LFE3-17EA-6MG328C - 17K LUT ECP3 FPGA, 116 I/O, 328-CSBGA | Lattice
N.º de pieza: LFE3-17EA-6MG328C ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $52.64 | $52,64 |
| 10 | $48.2 | $482,00 |
| 100 | $43.75 | $4.375,00 |
| 500 | $39.4 | $19.700,00 |
| 1.000 | $35.1 | $35.100,00 |
LFE3-17EA-6MG328C Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (LUTs), programmable interconnect, and dedicated hard IP such as SERDES, PLLs, and block RAM. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with full software-style reprogrammability. The LatticeECP3 family specifically targets low-cost, high-volume serial connectivity applications, distinguishing itself from pure CPLDs by integrating multi-gigabit transceivers directly on-die.
Key features of the LFE3-17EA-6MG328C include up to 16 SERDES channels supporting data rates from 150 Mbps (8b/10b-encoded) to 3.2 Gbps, dual-channel SERDES supporting protocols such as PCI Express, SGMII, and XAUI, distributed and block RAM totaling 716,800 bits, and embedded sysDSP slices for signal processing. The 65 nm process combined with 1.2 V core operation delivers the typical low-power consumption that defines the ECP3 value proposition.
Typical applications for this device include cost-optimized telecom bridges, low-density serial protocol aggregation (SGMII, XAUI, PCIe Gen1), industrial control planes, video processing pre-processing, and embedded control with parallel processing. The 116 user I/O and 17K LUT density suit designs where higher-end Virtex or Stratix-class FPGAs would be overkill, but pin-compatible alternatives exist for design migration.
When designing with the LFE3-17EA-6MG328C, ensure the PCB footprint matches the 328-ball CSBGA land pattern exactly and that the supporting power supply decoupling follows Lattice's TN1207 reference. The -6 speed grade balances Fmax and cost; the -7 grade delivers higher Fmax at higher price.
This page synthesizes real-time distributor pricing, drop-in same-package alternatives, and engineering-grade design notes that go beyond the manufacturer datasheet headline parameters.
Alternativas directas para LFE3-17EA-6MG328C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LFE3-17EA-7MG328C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LFE3-17EA-6MG328I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LFE3-17EA-6LMG328C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LFE3-17EA-6MG328C Valores máximos y características eléctricas
| Family | LatticeECP3 (ECP3) |
| Series | ECP3 |
| Number of Logic Elements / Cells | 17,000 |
| Number of LABs / CLBs | 2125 |
| Number of LUTs | 17,300 |
| Total RAM Bits | 716,800 |
| Number of User I/O | 116 |
| Number of SERDES Channels | Up to 16 |
| SERDES Data Rate | 150 Mbps to 3.2 Gbps |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| Speed Grade | -6 |
| Encapsulado | 328-LFBGA / CSBGA |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | Commercial (0C to +85C) |
| Estado RoHS | Compliant |
Guía de configuración de pines de LFE3-17EA-6MG328C 328-lfbga / csbga
Configuración de pines para LFE3-17EA-6MG328C (encapsulado 328-lfbga / csbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LFE3-17EA-6MG328C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LFE3-17EA-6MG328C es adecuado para 6 aplicacións: Cost-Optimized Serial Connectivity Bridge, Industrial Control Plane Aggregation, Video Pre-Processing and Format Conversion, Embedded Control with Parallel Processing, Low-Density Telecom Datapath Offload, Test and Measurement Instrumentation Backbone.
Cost-Optimized Serial Connectivity Bridge
The LFE3-17EA-6MG328C fits cost-optimized serial connectivity bridges because of its up to 16 SERDES channels operating at 150 Mbps to 3.2 Gbps, covering protocols from SGMII and XAUI to PCIe Gen1. Placed as the protocol-conversion engine between backplane SERDES links and parallel FPGA logic, its 17K LUT density is sufficient for state-machine glue and protocol framing. The -6 speed grade delivers enough Fmax for most mainstream bridging designs while keeping unit cost lower than the -7 grade. Compared with discrete SERDES PHYs plus an FPGA, the integrated SERDES reduces BOM count, board area, and power by approximately 30 percent per the Lattice ECP3 marketing collateral.
Recomendado
Industrial Control Plane Aggregation
The LFE3-17EA-6MG328C serves industrial control-plane aggregation because of its 116 user I/O, 716,800 bits of embedded SRAM, and tolerant 1.2 V core supply that integrates well with industrial 24 V backplane systems. The FPGA aggregates multiple fieldbus interfaces (EtherCAT, Profinet, Modbus TCP) and routes them through SERDES channels to a host processor. Its commercial 0C to +85C operating range covers most factory-floor enclosures, and the -6 speed grade is sufficient for typical deterministic control loops below 100 MHz. Designers can substitute the LFE3-17EA-6MG328I for industrial temperature deployments without any PCB changes.
Recomendado
Video Pre-Processing and Format Conversion
The LFE3-17EA-6MG328C fits video pre-processing and format conversion applications because its 17K LUTs provide enough logic capacity for color-space conversion and scaling pipelines, while the embedded sysDSP slices accelerate pixel-rate arithmetic. With 116 user I/O the device accepts wide parallel video buses (24-bit RGB at up to 1080p60) and outputs serialized streams over its SERDES links. Power consumption is moderate thanks to the 65 nm process, and the 328-CSBGA package provides the thermal headroom required for sustained pixel throughput. For higher-resolution designs above 1080p, designers typically migrate to the larger LFE3-35 or LFE3-70 ECP3 family members.
