IW611UK-A1IZ - Wi-Fi 6 + BT 5.4 RF Transceiver | NXP
N.º de pieza: IW611UK-A1IZ ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.79 | $6,79 |
| 10 | $6.32 | $63,20 |
| 100 | $5.61 | $561,00 |
| 500 | $5.12 | $2.560,00 |
| 1.000 | $4.75 | $4.750,00 |
IW611UK-A1IZ Descripción general
A Wi-Fi/Bluetooth combo transceiver is a type of RF IC that integrates a radio modem, baseband, and MAC functions for multiple wireless protocols in one die. It sits at the connectivity layer of the system hierarchy: RF transceiver -> wireless connectivity IC -> RF and wireless semiconductor -> semiconductor device. Combo ICs reduce bill-of-materials, board area, and RF coexistence complexity compared with two separate radios.
Key features include dual-band 1x1 Wi-Fi 6 support for OFDMA and uplink/downlink MU-MIMO basics of the 802.11ax standard, Bluetooth 5.4 with Bluetooth Low Energy for LE Audio-ready designs, and a high degree of single-chip integration that NXP states contributes to very low system cost. The WLCSP ball grid array keeps the footprint compact for space-limited smart devices.
Technically, the IW611 integrates the full RF front-end path for both 2.4 GHz and 5 GHz bands, sharing an antenna-facing front end with an internal coexistence scheme between Wi-Fi and Bluetooth air interfaces. The 5 GHz receiver covers 5.17 GHz to 5.895 GHz, spanning the UNII-1 through UNII-3 bands used in most regulatory domains.
Typical applications include smart home devices and accessories, smart appliances, smart energy infrastructure, industrial automation nodes, and embedded gateways, where one chip provides both high-throughput Wi-Fi 6 connectivity and BLE for commissioning, beacons, and sensor links.
Design consideration: because this is a bare WLCSP RF device, PCB stack-up, antenna matching, and power-supply filtering must follow the NXP reference design closely; layout errors directly degrade sensitivity and EMI compliance.
This page synthesizes distributor pricing, verified drop-in family alternatives, datasheet sourcing, and practical design guidance not consolidated in the manufacturer datasheet alone.
Alternativas directas para IW611UK-A1IZ — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con IW611UK-A1IZ (mismo factor de forma y huella) — difiere en Bluetooth Version, Frequency Bands, Integration Level.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
IW611UK-A1ITZ
✅ Sustitución directa✓ En stock
$6.79 / unidad
Ver hoja de datos →IW611UK-A1IAZ
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
IW611UK-A1IZ Especificaciones
| RF Protocol | Wi-Fi 6 (802.11ax) + Bluetooth 5.4 / BLE |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| 5 GHz Receive Range | 5.17 GHz to 5.895 GHz |
| Wi-Fi Configuration | 1x1 (single spatial stream) |
| Bluetooth Version | Bluetooth v5.4 including Bluetooth Low Energy |
| Tensión de alimentación | 1.8 V to 3.3 V |
| Encapsulado | 140-XFBGA, WLCSP |
| Tipo de montaje | Surface Mount |
| Integration Level | Single-chip Wi-Fi + Bluetooth combo |
| Target Applications | IoT, smart home, smart appliances, smart energy, industrial automation, gateways |
Guía de configuración de pines de IW611UK-A1IZ 140-xfbga, wlcsp
Configuración de pines para IW611UK-A1IZ (encapsulado 140-xfbga, wlcsp). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para IW611UK-A1IZ.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
IW611UK-A1IZ es adecuado para 6 aplicacións: Smart Home Devices and Accessories, Smart Appliances, Smart Energy Infrastructure, Industrial Automation Nodes, Embedded Gateways, Smart Devices and Wearable Accessories.
Smart Home Devices and Accessories
The IW611UK-A1IZ fits smart home products because it merges dual-band 1x1 Wi-Fi 6 (802.11ax) with Bluetooth 5.4/BLE on one die, cutting BOM count and board area in exactly the way NXP designed it for. BLE handles commissioning, proximity, and sensor links, while Wi-Fi 6 provides cloud connectivity with OFDMA and TWT for lower idle power in always-on accessories. Integrated on a 140-XFBGA WLCSP footprint from a 1.8V to 3.3V supply, it slots into compact product enclosures; the trade-off is stricter RF layout discipline than a module-based design.
Recomendado
Smart Appliances
For connected washing machines, refrigerators, and ovens, the IW611UK-A1IZ provides the single-chip 2.4/5 GHz Wi-Fi 6 plus Bluetooth 5.4 connectivity NXP targets explicitly for smart appliances. Dual-band operation lets the appliance avoid congested 2.4 GHz networks by using the 5.17 to 5.895 GHz band, improving throughput for status streaming and OTA firmware updates. BLE 5.4 enables local setup from a phone without provisioning a temporary hotspot. Operating from 1.8V to 3.3V matches appliance controller rails, and the high integration level NXP cites lowers total system cost across volume production.
