LPC55S28JBD64Y - 150MHz Cortex-M33, 512KB Flash MCU | NXP
N.º de pieza: LPC55S28JBD64Y ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.26 | $52,60 |
| 100 | $4.68 | $468,00 |
| 500 | $4.22 | $2.110,00 |
| 1.000 | $3.8 | $3.800,00 |
LPC55S28JBD64Y Descripción general
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, non-volatile program memory, SRAM, and peripherals such as UART, SPI, I2C, and USB into one package. Within the embedded-systems hierarchy, the MCU sits below application processors but above simple logic devices, and belongs to NXP's LPC5500 family within the broader EdgeVerse edge-computing platform, itself a descendant of the general-purpose ARM Cortex-M microcontroller lineage.
Key differentiating features of the LPC55S28JBD64Y include the ARMv8-M mainline Cortex-M33 core with a Memory Protection Unit (MPU), a built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The device is fabricated on a cost-effective 40-nm NVM process technology and offers Flexcomm serial connectivity with I2C, SPI, UART/USART, SDIO, and USB interfaces.
Technically, the LPC55S2x/S2x family is pin-, software- and peripheral-compatible across members, which the vendor cites as accelerating time to market. NXP's datasheet documentation details the Cortex-M33 core at revision r0p3, confirming secure ARMv8-M architecture suitable for TrustZone-style secure development workflows. The 512 KB flash allows complex firmware stacks, while the 150 MHz clock supports demanding real-time control and signal-processing workloads.
Typical applications include industrial automation and control nodes, IoT edge devices requiring secure boot and encrypted communication, and consumer embedded products such as smart accessories and battery-powered systems, where the LPC55S28's low power consumption and flexible serial connectivity provide a strong fit.
A key design consideration: the 'Y' ordering suffix denotes tape-and-reel packaging for automated assembly, while the otherwise-identical 'K' variant ships in trays; both share the same 64-HTQFP footprint, so pick based on your production line's feeding method.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes beyond the manufacturer datasheet, giving engineers a single decision-ready reference.
Alternativas directas para LPC55S28JBD64Y — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC55S28JBD64Y (mismo factor de forma y huella) — difiere en Package, Core Processor, Mounting Type, Process Technology, Connectivity.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LPC55S28JBD64K
✅ Sustitución directa✓ En stock
$3.6 / unidad
Ver hoja de datos →LPC55S26JBD64Y
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →LPC55S69JBD64Y
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC5528JBD64
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
LPC55S28JBD64Y Valores máximos y características eléctricas
| Core Processor | ARM Cortex-M33 |
| Core Size | 32-bit |
| Core Revision | r0p3 |
| Frecuencia de reloj máxima | 150 MHz |
| Flash Memory | 512 KB (512K x 8) |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB |
| Memory Protection Unit (MPU) | Yes |
| Interrupt Controller | NVIC (built-in) |
| NMI Input | Yes, with selectable sources |
| Encapsulado | 64-HTQFP (10x10 mm), Square |
| Terminal Form | Gull Wing |
| Number of Terminals | 64 |
| Tipo de montaje | Surface Mount |
| Temperature Grade | Industrial |
| Process Technology | 40 nm NVM |
| Product Family | LPC55S2x (EdgeVerse platform) |
| Packaging Suffix | Y = Tape & Reel |
Guía de configuración de pines de LPC55S28JBD64Y 64-htqfp (10x10 mm), square
Configuración de pines para LPC55S28JBD64Y (encapsulado 64-htqfp (10x10 mm), square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC55S28JBD64Y.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC55S28JBD64Y es adecuado para 6 aplicacións: Industrial Automation and Control, IoT Edge Devices, Secure Connected Consumer Products, Embedded USB Device Applications, Data Acquisition and Sensor Hubs, Battery-Powered Portable Instruments.
Industrial Automation and Control
The LPC55S28JBD64Y fits industrial control nodes because its 150 MHz Cortex-M33 core with MPU provides deterministic execution and memory isolation for real-time control loops, while the industrial temperature grade suits factory-floor environments. Its Flexcomm architecture flexibly assigns serial blocks as I2C, SPI, or UART/USART to talk to PLC I/O, motor drivers, and HMI panels, with the NMI input giving fast fault handling for safety interlocks. The 512 KB flash stores protocol stacks and firmware update images, and the built-in USB interface simplifies field configuration and diagnostics without extra bridge ICs.
Recomendado
IoT Edge Devices
For IoT edge nodes, the LPC55S28JBD64Y aligns on three parameters: the 150 MHz Cortex-M33 delivers enough headroom for TLS encryption and sensor fusion, the 512 KB flash holds secure bootloaders plus connectivity stacks, and the 40-nm NVM process keeps active power low for battery-powered designs. NXP explicitly places the LPC552x/S2x family in its EdgeVerse edge-computing platform for this use case. The selectable-source NMI and MPU support fault-tolerant operation, while Flexcomm ports adapt to Wi-Fi/BLE modules over UART or SPI, and SDIO supports storage expansion for local data logging.
