LPC55S69JBD100 - Dual-Core Cortex-M33 150MHz MCU, 640KB Flash, HLQFP-100 | NXP
N.º de pieza: LPC55S69JBD100 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $11.5 | $11,50 |
| 10 | $10.35 | $103,50 |
| 100 | $9.2 | $920,00 |
| 500 | $8.45 | $4.225,00 |
| 1.000 | $7.65 | $7.650,00 |
LPC55S69JBD100 Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), data memory (SRAM), and a rich set of peripherals on one silicon die. Modern Cortex-M MCUs sit in the taxonomy of microcontrollers -> embedded processors -> microcomputer ICs -> semiconductor devices. They are distinguished from microprocessors (MPUs) by their integrated memory and I/O, enabling single-chip system designs without external flash or RAM. The LPC55S6x family targets secure, connected edge applications, where deterministic real-time control meets advanced cryptography.
Key features of the LPC55S69JBD100 include TrustZone-M isolation for secure/non-secure firmware partitioning, an integrated Floating Point Unit (FPU) and Memory Protection Unit (MPU), a PowerQuad hardware accelerator (for CMSIS-DSP, FIR, matrix, and FFT operations), a CASPER cryptographic co-processor, USB High-Speed with on-chip PHY, Flexcomm serial peripherals (configurable as USART/SPI/I2C), SDIO, 32-bit counters/timers, SCTimer/PWM, PLU (Programmable Logic Unit), and a 16-bit 1.0 Msamples/sec ADC. The 100-pin HLQFP package provides ample GPIO while remaining hand-solderable.
The dual-core architecture lets CPU1 act as a low-power sensor-hub co-processor offloading always-on tasks from CPU0, while PowerQuad accelerates signal-processing workloads without CPU cycles. TrustZone-M, CASPER hardware crypto, secure boot, and immutable root-of-trust make the device suitable for PSA Certified Level 1+ applications.
Typical applications include IoT edge nodes, secure connected sensors, USB-C audio devices, HMI panels, and motor-control subsystems requiring floating-point performance. The USB High-Speed PHY simplifies USB-C and USB-IF-compliant designs without an external PHY. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
When designing with this device, carefully review the LPC55(S)xx hardware design guidelines (NXP application note AN13033) for decoupling, USB PHY impedance control, and TrustZone pin assignments that cannot be repurposed after secure provisioning. Ensure external flash wait-states are configured if QSPI is used at high speed.
Alternativas directas para LPC55S69JBD100 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC55S69JBD100 (mismo factor de forma y huella) — difiere en Operating Temperature, Security.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LPC55S66JBD100
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC55S69JBD100K
✅ Sustitución directa✓ En stock
$4.12 / unidad
Ver hoja de datos →LPC55S69JBD64
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC55S69JEV98
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPCS66JBD100
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC55S69JBD100 Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M33 dual-core (CPU0 + M33 coprocessor) |
| Maximum CPU Frequency | 150 MHz (device revision 1B) |
| Instruction Set | Armv8-M with TrustZone-M, FPU, MPU |
| On-Chip Flash | 640 KB |
| On-Chip SRAM | 320 KB |
| Encapsulado | 100-pin HLQFP (14x14 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40 C to +105 C |
| USB | USB High-Speed with on-chip PHY |
| ADC | 16-bit, 1.0 Msamples/sec |
| Serial Peripherals | Flexcomm Interface (USART/SPI/I2C configurable) |
| Storage I/O | SDIO interface |
| Timers | 32-bit counters/timers, SCTimer/PWM |
| Programmable Logic | PLU (Programmable Logic Unit) |
| Hardware Accelerators | PowerQuad (DSP), CASPER (crypto) |
| Security | TrustZone-M, secure boot, root-of-trust |
| Estado RoHS | Compliant |
Guía de configuración de pines de LPC55S69JBD100 100-pin hlqfp (14x14 mm)
Configuración de pines para LPC55S69JBD100 (encapsulado 100-pin hlqfp (14x14 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC55S69JBD100.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC55S69JBD100 es adecuado para 6 aplicacións: Secure IoT Edge Nodes, USB-C Audio Devices, Human-Machine Interface (HMI) Panels, Industrial Motor Control, Secure Connected Sensors, USB-C Power Delivery Controllers.
Secure IoT Edge Nodes
The LPC55S69JBD100 is well-suited for secure IoT edge nodes where TrustZone-M isolation, CASPER hardware crypto, and 150 MHz dual-core throughput converge. Its 640 KB flash accommodates TLS stacks, OTA update partitions, and application firmware while keeping secrets in TrustZone-protected secure regions. The dual-core layout lets CPU1 handle always-on sensor polling at low power while CPU0 runs the connected Linux-style application stack, optimizing total energy per task.
Recomendado
USB-C Audio Devices
The integrated USB High-Speed PHY with on-chip transceiver makes the LPC55S69JBD100 ideal for USB-C audio peripherals such as USB headsets, DACs, and audio interfaces. The 150 MHz Cortex-M33 with FPU executes real-time audio mixing and DSP effects, while PowerQuad accelerates FIR filters and FFT analysis at low CPU overhead. The 640 KB flash stores USB audio class drivers, firmware, and DSP coefficient tables, with 320 KB SRAM serving as audio buffer memory.
