IW611UK-A1IZ - Wi-Fi 6 + BT 5.4 RF Transceiver | NXP
부품 번호: IW611UK-A1IZ ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.79 | $6.79 |
| 10 | $6.32 | $63.20 |
| 100 | $5.61 | $561.00 |
| 500 | $5.12 | $2,560.00 |
| 1,000 | $4.75 | $4,750.00 |
IW611UK-A1IZ 개요
A Wi-Fi/Bluetooth combo transceiver is a type of RF IC that integrates a radio modem, baseband, and MAC functions for multiple wireless protocols in one die. It sits at the connectivity layer of the system hierarchy: RF transceiver -> wireless connectivity IC -> RF and wireless semiconductor -> semiconductor device. Combo ICs reduce bill-of-materials, board area, and RF coexistence complexity compared with two separate radios.
Key features include dual-band 1x1 Wi-Fi 6 support for OFDMA and uplink/downlink MU-MIMO basics of the 802.11ax standard, Bluetooth 5.4 with Bluetooth Low Energy for LE Audio-ready designs, and a high degree of single-chip integration that NXP states contributes to very low system cost. The WLCSP ball grid array keeps the footprint compact for space-limited smart devices.
Technically, the IW611 integrates the full RF front-end path for both 2.4 GHz and 5 GHz bands, sharing an antenna-facing front end with an internal coexistence scheme between Wi-Fi and Bluetooth air interfaces. The 5 GHz receiver covers 5.17 GHz to 5.895 GHz, spanning the UNII-1 through UNII-3 bands used in most regulatory domains.
Typical applications include smart home devices and accessories, smart appliances, smart energy infrastructure, industrial automation nodes, and embedded gateways, where one chip provides both high-throughput Wi-Fi 6 connectivity and BLE for commissioning, beacons, and sensor links.
Design consideration: because this is a bare WLCSP RF device, PCB stack-up, antenna matching, and power-supply filtering must follow the NXP reference design closely; layout errors directly degrade sensitivity and EMI compliance.
This page synthesizes distributor pricing, verified drop-in family alternatives, datasheet sourcing, and practical design guidance not consolidated in the manufacturer datasheet alone.
드롭인 대체품: IW611UK-A1IZ — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: IW611UK-A1IZ (동일 폼 팩터 및 풋프린트) — 차이점: Bluetooth Version, Frequency Bands, Integration Level.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
IW611UK-A1ITZ
✅ 드롭인✓ 재고 있음
$6.79 / 개
데이터시트 보기 →IW611UK-A1IAZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
IW611UK-A1IZ 사양
| RF Protocol | Wi-Fi 6 (802.11ax) + Bluetooth 5.4 / BLE |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| 5 GHz Receive Range | 5.17 GHz to 5.895 GHz |
| Wi-Fi Configuration | 1x1 (single spatial stream) |
| Bluetooth Version | Bluetooth v5.4 including Bluetooth Low Energy |
| 공급 전압 | 1.8 V to 3.3 V |
| 패키지 | 140-XFBGA, WLCSP |
| 실장 유형 | Surface Mount |
| Integration Level | Single-chip Wi-Fi + Bluetooth combo |
| Target Applications | IoT, smart home, smart appliances, smart energy, industrial automation, gateways |
IW611UK-A1IZ 140-xfbga, wlcsp 핀 구성 가이드
IW611UK-A1IZ(140-xfbga, wlcsp 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: IW611UK-A1IZ.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
IW611UK-A1IZ 적합 용도: 6 애플리케이션s: Smart Home Devices and Accessories, Smart Appliances, Smart Energy Infrastructure, Industrial Automation Nodes, Embedded Gateways, Smart Devices and Wearable Accessories.
Smart Home Devices and Accessories
The IW611UK-A1IZ fits smart home products because it merges dual-band 1x1 Wi-Fi 6 (802.11ax) with Bluetooth 5.4/BLE on one die, cutting BOM count and board area in exactly the way NXP designed it for. BLE handles commissioning, proximity, and sensor links, while Wi-Fi 6 provides cloud connectivity with OFDMA and TWT for lower idle power in always-on accessories. Integrated on a 140-XFBGA WLCSP footprint from a 1.8V to 3.3V supply, it slots into compact product enclosures; the trade-off is stricter RF layout discipline than a module-based design.
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Smart Appliances
For connected washing machines, refrigerators, and ovens, the IW611UK-A1IZ provides the single-chip 2.4/5 GHz Wi-Fi 6 plus Bluetooth 5.4 connectivity NXP targets explicitly for smart appliances. Dual-band operation lets the appliance avoid congested 2.4 GHz networks by using the 5.17 to 5.895 GHz band, improving throughput for status streaming and OTA firmware updates. BLE 5.4 enables local setup from a phone without provisioning a temporary hotspot. Operating from 1.8V to 3.3V matches appliance controller rails, and the high integration level NXP cites lowers total system cost across volume production.