Recomendado
Secure Connected Consumer Products
Consumer connected accessories benefit from the LPC55S28JBD64Y's balance of cost and capability: a single 150 MHz ARMv8-M core runs application firmware plus a secure boot flow, and the S-series security subset supports key storage and cryptographic operations needed for cloud pairing. Peripherals cover capacitive-touch, display (via SPI/SDIO), and USB interfaces in one 64-HTQFP 10x10 mm footprint, keeping BOM count low. The 512 KB flash accommodates feature-rich consumer firmware, and the pin-compatible family lets product tiers share one PCB with the LPC55S26 or LPC55S69 for cost or feature scaling.
Recomendado
Embedded USB Device Applications
The on-chip USB controller of the LPC55S28JBD64Y makes it a strong fit for USB device-class products such as custom HID devices, virtual COM-port instruments, and firmware-update dongles. Running at 150 MHz, the Cortex-M33 comfortably services USB interrupt traffic while executing application logic, and the Flexcomm UART/SPI ports link the MCU to sensors or FPGAs behind the USB facade. The 512 KB flash retains bootloader and descriptor images, enabling field firmware upgrades over USB, a common requirement for professional equipment and developer tools in the 64-HTQFP form factor.
Recomendado
Data Acquisition and Sensor Hubs
As a sensor hub, the LPC55S28JBD64Y aggregates multiple sensor streams through its Flexcomm serial blocks configured as SPI or I2C masters, timed by the 150 MHz core with DMA-style throughput aided by NVIC-managed interrupts. The 512 KB flash supports local calibration tables, linearization code, and logging buffers, while the MPU isolates safety-critical code from data-handling tasks. The NMI input provides immediate response to over-range or watchdog fault conditions. Industrial temperature grading keeps the part reliable in outdoor and uncontrolled-environment sensor deployments where consumer-grade MCUs drift or fail.
Recomendado
Battery-Powered Portable Instruments
Portable instruments leverage the LPC55S28JBD64Y's low-power 40-nm process and 150 MHz performance-on-demand: the core runs at full speed for measurement bursts and idles between readings to extend battery life. The 512 KB flash stores instrument firmware, UI assets, and logged datasets, while the SDIO-capable Flexcomm block writes to storage cards for data export. USB on-chip enables charging and PC connectivity without a separate controller. The industrial temperature grade also covers ruggedized handhelds used in field service, where consumer parts would violate operating-range requirements during thermal extremes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC55S28JBD64Y — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC55S28JBD64K | LPC55S26JBD64Y | LPC55S69JBD64Y | LPC5528JBD64 |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M33 (r0p3), single core | ARM Cortex-M33, single core | ARM Cortex-M33, single core | ARM Cortex-M33, dual core | ARM Cortex-M33, single core |
| Max Clock Frequency | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Same peripheral set | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Flexcomm, I2C, SDIO, SPI, UART/USART, USB | Flexcomm, I2C, SPI, UART/USART, USB |
Diferenciadores clave
- 512 KB flash in the lowest-cost single-core tier (frente a LPC55S26JBD64Y)
- Lower cost than dual-core for single-core workloads (frente a LPC55S69JBD64Y)
- Tape-and-reel delivery for high-volume assembly (frente a LPC55S28JBD64K)
Notas de diseño
The 64-HTQFP (10x10 mm) gull-wing package requires a standard 0.5 mm pitch land pattern; verify against the NXP footprint recommendation in the family datasheet before release. Because the entire LPC552x/S2x family is pin-compatible, design the PCB so any family member (LPC55S26, LPC55S28, LPC55S69) can be fitted - this costs nothing at layout time and preserves a sourcing escape path. Use a solid ground plane under the chip and connect the exposed center thermal pattern per NXP layout guidelines for best signal integrity.
Provide clean, decoupled supplies per the family datasheet power-domain diagram, placing 100 nF ceramic capacitors at each supply pin pair plus one bulk capacitor per rail, as close to the pins as possible. With a 40-nm core running at 150 MHz, core supply integrity directly affects maximum achievable clock frequency; poor decoupling typically manifests as intermittent failures near the top of the frequency range rather than outright non-start. Route analog supply domains separately from digital per NXP reference designs for the LPC55xx family.
Do not confuse the ordering suffixes: JBD64Y is tape-and-reel and JBD64K is tray - mixing them in procurement changes packaging, not function, but automated lines cannot use tray-only feed. Also confirm flash capacity needs before choosing the LPC55S26 as a cost-down: its smaller flash is the primary functional difference versus this 512 KB part. Finally, when migrating firmware to the LPC55S69, dual-core code will not run on this single-core LPC55S28, so abstract peripheral drivers from core-specific services from day one.
Información de cumplimiento
Compliance details not present in the provided web data. NXP's official product page lists an Environmental Quality section for LPC55S28JBD64; consult it directly for RoHS/REACH status.
