LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
N.º de pieza: LFE2-6E-6F256I ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LFE2-6E-6F256I Descripción general
An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after fabrication. The LFE2-6E-6F256I belongs to the ECP2 family and provides a compact implementation platform for control logic, data acquisition, protocol bridging, and embedded signal-processing functions. Its 6K LUT class can consolidate multiple fixed-function blocks into one device while retaining field-updatable firmware.
Key verified features include 6,000 logic elements, 750 equivalent logic blocks, 190 user I/Os, 56,320 RAM bits, and a 1.2 V supply designation. Distributor listings identify the device as an ECP2 FPGA with a -6 speed grade and industrial temperature designation. The package is identified as a 256-BGA package.
The ECP2 architecture is useful when a design needs programmable routing and logic rather than a fixed application-specific integrated circuit. The 190 I/O count provides substantial parallel connectivity for buses, counters, control signals, and external memory interfaces, while the available logic and RAM resources support moderate state machines and buffering. Exact timing, voltage tolerances, configuration details, and pin functions should be confirmed in the manufacturer data sheet before layout or production release.
Typical applications include industrial control and factory automation, communication-interface bridging, instrumentation and test equipment, embedded data acquisition, and compact control systems. The FPGA can consolidate interface logic and control functions, reducing component count when firmware flexibility is important.
When designing a board, preserve the manufacturer's recommended power, decoupling, configuration, clocking, and ball-grid-array layout requirements. Validate signal integrity and thermal performance across the complete operating temperature range and programmed logic configuration.
This page consolidates verified distributor and product data, application guidance, package information, and selection considerations for engineers evaluating the LFE2-6E-6F256I.
Alternativas directas para LFE2-6E-6F256I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LFE2-6E-6F256I (mismo factor de forma y huella) — difiere en Package, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LFE2-6E-6FN256I
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LFE2-6E-5F256I
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Ver hoja de datos →LFE2-6SE-5F256I
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LFE2-6E-6F256C
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Ver hoja de datos →LFE2-6E-6F256
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LFE2-6E-6F256I Valores máximos y características eléctricas
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Elements | 6,000 |
| Equivalent Logic Blocks | 750 |
| Total RAM | 56,320 bits |
| General-Purpose User I/Os | 190 |
| Speed Grade | -6 |
| Supply Designation | 1.2 V |
| Temperature Designation | Industrial |
| Encapsulado | 256-BGA |
| Package Type | Fine-Pitch Ball Grid Array |
| Package Dimensions | 17 mm x 17 mm |
| Logic Resource Class | 6K LUT FPGA |
| DSP Feature | Advanced DSP blocks listed for the ECP2/M family |
| Tipo de montaje | Surface Mount |
| Configuration | Field programmable |
| Manufacturer | Lattice Semiconductor Corporation |
| Product Family | ECP2 |
Guía de configuración de pines de LFE2-6E-6F256I 17 mm x 17 mm
Configuración de pines para LFE2-6E-6F256I (encapsulado 17 mm x 17 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LFE2-6E-6F256I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LFE2-6E-6F256I es adecuado para 6 aplicacións: Industrial Control Logic, Data Acquisition and Instrumentation, Communication Interface Bridging, Programmable Test and Measurement, Embedded Data Logging, Audio and Control Processing.
Industrial Control Logic
The LFE2-6E-6F256I fits industrial control and factory-automation blocks that need programmable sequencing, parallel control signals, and compact logic integration. Its verified 6,000 logic elements, 56,320 RAM bits, and 190 user I/Os can support state machines, machine interlocks, sensor conditioning control, actuator sequencing, and diagnostic logic in one programmable device. The industrial temperature designation supports industrial qualification planning, although the exact temperature range and qualification status must be confirmed. Program the FPGA around verified timing constraints and validate all I/O behavior across the intended supply and temperature conditions.
Recomendado
Data Acquisition and Instrumentation
Use the LFE2-6E-6F256I for instrumentation and data-acquisition front ends when parallel sensors, counters, trigger logic, and digital signal conditioning must be coordinated in one FPGA. The 190 user I/Os provide substantial board-level connectivity, while the 56,320 RAM bits can support buffering and finite-state control. The device's programmable nature allows timing and protocol changes without changing the PCB, provided the design stays within verified routing, timing, and I/O limits. Confirm exact voltage, clock, and acquisition timing requirements in the manufacturer data sheet.