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Smart Energy Infrastructure
NXP positions the IW611 directly for smart energy applications such as meters, gateways, and energy-management endpoints. The IW611UK-A1IZ's dual-band 1x1 Wi-Fi 6 radio delivers the reliable backhaul these endpoints need while OFDMA improves behavior when thousands of meters share spectrum, and Bluetooth Low Energy supports local field-service configuration via a phone or tablet. The 140-XFBGA WLCSP package and 1.8V to 3.3V supply fit compact, cost-sensitive meter electronics. Designers should budget for robust isolation and surge protection around the RF path, since meter environments are electrically harsh compared with consumer products.
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Industrial Automation Nodes
In factory automation, the IW611UK-A1IZ serves wireless sensor nodes, HMI accessories, and machine-monitoring endpoints where NXP explicitly targets industrial automation. Wi-Fi 6's TWT mechanism reduces node power draw between transmissions, and dual-band capability lets integrators place control traffic on the cleaner 5 GHz band (5.17 to 5.895 GHz RX coverage) away from noisy 2.4 GHz shop-floor spectrum. Bluetooth 5.4 gives maintenance staff a local BLE diagnostic channel. The WLCSP package demands careful conformal coating and layout in industrial environments, but yields a compact, integrated connectivity subsystem at low system cost.
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Embedded Gateways
For compact IoT gateways, the IW611UK-A1IZ provides the WAN-side Wi-Fi 6 client or AP capability plus BLE commissioning in a single 2.4/5 GHz chip, exactly the gateway use case NXP cites for the IW611 family. A 1x1 antenna configuration keeps RF front-end cost minimal while 802.11ax OFDMA sustains aggregate traffic from many downstream nodes. The 140-XFBGA WLCSP footprint minimizes gateway PCB area, and the 1.8V to 3.3V input range simplifies integration with gateway power supplies. For throughput-heavy gateways, pair it with a host processor exposing sufficient SDIO/USB bandwidth per the datasheet host-interface specification.
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Smart Devices and Wearable Accessories
Smart devices and their accessories benefit from the IW611UK-A1IZ's high integration: one chip replaces separate Wi-Fi and Bluetooth radios, shrinking the PCB of space-constrained products. NXP lists smart devices and accessories as a primary IW611 market. BLE 5.4 supports LE Audio-ready links and beaconing for phone accessories, while Wi-Fi 6 handles high-rate tasks like media sync and firmware updates over both 2.4 GHz and 5 GHz bands. Designers should place the WLCSP die close to the antenna with controlled-impedance matching, since every millimeter of mismatched trace erodes the link budget of a 1x1 radio.
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추천 제품 요약
엔지니어링 참조 데이터: IW611UK-A1IZ — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | IW611UK-A1ITZ | IW611UK-A1IAZ |
|---|---|---|---|
| Package | 140-XFBGA, WLCSP | 140-XFBGA, WLCSP - same | 140-XFBGA, WLCSP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Wi-Fi Standard | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 | Wi-Fi 6 (802.11ax), 1x1 |
| Bluetooth Version | Bluetooth 5.4 / BLE | Bluetooth 5.4 / BLE | Bluetooth 5.4 / BLE |
| Frequency Bands | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz |
| Supply Voltage | 1.8 V to 3.3 V | 1.8 V to 3.3 V | 1.8 V to 3.3 V |
| Lifecycle Status | Active | Active | Active |
주요 차별점
- Wi-Fi 6 (802.11ax) with OFDMA and TWT in a single chip (vs IW611UK-A1ITZ)
- Bluetooth 5.4 / BLE support (vs IW611UK-A1IAZ)
- Very low system cost through high integration (vs Two-chip Wi-Fi + BLE discrete solutions)
설계 노트
The IW611UK-A1IZ uses a 140-ball WLCSP (XFBGA) with fine ball pitch. Follow the NXP IW611 datasheet land-pattern and stack-up recommendations exactly: use a controlled-impedance 50-ohm feed from the RF pin to the antenna with a pi-network for matching, keep the matching network within 2-3 mm of the ball, and provide solid, uninterrupted ground planes on the layer directly beneath the die. Via-stitch the ground pour around the RF section to suppress cavity resonances that would degrade 5 GHz sensitivity.
Supply the IW611 within its 1.8V to 3.3V range, but note the chip internally derives multiple rails; per the NXP datasheet power section, provide per-rail decoupling with a bulk 10 uF plus 0.1 uF and 1 nF ceramic组合 per pin group as specified in the reference design. Because the RF PA draws burst currents during TX, place the bulk capacitor close to the supply balls and use a regulator with good load transient response; otherwise TX burst noise can couple into shared analog rails.
Do not treat the A1IZ/A1ITZ/A1IAZ suffixes as interchangeable without checking the NXP ordering table; although silicon is identical, qualification and packing variants can differ. Also, WLCSP parts are moisture-sensitive - follow the MSL floor-life rules and bake if exposure limits are exceeded before reflow, or popcorn cracking of the package can occur during soldering.
규정 준수 정보
Compliance status not explicitly stated in retrieved web data; confirm on the NXP IW611UK product page or distributor compliance certificates. As an active consumer/IoT NXP part it is typically RoHS-compliant, but XAIPART does not assume compliance without source data.
