º de pieza: IIS3DWBTR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.75 | $117,50 |
| 100 | $10.5 | $1.050,00 |
| 500 | $9.25 | $4.625,00 |
| 1.000 | $8.4 | $8.400,00 |
IIS3DWBTR Descripción general
Key specifications include selectable full-scale acceleration ranges of +/-2 g, +/-4 g, +/-8 g, and +/-16 g, along with ultra-low noise density of 75 ug/giB (in the high-performance mode). The on-chip ADC samples at up to 26.7 kHz with a 16-bit resolution, and the FIFO buffer holds up to 3 kB of programmable watermark data. The sensor operates from a 1.71 V to 3.6 V supply and includes a temperature sensor for thermal compensation.
The IIS3DWBTR is a system-in-package (SiP) that combines the MEMS element and the ASIC in a single reflow-solderable land-grid-array module. The wide bandwidth, low noise, stable sensitivity, and the ability to operate over an extended temperature range make it particularly suitable for vibration monitoring of motors, pumps, fans, bearings, and structural components in Industry 4.0 deployments.
Typical applications include condition monitoring and predictive maintenance in rotating machinery, vibration analysis in HVAC and building automation, motor control feedback loops, structural health monitoring of bridges and towers, and industrial IoT sensor nodes. The wide bandwidth also supports shock detection and seismic instrumentation.
When designing with the IIS3DWBTR, place 100 nF decoupling capacitors as close as possible to the supply pins and follow the PCB layout guidelines in the manufacturer datasheet to minimize mechanical stress coupling and ensure accurate high-frequency vibration measurements. The 1.71 V minimum supply makes it directly usable with 1.8 V MCUs and Bluetooth Low Energy SoCs without level shifters.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers shorten selection cycles for vibration-sensing projects.
Alternativas directas para IIS3DWBTR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
IIS3DWB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
IIS2DWQ
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
IIS3DWBTR Valores máximos y características eléctricas
| Tipo de sensor | 3-Axis Digital Vibration Sensor (MEMS Accelerometer, SiP) |
| Number of Axes | 3 (X, Y, Z) |
| Full-Scale Range | +/-2 g, +/-4 g, +/-8 g, +/-16 g (selectable) |
| Output Interface | I2C / SPI (digital) |
| Bandwidth | DC to 6 kHz (flat, all axes) |
| Densidad de ruido | 75 ug/giB (high-performance mode) |
| Output Data Rate | Up to 26.7 kHz |
| ADC Resolution | 16-bit |
| Tensión de alimentación | 1.71 V to 3.6 V |
| Temperatura de funcionamiento | -40 C to +105 C |
| FIFO Buffer | 3 kB (programmable watermark) |
| On-chip Features | Temperature sensor, self-test, embedded interrupt logic |
| Encapsulado | LGA-14 (solder pads, surface mount) |
| Tipo de montaje | Surface Mount |
| Sensitivity Stability | High stability and repeatability over temperature |
| Estado RoHS | Compliant |
Configuración de pines de IIS3DWBTR
| Pin 1 | VDD — Power supply (1.71 V to 3.6 V) |
| Pin 2 | VDDIO — I/O supply voltage |
| Pin 3 | GND — Ground |
| Pin 4 | RES — Reserved (connect per datasheet) |
| Pin 5 | CS — SPI chip select (active low) |
| Pin 6 | SCL/SPC — I2C clock / SPI serial clock |
| Pin 7 | SDA/SDI/SDO — I2C data / SPI data (3-wire shared) |
| Pin 8 | SDO/SA0 — SPI SDO / I2C slave address LSB |
| Pin 9 | INT1 — Interrupt 1 (programmable) |
| Pin 10 | INT2 — Interrupt 2 (programmable) |
| Pin 11 | DRDY — Data-ready output |
| Pin 12 | RES — Reserved (connect per datasheet) |
| Pin 13 | RES — Reserved (connect per datasheet) |
| Pin 14 | GND — Ground / thermal pad |
Aplicaciones típicas
IIS3DWBTR es adecuado para 6 aplicacións: Industrial Condition Monitoring and Predictive Maintenance, Vibration Analysis in HVAC and Building Automation, Structural Health Monitoring of Bridges and Towers, Motor Control and Drive Feedback Loops, Industrial IoT Wireless Vibration Sensor Nodes, Seismic and Shock Detection Instrumentation.
Industrial Condition Monitoring and Predictive Maintenance
The IIS3DWBTR fits industrial condition-monitoring deployments because its flat DC to 6 kHz bandwidth on all three axes captures the bearing-fault, gear-mesh, and imbalance spectral signatures used in predictive-maintenance algorithms. With 75 ug/giB noise density and a selectable up to +/-16 g range, the sensor resolves both early-stage micro-vibration and high-energy impacts on motors, pumps, fans, and gearboxes in plants operating up to +105 C. The 3 kB FIFO allows burst-mode capture at 26.7 kHz ODR without host-MCU saturation, while the SPI interface streams raw data directly to an STM32WB-class SoC for FFT computation and anomaly detection.
Recomendado
Vibration Analysis in HVAC and Building Automation
In HVAC and building-automation deployments, the IIS3DWBTR detects chiller-compressor vibration, fan imbalance, and structural resonance that drive energy waste and noise complaints. The 1.71-3.6 V supply matches 3.3 V building-controller rails directly, and the digital I2C/SPI output eliminates analog noise pickup across long cable runs typical in rooftop unit installations. The -40 to +105 C operating range covers unconditioned mechanical rooms and rooftop enclosures without additional thermal protection, and the 3 kB FIFO smooths event-driven wake cycles on battery-powered wireless vibration nodes.
