LPC1813JET100E - 180MHz Cortex-M3 MCU | NXP | Embedded Control
N.º de pieza: LPC1813JET100E ✓ ActivoLPC1813JET100E Descripción general
A microcontroller is a programmable semiconductor that integrates a CPU core, memory, and peripherals into one device. The ARM Cortex-M3 processor provides a 32-bit instruction set with efficient interrupt handling, while the LPC1813JET100E adds embedded flash, SRAM, and communication resources on a single package. In the system hierarchy, it is an MCU, an embedded processing IC, and a semiconductor used to supervise sensors, communications, actuators, and human-machine interfaces.
The device's headline characteristics are its 180 MHz Cortex-M3 processing capability, 512 KB of embedded flash, and 100-pin TFBGA package. The LPC1800 family is positioned for applications requiring high-performance embedded control and a broad peripheral set. Family documentation identifies Ethernet, two high-speed USB interfaces, LCD support, and electromagnetic-compatibility design features, making the platform suitable for gateways, industrial controllers, network-connected equipment, and multimedia control systems.
Performance is balanced by integration: the MCU combines a 3.3 V operating class with substantial embedded memory and high-speed serial connectivity. The exact LPC1813 variant configuration, including SRAM capacity and the availability of individual communication peripherals, should be confirmed against the manufacturer datasheet before schematic capture. Firmware developers should also verify clock, reset, power, and debug assignments in the pin description table rather than relying on assumptions based on another LPC18xx member.
Typical uses include industrial Ethernet equipment, USB-connected control systems, network access points, programmable logic controllers, and embedded human-machine interfaces. An Ethernet interface can connect the controller to a supervisory network, while high-speed USB supports service ports, data acquisition links, or peripheral expansion. The Cortex-M3 architecture also supports common real-time control, communications, and monitoring workloads when firmware scheduling and interrupt priorities are designed carefully.
A principal design consideration is fine-pitch BGA layout. The 100-pin TFBGA requires a PCB footprint and assembly process capable of handling dense ball pitches, and power, ground, and high-speed signal routing must follow NXP's reference layout and decoupling guidance. Designers should budget memory for the application, validate bootloader support, and confirm that the selected board configuration exposes every required communication interface.
This product page combines the manufacturer identification, exact orderable MPN, distributor technical summary, known family capabilities, and engineering-focused selection guidance. It also distinguishes the LPC1813JET100E from closely related LPC18xx devices so designers can assess flash capacity, peripheral differences, package compatibility, and the practical effort required for a board-level substitution.
Alternativas directas para LPC1813JET100E — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC1813JET100E (mismo factor de forma y huella) — difiere en Package, Product Type, Architecture, Flash Memory.
LPC1812JET100E
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →LPC1822JET100E
✅ Sustitución directaConsulte el precio
Ver hoja de datos →LPC1823JET100E
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →LPC1837JET100E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1831JET100E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
LPC1813JET100E Valores máximos y características eléctricas
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Manufacturer | NXP Semiconductors |
| Maximum CPU Frequency | 180 MHz |
| Processor Core | ARM Cortex-M3 |
| Instruction Set | 32-bit |
| Embedded Flash | 512 KB |
| Flash Organization | 512K x 8 |
| Tensión de alimentación | 3.3 V |
| Encapsulado | 100-pin TFBGA, 9 mm x 9 mm |
| Package Family | TFBGA |
| Tipo de montaje | Surface mount |
| Ethernet Support | LPC18xx family feature |
| High-Speed USB Interfaces | 2 in LPC18xx family |
| LCD Support | LPC18xx family feature |
| EMC Features | LPC18xx family feature |
Guía de configuración de pines de LPC1813JET100E tfbga
Configuración de pines para LPC1813JET100E (encapsulado tfbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC1813JET100E.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC1813JET100E es adecuado para 6 aplicacións: Industrial Ethernet Controller, USB Service and Configuration Port, Embedded Data Acquisition System, Networked Human-Machine Interface, Programmable Logic Controller, Connected Consumer Control Module.
Industrial Ethernet Controller
The LPC1813JET100E fits industrial Ethernet control equipment because it combines a 180 MHz ARM Cortex-M3 core, 512 KB of embedded flash, and LPC18xx-family Ethernet support in a 100-pin TFBGA package. The MCU can supervise sensors, execute control logic, and manage network traffic while preserving performance for protocol processing. Its 3.3 V operating class also simplifies integration with common industrial-interface circuitry. Ethernet PHY selection remains an important design decision because the MCU requires a suitable physical-layer interface and correctly terminated network path. Designers should review the exact LPC1813 Ethernet pin multiplexing, reference clock requirements, and magnetics recommendations in the NXP documentation. The 9 mm by 9 mm TFBGA helps limit board area, although fine-pitch assembly and controlled impedance routing require deliberate PCB design and validation.
Recomendado
USB Service and Configuration Port
The LPC1813JET100E is suitable for a USB-connected embedded control module because the LPC18xx family provides two high-speed USB interfaces and the MCU supplies 180 MHz processing performance with 512 KB of flash. One interface can support a service, diagnostic, or configuration connection while the MCU continues operating the equipment. A USB-to-serial interface such as USB2517-JZX-TR can be useful when a downstream USB hub or host connection must be implemented. Firmware should include enumeration, suspend and resume handling, and the boot path required by the product. Before routing the PCB, confirm the exact USB data pins, transceiver requirements, clocking, and termination using the manufacturer pin table. The 100-pin TFBGA keeps the controller compact but requires careful escape routing from the center of the package.
