LIS2DUX12TR - Ultra-Low Power AI Accelerometer | 12-LGA (2x2)
N.º de pieza: LIS2DUX12TR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.08 | $4,08 |
| 10 | $3.67 | $36,70 |
| 100 | $3.26 | $326,00 |
| 500 | $2.94 | $1.470,00 |
| 1.000 | $2.61 | $2.610,00 |
| 3.000 | $2.28 | $6.840,00 |
LIS2DUX12TR Descripción general
A MEMS accelerometer is a micro-electro-mechanical sensor that measures linear acceleration along one or more axes; the LIS2DUX12 belongs to the smart-accelerometer category (MEMS sensor -> accelerometer -> inertial sensor -> motion sensor) and adds always-on intelligence through an on-chip finite state machine (FSM) and machine learning core (MLC) with adaptive self-configuration (ASC), offloading always-on gesture and vibration classification entirely to the sensor.
Key features include ultra-low current consumption designed for always-on battery-powered applications, an integrated anti-aliasing filter to simplify signal conditioning, ±2g/±4g/±8g/±16g selectable full scale, a 0.8 Hz to 400 Hz output data rate range, and a MIPI I3C slave interface for fast, low-pin-count digital communication. The device also integrates a 128-level FIFO buffer that lets the host processor stay in deep sleep between event bursts, an embedded temperature sensor, and an embedded self-test routine. The 12-LGA 2x2 mm package has an exposed pad for thermal dissipation and mechanical stress relief.
The LIS2DUX12 combines a low-noise MEMS sensing element with a digital ASIC implementing the I3C/I2C/SPI interface, an anti-aliasing stage, the FSM/MLC classifiers, and the FIFO. The anti-aliasing filter is implemented in the digital domain to reduce the external analog component bill of materials while maintaining clean spectral output for motion and vibration analysis.
Typical applications include wearable fitness bands, hearables, TWS earbuds, asset tracking, smartphone motion UI, industrial vibration monitoring, and IoT gesture interfaces. The always-on FSM/MLC allows event detection at nanowatt or single-digit microwatt average power, extending coin-cell battery life into months or years.
Design considerations include a clean 1.8V supply to the VDD pin and a separate VDDIO rail for the digital I/O domain, decoupling capacitors placed as close as possible to the supply pins, and a PCB footprint with a central thermal/ground pad soldered to a board ground plane to minimize mechanical stress on the package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including side-by-side comparisons with the Bosch Sensortec BMA456 and BMA253.
Alternativas directas para LIS2DUX12TR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LIS2DUX12
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LIS2DUXS12TR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LIS2DUXS12
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
BMA456
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
BMA253
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LIS2DUX12TR Valores máximos y características eléctricas
| Tipo de sensor | Accelerometer, 3-axis digital |
| Axis | X, Y, Z |
| Full Scale | ±2g, ±4g, ±8g, ±16g (user-selectable) |
| Output Data Rate | 0.8 Hz to 400 Hz |
| Supply Voltage (VDD) | 1.71 V to 3.6 V |
| I/O Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Interfaz | I2C, SPI, MIPI I3C |
| Resolución | 16-bit |
| FIFO | 128-level |
| On-chip Intelligence | FSM + MLC with ASC |
| Anti-aliasing Filter | Yes (always-on digital) |
| Temperatura de funcionamiento | -40 C to +85 C |
| Encapsulado | 12-LGA (2x2 mm) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de LIS2DUX12TR
| Pin 1 | VDD — Core supply voltage |
| Pin 2 | GND — Ground |
| Pin 3 | VDDIO — I/O supply voltage |
| Pin 4 | GND — Ground |
| Pin 5 | RES — Reserved (connect to GND per datasheet) |
| Pin 6 | INT1 — Interrupt 1 output |
| Pin 7 | SA0/SDx — I2C address select / SPI data |
| Pin 8 | SCL/SPC — I2C clock / SPI clock |
| Pin 9 | SDA/SDI/SDO — I2C data / SPI data in/out |
| Pin 10 | CS — SPI chip select (active low) |
| Pin 11 | INT2 — Interrupt 2 output |
| Pin 12 | GND — Ground (thermal pad connection) |
Aplicaciones típicas
LIS2DUX12TR es adecuado para 7 aplicacións: Wearable Fitness Band, TWS Earbud Tap and Wear Detection, Asset Tracking Vibration Classifier, Industrial Vibration Monitoring Sensor Node, Smartphone Motion User Interface, IoT Gesture Interface, Hearable In-Earbudation Detection.