Recomendado
Human-Machine Interface (HMI) Panels
For industrial HMI panels, the LPC55S69JBD100's Cortex-M33 with FPU drives TFT LCD controllers via Flexcomm-configurable SPI, runs touch-sensor scanning on CPU1, and serves responsive graphics on CPU0. The 16-bit 1 Msps ADC handles analog front-end sensing for slider/wheel inputs, while SCTimer/PWM drives backlight dimming and status LEDs. TrustZone-M isolates the secure firmware-update channel from the user-facing UI code.
Recomendado
Industrial Motor Control
The LPC55S69JBD100 targets sensorless and FOC motor control with SCTimer/PWM for high-resolution center-aligned PWM outputs, the 1 Msps 16-bit ADC for back-EMF sampling, and PowerQuad accelerating Park/Clarke transforms in real time. Dual-core isolation lets CPU0 handle communication (CAN, USB, Flexcomm) while CPU1 runs the deterministic control loop at fixed cycle times, ensuring low jitter under heavy peripheral load.
Recomendado
Secure Connected Sensors
Battery-powered secure connected sensors benefit from the LPC55S69JBD100's dual-core architecture: CPU1 stays in low-power polling mode reading I2C sensors like the HDC1080DMBR, waking CPU0 only for BLE/Wi-Fi transmissions. TrustZone-M protects calibration certificates and signed firmware updates, while CASPER hardware crypto accelerates TLS handshakes without CPU overhead. 640 KB flash supports full TLS stacks with certificate caching.
Recomendado
USB-C Power Delivery Controllers
The LPC55S69JBD100's USB High-Speed PHY and rich Flexcomm peripherals make it an excellent USB-C PD controller host, negotiating power contracts over USB-C CC lines while monitoring VBUS through the 16-bit ADC. TrustZone-M protects USB-PD authentication certificates from cloned-charger attacks, while the Cortex-M33's deterministic interrupt latency ensures fast PD messaging. 640 KB flash holds the full USB-PD 3.1 stack.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC55S69JBD100 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC55S66JBD100 | LPC55S69JBD100K | LPC55S69JBD64 | LPC55S69JEV98 | LPCS66JBD100 |
|---|---|---|---|---|---|---|
| Package | 100-pin HLQFP (14x14 mm) | 100-pin HLQFP (14x14 mm) - same | 100-pin HLQFP (14x14 mm) - same | 64-pin package - different | VFBGA-98 - different | 100-pin HLQFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | Dual Cortex-M33 (CPU0 + CPU1) | Dual Cortex-M33 | Dual Cortex-M33 (same die) | Dual Cortex-M33 | Dual Cortex-M33 (same die) | Dual Cortex-M33 |
| Max Frequency | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz | 150 MHz |
| USB HS PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| TrustZone-M | Yes | Yes | Yes | Yes | Yes | Yes (limited) |
Diferenciadores clave
- Dual-core Cortex-M33 with CPU1 co-processor for low-power offload (frente a Single-core Cortex-M33 MCUs)
- TrustZone-M + CASPER hardware crypto accelerators (frente a LPC546xx (no TrustZone-M))
- Integrated USB High-Speed PHY (480 Mbps) (frente a MCUs requiring external ULPI PHY)
Notas de diseño
Estimated: at 150 MHz dual-core operation with all peripherals enabled, the LPC55S69JBD100 consumes approximately 60-80 mA active current per NXP datasheet figures; in deep power-down it drops below 10 uA. When designing battery-powered applications, use CPU1 for always-on sensor polling at <1 MHz to keep CPU0 powered down. Decouple each VDD/VSS pair with 100 nF ceramic as close to the pins as possible plus a bulk 4.7 uF on each voltage rail.
The USB High-Speed PHY requires 90-character differential traces for D+/D- with matched length within 150 mil. Per NXP application note AN13033 (LPC55(S)xx hardware design guidelines), keep USB traces short, route over a continuous ground plane, and place the ESD protection array within 3 mm of the USB connector. Maintain 4-layer PCB stackup with dedicated ground and power planes for best SI/EMI performance on the 480 Mbps USB signals.
TrustZone-M pin assignments are irrevocable after secure provisioning. According to NXP documentation, plan your secure pin selection early in PCB layout because changing secure GPIO functions requires full re-provisioning with new debug certificates. Expose SWDIO/SWCLK pins to a 10-pin or 20-pin Cortex Debug connector for production programming and field recovery.
Do not skip the external 32.768 kHz crystal for RTC operation - internal RC oscillator drift exceeds RTC accuracy requirements. Configure QSPI flash wait-states when using high-speed external flash above 50 MHz SCK. When migrating from LPC546xx or LPC54S0xx, the Flexcomm peripheral multiplexing differs - the I2C pin assignment is not identical. Validate full peripheral driver compatibility before board bring-up.
Información de cumplimiento
RoHS compliant per NXP product page. AEC-Q100 qualification not specified - this is an industrial-grade part, not automotive-grade.
