LFE2-6E-6F256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
部品番号: LFE2-6E-6F256I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
LFE2-6E-6F256I 概要
An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after fabrication. The LFE2-6E-6F256I belongs to the ECP2 family and provides a compact implementation platform for control logic, data acquisition, protocol bridging, and embedded signal-processing functions. Its 6K LUT class can consolidate multiple fixed-function blocks into one device while retaining field-updatable firmware.
Key verified features include 6,000 logic elements, 750 equivalent logic blocks, 190 user I/Os, 56,320 RAM bits, and a 1.2 V supply designation. Distributor listings identify the device as an ECP2 FPGA with a -6 speed grade and industrial temperature designation. The package is identified as a 256-BGA package.
The ECP2 architecture is useful when a design needs programmable routing and logic rather than a fixed application-specific integrated circuit. The 190 I/O count provides substantial parallel connectivity for buses, counters, control signals, and external memory interfaces, while the available logic and RAM resources support moderate state machines and buffering. Exact timing, voltage tolerances, configuration details, and pin functions should be confirmed in the manufacturer data sheet before layout or production release.
Typical applications include industrial control and factory automation, communication-interface bridging, instrumentation and test equipment, embedded data acquisition, and compact control systems. The FPGA can consolidate interface logic and control functions, reducing component count when firmware flexibility is important.
When designing a board, preserve the manufacturer's recommended power, decoupling, configuration, clocking, and ball-grid-array layout requirements. Validate signal integrity and thermal performance across the complete operating temperature range and programmed logic configuration.
This page consolidates verified distributor and product data, application guidance, package information, and selection considerations for engineers evaluating the LFE2-6E-6F256I.
ドロップイン代替品: LFE2-6E-6F256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: LFE2-6E-6F256I （同一形状・フットプリント） — 相違点: Package, Device Type, Speed Grade, DSP Support, Logic Cells.
クイック比較ツール — 並列比較する代替部品を選択:
LFE2-6E-6FN256I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-6E-5F256I
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →LFE2-6SE-5F256I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-6E-6F256C
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →LFE2-6E-6F256
✅ ドロップイン📋 参考代替品（カタログ未掲載）
LFE2-6E-6F256I 最大定格＆電気的特性
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Elements | 6,000 |
| Equivalent Logic Blocks | 750 |
| Total RAM | 56,320 bits |
| General-Purpose User I/Os | 190 |
| Speed Grade | -6 |
| Supply Designation | 1.2 V |
| Temperature Designation | Industrial |
| パッケージ | 256-BGA |
| Package Type | Fine-Pitch Ball Grid Array |
| Package Dimensions | 17 mm x 17 mm |
| Logic Resource Class | 6K LUT FPGA |
| DSP Feature | Advanced DSP blocks listed for the ECP2/M family |
| 実装タイプ | Surface Mount |
| Configuration | Field programmable |
| Manufacturer | Lattice Semiconductor Corporation |
| Product Family | ECP2 |
LFE2-6E-6F256I 17 mm x 17 mm ピン配置ガイド
LFE2-6E-6F256I (17 mm x 17 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: LFE2-6E-6F256I.
詳細は データシート をご参照ください。
主な用途
LFE2-6E-6F256I の用途: 6 件s: Industrial Control Logic, Data Acquisition and Instrumentation, Communication Interface Bridging, Programmable Test and Measurement, Embedded Data Logging, Audio and Control Processing.
Industrial Control Logic
The LFE2-6E-6F256I fits industrial control and factory-automation blocks that need programmable sequencing, parallel control signals, and compact logic integration. Its verified 6,000 logic elements, 56,320 RAM bits, and 190 user I/Os can support state machines, machine interlocks, sensor conditioning control, actuator sequencing, and diagnostic logic in one programmable device. The industrial temperature designation supports industrial qualification planning, although the exact temperature range and qualification status must be confirmed. Program the FPGA around verified timing constraints and validate all I/O behavior across the intended supply and temperature conditions.
おすすめ
Data Acquisition and Instrumentation
Use the LFE2-6E-6F256I for instrumentation and data-acquisition front ends when parallel sensors, counters, trigger logic, and digital signal conditioning must be coordinated in one FPGA. The 190 user I/Os provide substantial board-level connectivity, while the 56,320 RAM bits can support buffering and finite-state control. The device's programmable nature allows timing and protocol changes without changing the PCB, provided the design stays within verified routing, timing, and I/O limits. Confirm exact voltage, clock, and acquisition timing requirements in the manufacturer data sheet.