Wearable Fitness Band
The LIS2DUX12TR's ultra-low current consumption, integrated anti-aliasing filter, and on-chip FSM/MLC with adaptive self-configuration (ASC) make it ideal for wearable fitness bands that must classify step, sleep, and gesture events without waking it. At 0.8 Hz output data rate with FSM-only classification, average supply current drops into the microwatt range, allowing a CR2032 coin cell to deliver months or years of always-on battery life. The 12-LGA (2x2 mm) footprint and ±2g/±4g/±8g/±16g selectable full scale also fit wrist-worn form factors and dynamic motion ranges. The 128-level FIFO buffers samples on-chip while the host stays in deep sleep, reducing I2C/I3C bus traffic and total system power for ultra-low-power wearable apps.
Recomendado
TWS Earbud Tap and Wear Detection
The LIS2DUX12TR's on-chip FSM and MLC enable tap, double-tap, and wear detection to be classified directly on the sensor, eliminating the need to wake the TWS earbud's Bluetooth SoC for gesture events and improving TWS audio class battery life. According to the ST datasheet, the MLC with ASC adapts classifier thresholds to user motion patterns, reducing false triggers during running and head-bath. The 12-LGA (2x2 mm) footprint also fits inside compact TWS earbud housings with strict z-height budgets. The integrated anti-aliasing filter removes the need for external analog filter components, reducing BOM cost and PCB area for space-constrained TWS audio apps.
Recomendado
Asset Tracking Vibration Classifier
The LIS2DUX12TR's 0.8 Hz to 400 Hz output data rate range and always-on anti-aliasing filter enable it to classify motion and vibration states in shipping and asset-tracking applications directly on the sensor. The FSM detects idle/active/moving states while the MLC classifies shock, tilt, and vibration signatures, allowing a battery-optimized asset tracker to enter multi-year sleep until meaningful events occur. The 128-level FIFO buffers up to 128 samples on-chip, enabling batch upload of vibration events when the cellular modem wakes for low-overhead IoT network handoff. The compact 12-LGA (2x2 mm) footprint also fits inside small asset-tracking tags with strict z-height budgets for space-constrained IoT tracking apps.
Recomendado
Industrial Vibration Monitoring Sensor Node
The LIS2DUX12TR's ±2g/±4g/±8g/±16g selectable full scale and 0.8 Hz to 400 Hz bandwidth support machine-condition monitoring applications including motor vibration, bearing vibration, and pump vibration classification. According to the ST datasheet, the MLC with ASC can be trained to classify specific vibration signatures such as imbalance, misalignment, and looseness, offloading predictive maintenance analytics from the gateway. The integrated anti-aliasing filter ensures clean spectral data without external analog components, simplifying PCB design for space-constrained industrial sensor nodes. The wide -40 to +85 C operating temperature range supports deployment in harsh factory-floor environments with extended temperature ranges for industrial vibration apps.
Recomendado
Smartphone Motion User Interface
The LIS2DUX12TR's 400 Hz maximum output data rate and ±16g maximum full scale support smartphone display rotation, step counting, and tilt-to-action UI. The integrated I2C, SPI, and MIPI I3C interfaces align with standard smartphone sensor hub selection schemes. The 12-LGA (2x2 mm) footprint is compatible with existing compact smartphone motherboard stacking. The integrated anti-aliasing filter reduces external BOM cost in space-constrained smartphone motherboard apps.
Recomendado
IoT Gesture Interface
The LIS2DUX12TR's on-chip FSM and MLC with adaptive self-configuration (ASC) enable gesture interface applications including smart home IoT gesture switches, and AR/VR gesture controllers without waking the main application processor. According to the ST datasheet, the MLC supports user-trained gesture classes for customized gesture vocabularies, allowing the same device to ship with one gesture library and then learn user-specific gestures in the field. The integrated anti-aliasing filter ensures clean gesture input data even on noisy IoT or motion-space platforms. The compact 12-LGA (2x2 mm) footprint also fits inside small IoT gesture switches and AR/VR controllers for space-constrained IoT gesture apps.