Recomendado
Communication Interface Bridging
The LFE2-6E-6F256I is suitable for bridging legacy parallel interfaces to serial or mixed-signal protocols when the required logic fits within its 6K-LUT-class resources. Its 190 I/Os can expose buses, chip-selects, interrupts, and control lines, while programmable logic can implement framing, buffering, and protocol conversion. Verify the target FPGA's supported I/O standards, voltage tolerances, timing margins, and configuration method before release. The available search data confirms FPGA, I/O, RAM, and DSP-related family features but does not provide a complete protocol-specific reference design.
Recomendado
Programmable Test and Measurement
The LFE2-6E-6F256I can consolidate sequencing, pattern generation, counters, and interface logic in compact test-and-measurement equipment. Its programmable nature allows measurement algorithms and control sequences to be updated while the 256-BGA package keeps the device footprint compatible with high-density assembly. The 6,000 logic elements and 190 I/Os are appropriate for moderate multi-channel control rather than unrestricted high-performance signal processing. Confirm clock quality, I/O standards, and timing closure using the manufacturer's device documentation.
Recomendado
Embedded Data Logging
The LFE2-6E-6F256I can implement data qualification, packet assembly, counters, local buffering, and storage-control logic for embedded systems that need field-programmable behavior. Its 56,320 RAM bits provide limited on-chip storage, while 190 I/Os support sensors, memory interfaces, status indicators, and host communication. The device is most appropriate when modest buffering and control logic are needed and firmware updates add value. Validate storage-interface timing, signal integrity, and thermal conditions against the final board implementation.
Recomendado
Audio and Control Processing
The LFE2-6E-6F256I can support modest audio-control, timing, and peripheral-management functions when the design requires programmable logic rather than a fixed DSP. The ECP2/M-family description identifies advanced DSP blocks, but the supplied data does not state the exact block count or arithmetic capabilities for this MPN. Treat the device as suitable only after confirming DSP resources, clocking, audio interface timing, and I/O standards in the manufacturer documentation. Its 190 I/Os are useful for control, status, and digital audio routing around a larger signal-processing architecture.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LFE2-6E-6F256I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LFE2-6E-6FN256I | LFE2-6E-5F256I | LFE2-6SE-5F256I | LFE2-6E-6F256C | LFE2-6E-6F256 |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
Diferenciadores clave
- Verified resource profile (frente a LFE2-6E-6FN256I)
- 190 general-purpose user I/Os (frente a LFE2-6E-6FN256I)
- Industrial-grade ordering designation (frente a LFE2-6E-6F256)
- Speed-grade positioning (frente a LFE2-6E-5F256I)
Notas de diseño
Use the manufacturer 256-BGA ball map and recommended land pattern rather than inferring connections from the 190-I/O summary. Place configuration, clock, and decoupling components according to the Lattice ECP2 reference guidance. Confirm board density, via-in-pad requirements, solder-mask design, and assembly process before committing the PCB, because a footprint error can affect many signals simultaneously.
The verified listings identify a 1.2 V supply designation, but do not provide the complete recommended power architecture, voltage tolerances, or current limits. Follow the manufacturer data sheet for core and auxiliary supplies, sequencing, decoupling capacitance, and startup behavior. Treat the exact electrical values as data-needed rather than deriving them from the package name.
FPGA power depends on the programmed design, switching activity, I/O loading, supply voltage, and ambient conditions. Before production, estimate worst-case junction temperature using the manufacturer power data and thermal model for the actual 256-BGA PCB. Validate with a populated-board thermal test, especially for high-speed I/O or designs using many toggling logic resources.
The 190 user I/O count creates many potential high-speed edges, so route clocks and sensitive interfaces away from noisy switching paths and follow the manufacturer's I/O standards. Verify timing constraints in the selected Lattice toolchain, account for board-level skew and loading, and use the exact pin assignments from the device data sheet before assigning external buses.
Do not treat a similar MPN or matching resource count as proof of a drop-in replacement. LFE2-6E-6FN256I has the closest verified resource summary, but speed, electrical, pin, configuration, and temperature differences must still be checked. Preserve the exact MPN in BOMs, compare manufacturer package drawings, and run post-placement timing and functional validation on any substitution.
Información de cumplimiento
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The industrial I designation is a temperature-grade designation, not evidence of AEC-Q100 qualification.