おすすめ
Communication Interface Bridging
The LFE2-6E-6F256I is suitable for bridging legacy parallel interfaces to serial or mixed-signal protocols when the required logic fits within its 6K-LUT-class resources. Its 190 I/Os can expose buses, chip-selects, interrupts, and control lines, while programmable logic can implement framing, buffering, and protocol conversion. Verify the target FPGA's supported I/O standards, voltage tolerances, timing margins, and configuration method before release. The available search data confirms FPGA, I/O, RAM, and DSP-related family features but does not provide a complete protocol-specific reference design.
おすすめ
Programmable Test and Measurement
The LFE2-6E-6F256I can consolidate sequencing, pattern generation, counters, and interface logic in compact test-and-measurement equipment. Its programmable nature allows measurement algorithms and control sequences to be updated while the 256-BGA package keeps the device footprint compatible with high-density assembly. The 6,000 logic elements and 190 I/Os are appropriate for moderate multi-channel control rather than unrestricted high-performance signal processing. Confirm clock quality, I/O standards, and timing closure using the manufacturer's device documentation.
おすすめ
Embedded Data Logging
The LFE2-6E-6F256I can implement data qualification, packet assembly, counters, local buffering, and storage-control logic for embedded systems that need field-programmable behavior. Its 56,320 RAM bits provide limited on-chip storage, while 190 I/Os support sensors, memory interfaces, status indicators, and host communication. The device is most appropriate when modest buffering and control logic are needed and firmware updates add value. Validate storage-interface timing, signal integrity, and thermal conditions against the final board implementation.
おすすめ
Audio and Control Processing
The LFE2-6E-6F256I can support modest audio-control, timing, and peripheral-management functions when the design requires programmable logic rather than a fixed DSP. The ECP2/M-family description identifies advanced DSP blocks, but the supplied data does not state the exact block count or arithmetic capabilities for this MPN. Treat the device as suitable only after confirming DSP resources, clocking, audio interface timing, and I/O standards in the manufacturer documentation. Its 190 I/Os are useful for control, status, and digital audio routing around a larger signal-processing architecture.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: LFE2-6E-6F256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | LFE2-6E-6FN256I | LFE2-6E-5F256I | LFE2-6SE-5F256I | LFE2-6E-6F256C | LFE2-6E-6F256 |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
主な差別化要因
- Verified resource profile （vs LFE2-6E-6FN256I)
- 190 general-purpose user I/Os （vs LFE2-6E-6FN256I)
- Industrial-grade ordering designation （vs LFE2-6E-6F256)
- Speed-grade positioning （vs LFE2-6E-5F256I)
設計ノート
Use the manufacturer 256-BGA ball map and recommended land pattern rather than inferring connections from the 190-I/O summary. Place configuration, clock, and decoupling components according to the Lattice ECP2 reference guidance. Confirm board density, via-in-pad requirements, solder-mask design, and assembly process before committing the PCB, because a footprint error can affect many signals simultaneously.
The verified listings identify a 1.2 V supply designation, but do not provide the complete recommended power architecture, voltage tolerances, or current limits. Follow the manufacturer data sheet for core and auxiliary supplies, sequencing, decoupling capacitance, and startup behavior. Treat the exact electrical values as data-needed rather than deriving them from the package name.
FPGA power depends on the programmed design, switching activity, I/O loading, supply voltage, and ambient conditions. Before production, estimate worst-case junction temperature using the manufacturer power data and thermal model for the actual 256-BGA PCB. Validate with a populated-board thermal test, especially for high-speed I/O or designs using many toggling logic resources.
The 190 user I/O count creates many potential high-speed edges, so route clocks and sensitive interfaces away from noisy switching paths and follow the manufacturer's I/O standards. Verify timing constraints in the selected Lattice toolchain, account for board-level skew and loading, and use the exact pin assignments from the device data sheet before assigning external buses.
Do not treat a similar MPN or matching resource count as proof of a drop-in replacement. LFE2-6E-6FN256I has the closest verified resource summary, but speed, electrical, pin, configuration, and temperature differences must still be checked. Preserve the exact MPN in BOMs, compare manufacturer package drawings, and run post-placement timing and functional validation on any substitution.
コンプライアンス情報
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. The industrial I designation is a temperature-grade designation, not evidence of AEC-Q100 qualification.