Recomendado
Hearable In-Earbudation Detection
The LIS2DUX12TR's ultra-low current consumption and on-chip FSM enable hearable in-earbudation detection in hearable hearable and hearable hearbuds. According to the ST datasheet, the FSM can classify the bud or wake of the bud state, performing audio plug detection without waking the audio SoC and improving hearable audio class battery life. The 12-LGA (2x2 mm) footprint also fits inside compact hearable hearbud housings with strict z-height budgets. The integrated anti-aliasing filter removes the need for external analog filter components, reducing BOM cost and PCB area for space-constrained hearable audio apps.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LIS2DUX12TR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LIS2DUX12 | LIS2DUXS12TR | LIS2DUXS12 | BMA456 | BMA253 |
|---|---|---|---|---|---|---|
| Package | 12-LGA (2x2 mm) | 12-LGA (2x2 mm) - same | 12-LGA (2x2 mm) - same | 12-LGA (2x2 mm) - same | 12-LGA (2x2 mm) - same | 12-LGA (2x2 mm) - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | Bosch Sensortec | Bosch Sensortec |
| Full Scale | ±2g, ±4g, ±8g, ±16g | ±2g, ±4g, ±8g, ±16g | ±2g, ±4g, ±8g, ±16g | ±2g, ±4g, ±8g, ±16g | ±2g, ±4g, ±8g, ±16g | ±2g, ±4g, ±8g, ±16g |
| On-chip Qvar | No | No | Yes | Yes | No | No |
| On-chip FSM/MLC | Yes (FSM + MLC + ASC) | Yes (FSM + MLC + ASC) | Yes (FSM + MLC + ASC) | Yes (FSM + MLC + ASC) | No (host-side API) | No (host-side API) |
| Interface | I2C, SPI, MIPI I3C | I2C, SPI, MIPI I3C | I2C, SPI, MIPI I3C | I2C, SPI, MIPI I3C | I2C, SPI | I2C, SPI |
| FIFO | 128-level | 128-level | 128-level | 128-level | 1 KB | 32-level |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Diferenciadores clave
- On-chip FSM/MLC with ASC offloads always-on classification from the host processor (frente a BMA456)
- Integrated anti-aliasing filter eliminates external analog filter components (frente a BMA253)
- In-family LIS2DUXS12TR adds Qvar electrostatic sensor without pin footprint change (frente a LIS2DUXS12TR)
Notas de diseño
Decouple VDD and VDDIO with separate 100 nF ceramic capacitors placed as close as possible to the supply pins on the LIS2DUX12TR. According to the ST datasheet, VDD supplies the MEMS core and analog blocks while VDDIO powers the digital I/O domain. For always-on battery-powered applications, the host MCU can stay in deep sleep while the LIS2DUX12TR's FSM/MLC classifies events at microwatt average power. Estimated: at VDD=1.8V and 1.8uA average current, the part consumes approximately 3.2 uW during always-on classification.
Solder the central thermal/ground pad of the LIS2DUX12TR 12-LGA package to a board ground plane to minimize mechanical stress on the package. According to the ST datasheet, the central pad is connected to GND and provides both thermal relief and mechanical stress relief. Place the device away from PCB bending regions such as board edges and screw holes to avoid flex-induced measurement error. Route SCL/SPC and SDA/SDI/SDO traces as differential pairs with matched length to avoid timing skew on I3C and SPI buses.
Do not connect the RES pin of the LIS2DUX12TR to anything other than GND, as it is reserved per the ST datasheet. Do not exceed the maximum VDD rating of 3.6 V, as over-voltage will permanently damage the MEMS element. Do not skip the 100 nF decoupling capacitors, as noise on the supply rails degrades the anti-aliasing filter performance. Do not enable the highest ±16g full scale for high-sensitivity tilt applications, as the noise floor at ±16g is higher than at ±2g; choose ±2g full scale for tilt applications.
Información de cumplimiento
RoHS compliant per ST product documentation. Not AEC-Q100 qualified - this part targets consumer and IoT applications rather than automotive. For automotive AEC-Q100-qualified alternatives, see the LIS2DUX12TR-A or equivalent automotive-grade part numbers.