Recomendado
Embedded Data Acquisition System
The LPC1813JET100E offers enough processing bandwidth and program storage for embedded data-acquisition and signal-conditioning systems that must combine control loops with communications. Its 180 MHz ARM Cortex-M3 core can service interrupts, process acquired data, and supervise multiple external interfaces, while 512 KB of flash provides room for application code, protocol handlers, and update logic. A precision converter such as MCP3424-E/SL can provide analog-to-digital conversion for low-frequency or sensor-oriented measurements. The MCU should be paired with appropriate analog isolation, input protection, and grounding techniques so switching and converter behavior does not compromise measurement accuracy. Confirm available SRAM, DMA routing, timer assignments, and the exact peripheral mix before finalizing firmware architecture. Fine-pitch BGA construction and continuous high-speed activity make thermal verification and signal-integrity testing essential.
Recomendado
Networked Human-Machine Interface
The LPC1813JET100E can serve as the central controller for a networked human-machine interface because the LPC18xx family combines Cortex-M3 processing, 512 KB of flash, LCD support, Ethernet, and USB in one device. The MCU can drive a display, process user input, update status information, and expose diagnostics through a local or remote network. A codec such as PCM1725U may support audio output functions in suitable multimedia designs, although the complete signal chain must remain compatible with the chosen display and enclosure. Power sequencing for the LCD, external interface isolation, and ESD protection are essential. Because this is a 100-pin TFBGA, the pin multiplexing and escape routes for LCD data should be resolved before schematic sign-off. Validate boot behavior, firmware update strategy, and display timing on first prototype hardware.
Recomendado
Programmable Logic Controller
The LPC1813JET100E is appropriate for compact programmable logic controller modules that need deterministic control, communications, and local data storage in a single package. Its 180 MHz ARM Cortex-M3 core and 512 KB of flash support real-time tasks, protocol handling, diagnostics, and configuration logic. The 3.3 V operating class is compatible with common industrial digital interfaces when suitable isolation and protection are added. A robust Ethernet connection through LAN8742-CZ-TR can link the controller to supervisory software, while USB may simplify service access. Firmware architecture should isolate time-critical control tasks from network and update workloads, and memory usage should be checked against the device's exact SRAM allocation. The fine-pitch TFBGA package reduces board footprint but increases assembly and inspection requirements, making a proven footprint and manufacturing process important.
Recomendado
Connected Consumer Control Module
The LPC1813JET100E can support connected consumer equipment where a compact controller must combine user interfaces, USB connectivity, and network capability. Its 180 MHz Cortex-M3 core provides ample headroom for control tasks, status rendering, and communication protocols, while 512 KB of embedded flash accommodates application and update logic. USB2514BI-AEZG can be used where multiple internal USB functions require a hub. The design must manage USB enumeration, firmware updates, recovery after interrupted writes, and thermal performance within the enclosure. Because the MCU uses a 100-pin TFBGA package, component placement should account for assembly access, thermal spreading, and antenna or connector clearance where applicable. Check the exact USB and display pin assignments and confirm the required operating-temperature grade for the product's intended environment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC1813JET100E — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC1812JET100E | LPC1822JET100E | LPC1823JET100E | LPC1837JET100E | LPC1831JET100E |
|---|---|---|---|---|---|---|
| Package | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Processor Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Diferenciadores clave
- Balanced 512 KB flash configuration in the LPC18xx family (frente a LPC1837JET100E)
- Direct 180 MHz Cortex-M3 processing platform (frente a LPC1822JET100E)
- Connected-device integration in a 100-pin 9 x 9 mm TFBGA (frente a LPC1812JET100E)
Notas de diseño
Treat the 100-pin TFBGA as a fine-pitch assembly constraint rather than a generic IC footprint. Use the NXP land pattern, verify the PCB stack-up, and preserve escape-routing space from the package center. Place decoupling capacitors at the corresponding supply pins and route each ground connection directly into the relevant plane. Prototype assembly and X-ray inspection are advisable because hidden solder joints and package warpage can create electrical faults that are difficult to diagnose from board-level tests alone.
Assign every external function from the complete manufacturer pin-description table. The LPC18xx family supports multiple multiplexing options, so a peripheral signal may move between pins or acquire different electrical requirements across related devices. Before releasing a PCB intended for a substitute, compare all used pins, analog functions, debug signals, reset connections, and clock inputs. This check is especially important for the LPC1837JET100E because its 1 MB flash changes firmware capacity rather than the package footprint.
Create separate distribution paths for the digital supply, analog-related supply domains, and any external interface reference supplies, following the NXP reference schematic. Confirm the exact core and I/O voltage limits in the datasheet before selecting regulators or bias levels. Place bulk capacitance near the power-entry point, high-frequency bypass capacitance at each device supply ball, and test the assembled board for droop during Ethernet, USB, and LCD activity. Startup sequencing must also be checked if any peripheral rail depends on a controlled supply.
Do not treat equal package dimensions as proof that two LPC18xx devices are interchangeable. A valid substitution also requires agreement among CPU frequency, flash and SRAM capacity, pin multiplexing, clock architecture, peripheral availability, startup behavior, and package-ball assignments. Program a bootloader that can identify the exact device and validate the primary communication paths after firmware replacement. For the LPC1837JET100E, the 512 KB to 1 MB flash increase changes the memory map and may require a revised linker configuration.
Información de cumplimiento
No explicit environmental or material-compliance declaration was found for the exact LPC1813JET100E order code. AEC-Q100 qualification is not indicated for this general-purpose microcontroller order code.