Recomendado
Embedded Control with Parallel Processing
The LFE3-17EA-6MG328C delivers embedded control with hardware parallelism because its 17.3K LUTs can implement custom state machines that run deterministically without RTOS jitter. The 716,800 bits of block RAM are sufficient for instruction and data scratchpad storage in soft-core CPU implementations (MicroBlaze or LatticeMico32). The 116 user I/O connect to legacy parallel buses, PWM channels, and encoder interfaces. Compared with a discrete microcontroller, the ECP3 offers deterministic latency for safety-critical loops and supports concurrent execution of control and communication tasks. The -6 speed grade is adequate for sub-100 MHz control logic typical in industrial embedded designs.
Recomendado
Low-Density Telecom Datapath Offload
The LFE3-17EA-6MG328C is well suited for low-density telecom datapath offload because its SERDES channels directly accept framer interfaces at 1.0625 Gbps (XAUI lane rate), 2.5 Gbps, and 3.2 Gbps without external PHYs. Its LUT count handles small packet-header processing, OAM (Operations, Administration, Maintenance) insertion, and traffic-class lookups for line-card aggregation. Compared with general-purpose processors, the FPGA provides line-rate processing with deterministic latency. For higher-density aggregation, designers move to the 35K or 70K LUT ECP3 variants, but for low-port-count tributary cards the LFE3-17EA-6MG328C delivers the best cost-per-channel.
Recomendado
Test and Measurement Instrumentation Backbone
The LFE3-17EA-6MG328C suits test and measurement instrumentation because its SERDES channels can capture high-speed ADC/DAC data streams at up to 3.2 Gbps, while the 17K LUTs implement trigger logic, decimation, and DSP preprocessing. The 716,800 bits of embedded SRAM buffer sample windows before DMA to a host. The 116 user I/O provide trigger, clock, and parallel low-speed ADC interface channels. Compared with fixed-function ASICs, the FPGA's reprogrammability lets the same hardware serve multiple test protocols. For higher sample rates exceeding 3.2 Gbps, designers step up to ECP3-70 or move to Xilinx Kintex-class devices.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LFE3-17EA-6MG328C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LFE3-17EA-7MG328C | LFE3-17EA-6MG328I | LFE3-17EA-6LMG328C |
|---|---|---|---|---|
| Package | 328-LFBGA / CSBGA | 328-LFBGA / CSBGA (same) | 328-LFBGA / CSBGA (same) | 328-LFBGA / CSBGA (same) |
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Logic Elements | 17,000 | 17,000 (same die) | 17,000 (same die) | 17,000 (same die) |
| Speed Grade | -6 | -7 (faster) | -6 (same) | -6 (same) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Power Variant | Standard | Standard | Standard | Low-power (L) |
Diferenciadores clave
- Integrated multi-gigabit SERDES on a low-cost 65 nm FPGA die (frente a LFE3-17EA-7MG328C)
- Industrial temperature support in the same footprint (frente a LFE3-17EA-6MG328I)
- Low-power variant for thermally constrained designs (frente a LFE3-17EA-6LMG328C)
Notas de diseño
The LFE3-17EA-6MG328C requires a 1.2 V core supply with +/-5 percent tolerance. Estimate: at typical SERDES utilization (4 active channels at 3.2 Gbps) plus 30 percent logic utilization, total core current draws approximately 0.5 A to 0.9 A depending on toggle rate. Use a low-noise LDO or buck regulator with at least 20 percent headroom; the Lattice TN1207 reference recommends 33 uF bulk plus 0.1 uF and 10 nF decoupling distributed around the BGA perimeter.
The 328-CSBGA land pattern requires microvia or via-in-pad construction for reliable assembly, particularly for the inner rows. Estimate: trace escape demands at minimum a 6-layer PCB with HDI (stacked microvias). Place decoupling capacitors on the bottom side directly beneath their respective BGA balls when via-in-pad is used. Thermal vias under the central balls are recommended to keep junction temperature below 100C at maximum SERDES activity.
Do not mix -6 and -7 speed grades within a multi-FPGA design - timing closure must be re-run if the speed grade changes. SERDES reference clock jitter must remain below the value specified in the LatticeECP3 Family Data Sheet (typically 1 ps RMS for 3.2 Gbps operation); a noisy reference clock causes intermittent link failures that are difficult to debug. Always program the configuration image with the correct bitstream revision for the selected speed grade.
SERDES channels operating at 3.2 Gbps require controlled-impedance differential routing (100 ohm +/-10 percent) with length matching within 5 mils for the P and N pairs. Estimate: maximum recommended PCB trace length for 3.2 Gbps is approximately 6 inches on standard FR-4 before insertion loss forces pre-emphasis or equalization tuning. Use HyperLynx or SiSoft SI simulation before committing to layout on dense mainboards.
Información de cumplimiento
RoHS compliant per Lattice product page. Not AEC-Q100 qualified (FPGA, not automotive-grade part). LatticeECP3 family does not carry a published halogen-free statement as of the verified web data.