Recomendado
Smart Energy Infrastructure
NXP positions the IW611 directly for smart energy applications such as meters, gateways, and energy-management endpoints. The IW611UK-A1IZ's dual-band 1x1 Wi-Fi 6 radio delivers the reliable backhaul these endpoints need while OFDMA improves behavior when thousands of meters share spectrum, and Bluetooth Low Energy supports local field-service configuration via a phone or tablet. The 140-XFBGA WLCSP package and 1.8V to 3.3V supply fit compact, cost-sensitive meter electronics. Designers should budget for robust isolation and surge protection around the RF path, since meter environments are electrically harsh compared with consumer products.
Recomendado
Industrial Automation Nodes
In factory automation, the IW611UK-A1IZ serves wireless sensor nodes, HMI accessories, and machine-monitoring endpoints where NXP explicitly targets industrial automation. Wi-Fi 6's TWT mechanism reduces node power draw between transmissions, and dual-band capability lets integrators place control traffic on the cleaner 5 GHz band (5.17 to 5.895 GHz RX coverage) away from noisy 2.4 GHz shop-floor spectrum. Bluetooth 5.4 gives maintenance staff a local BLE diagnostic channel. The WLCSP package demands careful conformal coating and layout in industrial environments, but yields a compact, integrated connectivity subsystem at low system cost.
Recomendado
Embedded Gateways
For compact IoT gateways, the IW611UK-A1IZ provides the WAN-side Wi-Fi 6 client or AP capability plus BLE commissioning in a single 2.4/5 GHz chip, exactly the gateway use case NXP cites for the IW611 family. A 1x1 antenna configuration keeps RF front-end cost minimal while 802.11ax OFDMA sustains aggregate traffic from many downstream nodes. The 140-XFBGA WLCSP footprint minimizes gateway PCB area, and the 1.8V to 3.3V input range simplifies integration with gateway power supplies. For throughput-heavy gateways, pair it with a host processor exposing sufficient SDIO/USB bandwidth per the datasheet host-interface specification.
Recomendado
Smart Devices and Wearable Accessories
Smart devices and their accessories benefit from the IW611UK-A1IZ's high integration: one chip replaces separate Wi-Fi and Bluetooth radios, shrinking the PCB of space-constrained products. NXP lists smart devices and accessories as a primary IW611 market. BLE 5.4 supports LE Audio-ready links and beaconing for phone accessories, while Wi-Fi 6 handles high-rate tasks like media sync and firmware updates over both 2.4 GHz and 5 GHz bands. Designers should place the WLCSP die close to the antenna with controlled-impedance matching, since every millimeter of mismatched trace erodes the link budget of a 1x1 radio.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para IW611UK-A1IZ — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | IW611UK-A1ITZ | IW611UK-A1IAZ |
|---|---|---|---|
| Package | 140-XFBGA, WLCSP | 140-XFBGA, WLCSP - same | 140-XFBGA, WLCSP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 |
| Bluetooth Version | Bluetooth 5.4 / BLE | Bluetooth 5.4 / BLE | Bluetooth 5.4 / BLE |
| Frequency Bands | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz |
| Supply Voltage | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V |
| Lifecycle Status | Active | Active | Active |
Diferenciadores clave
- Wi-Fi 6 (802.11ax) with OFDMA and TWT in a single chip (frente a IW611UK-A1ITZ)
- Bluetooth 5.4 / BLE support (frente a IW611UK-A1IAZ)
- Very low system cost through high integration (frente a Two-chip Wi-Fi + BLE discrete solutions)
Notas de diseño
The IW611UK-A1IZ uses a 140-ball WLCSP (XFBGA) with fine ball pitch. Follow the NXP IW611 datasheet land-pattern and stack-up recommendations exactly: use a controlled-impedance 50-ohm feed from the RF pin to the antenna with a pi-network for matching, keep the matching network within 2-3 mm of the ball, and provide solid, uninterrupted ground planes on the layer directly beneath the die. Via-stitch the ground pour around the RF section to suppress cavity resonances that would degrade 5 GHz sensitivity.
Supply the IW611 within its 1.8V to 3.3V range, but note the chip internally derives multiple rails; per the NXP datasheet power section, provide per-rail decoupling with a bulk 10 uF plus 0.1 uF and 1 nF ceramic组合 per pin group as specified in the reference design. Because the RF PA draws burst currents during TX, place the bulk capacitor close to the supply balls and use a regulator with good load transient response; otherwise TX burst noise can couple into shared analog rails.
Do not treat the A1IZ/A1ITZ/A1IAZ suffixes as interchangeable without checking the NXP ordering table; although silicon is identical, qualification and packing variants can differ. Also, WLCSP parts are moisture-sensitive - follow the MSL floor-life rules and bake if exposure limits are exceeded before reflow, or popcorn cracking of the package can occur during soldering.
Información de cumplimiento
Compliance status not explicitly stated in retrieved web data; confirm on the NXP IW611UK product page or distributor compliance certificates. As an active consumer/IoT NXP part it is typically RoHS-compliant, but XAIPART does not assume compliance without source data.