Recomendado
Structural Health Monitoring of Bridges and Towers
The IIS3DWBTR enables structural-health monitoring of bridges, towers, and large civil-infrastructure assets by capturing low-amplitude ambient and traffic-induced vibrations with 75 ug/giB noise density across all three axes. Its flat DC to 6 kHz bandwidth covers the natural-mode frequencies of most civil structures (typically 0.1 Hz to 100 Hz) as well as higher-mode resonances that reveal progressive damage. The 16-bit ADC at up to 26.7 kHz ODR gives spectral headroom for FFT modal analysis, and the small 2.5 mm x 3.0 mm LGA footprint fits inside compact wireless sensor nodes deployed in hard-to-reach locations.
Recomendado
Motor Control and Drive Feedback Loops
The IIS3DWBTR closes the feedback loop in advanced motor-control drives by reporting mechanical vibration on the motor housing, which the controller uses to detect rotor imbalance, bearing wear, and coupling misalignment in real time. The selectable +/-2 g to +/-16 g range covers both precision servo drives (low amplitude) and heavy industrial drives (high amplitude). With SPI running at 10 MHz and a 26.7 kHz maximum ODR, the sensor keeps pace with field-oriented-control loops on STM32 motor-control kits without adding latency to the torque-control cycle.
Recomendado
Industrial IoT Wireless Vibration Sensor Nodes
The IIS3DWBTR is ideal for battery-powered IIoT vibration sensor nodes because its 1.71-3.6 V supply matches the output of coin-cell or Li-Po boosters, and its embedded FIFO plus watermark interrupt lets an STM32WB-class SoC sleep while vibration events accumulate. The 3-axis flat 6 kHz response supports FFT-based anomaly detection on-node, and the 75 ug/giB noise floor preserves the dynamic range needed to detect sub-mg precursor faults. Operating up to +105 C, the sensor mounts directly on motor housings, pumps, and gearboxes in unconditioned industrial environments.
Recomendado
Seismic and Shock Detection Instrumentation
The IIS3DWBTR serves seismic and shock-detection instrumentation thanks to its +/-16 g full-scale range, 6 kHz flat bandwidth, and 75 ug/giB noise density, which together preserve the spectral content of low-amplitude ground motion and high-energy impacts in laboratory and field experiments. The on-chip temperature sensor enables real-time thermal compensation of sensitivity drift, and the FIFO allows continuous background recording with post-trigger event capture. The compact LGA package fits into handheld data loggers, geophone augmentation units, and laboratory shock-table instrumentation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para IIS3DWBTR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | IIS3DWB | IIS2DWQ |
|---|---|---|---|
| Package | LGA-14 (2.5 x 3.0 mm) | LGA-14 (same SiP) | LGA-14 (similar footprint - verify against datasheet) |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Sensor Type | 3-axis digital vibration sensor | 3-axis digital vibration sensor | 3-axis digital accelerometer |
| Bandwidth | DC to 6 kHz (flat) | DC to 6 kHz (flat) | Up to approx 200 Hz |
| Full-Scale Range | +/-2 g, +/-4 g, +/-8 g, +/-16 g | +/-2 g, +/-4 g, +/-8 g, +/-16 g | +/-2 g, +/-4 g |
| Noise Density | 75 ug/giB | 75 ug/giB | Approximately 110 ug/giB |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Interface | I2C / SPI | I2C / SPI | I2C / SPI |
Diferenciadores clave
- Flat 6 kHz bandwidth on all three axes (frente a IIS2DWQ)
- Ultra-low 75 ug/giB noise density (frente a IIS2DWQ)
- Up to +/-16 g full-scale range selection (frente a IIS2DWQ)
Notas de diseño
Place 100 nF decoupling capacitors as close as possible to the VDD and VDDIO pins, and route a clean ground plane directly under the IIS3DWBTR LGA package to minimize noise coupling on the analog supply. The exposed thermal pad on the underside of the LGA package must be soldered to the PCB ground plane to provide mechanical rigidity and a thermal path; do not leave it floating. Following the manufacturer PCB layout guideline is critical because the sensor's 6 kHz bandwidth makes it sensitive to supply ripple and mechanical stress on the package.
For SPI operation up to 10 MHz, keep the SCL/SPC, SDA/SDI/SDO, and CS traces short and length-matched. Place a 10-100 ohm series resistor near the source to dampen reflections on the SPI bus if the MCU is more than 50 mm away. For I2C, use 4.7 kohm pull-ups to VDDIO and verify rise-time with an oscilloscope - long I2C buses can degrade the data-ready signal integrity above 400 kHz.
Do not confuse the IIS3DWBTR with consumer IMUs like LSM6DSO - the IIS3DWBTR is a vibration sensor with flat 6 kHz bandwidth, not a motion-tracking IMU with gyroscope. Do not apply mechanical stress to the LGA package during board assembly, because stress-induced package deformation can shift the DC zero-g offset. Always perform a board-level zero-g calibration after final soldering and let the part thermally stabilize before capturing reference data.
Use the IIS3DWBTR's low-power and power-down modes aggressively for battery-powered IIoT deployments. The 3 kB FIFO plus watermark interrupt allows the host MCU to sleep while the sensor accumulates vibration samples, waking only when the FIFO threshold is exceeded or a programmed event is detected. This duty-cycled approach can reduce system average current consumption by an order of magnitude versus continuous high-ODR streaming.
Información de cumplimiento
RoHS and REACH compliant per STMicroelectronics product page. Operating temperature range of -40 C to +105 C supports industrial but not automotive AEC-Q100 qualification. Halogen-free status not explicitly stated in the verified data.
