NXP Semiconductors

LPC55S69JBD100 - Dual-Core Cortex-M33 150MHz MCU, 640KB Flash, HLQFP-100 | NXP

Teilenummer: LPC55S69JBD100 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
100-pin HLQFP (14x14 mm) Package 150 MHz (device revision 1B) Speed 640 KB Memory
Ab $7.65 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-08
Mengenpreise
Menge Stückpreis Gesamt
1 $11.5 $11,50
10 $10.35 $103,50
100 $9.2 $920,00
500 $8.45 $4.225,00
1.000 $7.65 $7.650,00
ℹ️ Alle Preise sind in USD

LPC55S69JBD100 Übersicht

The NXP Semiconductors LPC55S69JBD100 is a dual-core ARM Cortex-M33 microcontroller built on the Armv8-M architecture, integrating a primary CPU0 (r0p3) and an M33 coprocessor (CPU1) running up to 150 MHz, with 640 KB on-chip flash and 320 KB SRAM, in a 100-pin HLQFP package (14x14 mm).

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), data memory (SRAM), and a rich set of peripherals on one silicon die. Modern Cortex-M MCUs sit in the taxonomy of microcontrollers -> embedded processors -> microcomputer ICs -> semiconductor devices. They are distinguished from microprocessors (MPUs) by their integrated memory and I/O, enabling single-chip system designs without external flash or RAM. The LPC55S6x family targets secure, connected edge applications, where deterministic real-time control meets advanced cryptography.

Key features of the LPC55S69JBD100 include TrustZone-M isolation for secure/non-secure firmware partitioning, an integrated Floating Point Unit (FPU) and Memory Protection Unit (MPU), a PowerQuad hardware accelerator (for CMSIS-DSP, FIR, matrix, and FFT operations), a CASPER cryptographic co-processor, USB High-Speed with on-chip PHY, Flexcomm serial peripherals (configurable as USART/SPI/I2C), SDIO, 32-bit counters/timers, SCTimer/PWM, PLU (Programmable Logic Unit), and a 16-bit 1.0 Msamples/sec ADC. The 100-pin HLQFP package provides ample GPIO while remaining hand-solderable.

The dual-core architecture lets CPU1 act as a low-power sensor-hub co-processor offloading always-on tasks from CPU0, while PowerQuad accelerates signal-processing workloads without CPU cycles. TrustZone-M, CASPER hardware crypto, secure boot, and immutable root-of-trust make the device suitable for PSA Certified Level 1+ applications.

Typical applications include IoT edge nodes, secure connected sensors, USB-C audio devices, HMI panels, and motor-control subsystems requiring floating-point performance. The USB High-Speed PHY simplifies USB-C and USB-IF-compliant designs without an external PHY. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

When designing with this device, carefully review the LPC55(S)xx hardware design guidelines (NXP application note AN13033) for decoupling, USB PHY impedance control, and TrustZone pin assignments that cannot be repurposed after secure provisioning. Ensure external flash wait-states are configured if QSPI is used at high speed.

Drop-in-Alternativen für LPC55S69JBD100 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit LPC55S69JBD100 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Security.

NXP Semiconductors
Operating Temperature: -40C to +105C
Security: TrustZone-M, secure boot, PRINCE, TRNG, CASPER
Vergleichen mit LPC55S69JBD100 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

LPC55S66JBD100

✅ Drop-In
📦 100-pin HLQFP (14x14)
Same HLQFP-100 package and pinout, reduced flash/SRAM vs S69 variant

📋 Referenzalternative (nicht im Katalog)

LPC55S69JBD100K

✅ Drop-In
NXP Semiconductors
📦 100-pin HLQFP (14x14)
Dual ARM Cortex-M33 (Armv8-M) · 150 MHz · 640 KB (640K x 8) · 320 KB · 100-pin HLQFP (14x14 mm) · Surface Mount · S-PQFP-G100 · -40C to +105C

✓ Auf Lager

$4.12 / Stück

Datenblatt ansehen →

LPC55S69JBD64

✅ Drop-In
📦 64-pin package
Same Cortex-M33 dual-core architecture, reduced pin count package (HLQFP-64 vs HLQFP-100)

📋 Referenzalternative (nicht im Katalog)

LPC55S69JEV98

✅ Drop-In
📦 VFBGA-98 (7x7)
Same die, VFBGA-98 BGA package with reduced footprint vs HLQFP-100

📋 Referenzalternative (nicht im Katalog)

LPCS66JBD100

✅ Drop-In
📦 100-pin HLQFP (14x14)
LPC55S66 family member (non-secure variant), same HLQFP-100 pinout, reduced security features

📋 Referenzalternative (nicht im Katalog)

LPC55S69JBD100 Grenzwerte & elektrische Eigenschaften

Core Architecture ARM Cortex-M33 dual-core (CPU0 + M33 coprocessor)
Maximum CPU Frequency 150 MHz (device revision 1B)
Instruction Set Armv8-M with TrustZone-M, FPU, MPU
On-Chip Flash 640 KB
On-Chip SRAM 320 KB
Gehäuse 100-pin HLQFP (14x14 mm)
Montageart Surface Mount
Betriebstemperatur -40 C to +105 C
USB USB High-Speed with on-chip PHY
ADC 16-bit, 1.0 Msamples/sec
Serial Peripherals Flexcomm Interface (USART/SPI/I2C configurable)
Storage I/O SDIO interface
Timers 32-bit counters/timers, SCTimer/PWM
Programmable Logic PLU (Programmable Logic Unit)
Hardware Accelerators PowerQuad (DSP), CASPER (crypto)
Security TrustZone-M, secure boot, root-of-trust
RoHS-Status Compliant

LPC55S69JBD100 100-pin hlqfp (14x14 mm) Pinbelegungsleitfaden

Pinbelegung für LPC55S69JBD100 (100-pin hlqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für LPC55S69JBD100 im 100-pin hlqfp (14x14 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für LPC55S69JBD100.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

LPC55S69JBD100 ist geeignet für 6 Anwendungs: Secure IoT Edge Nodes, USB-C Audio Devices, Human-Machine Interface (HMI) Panels, Industrial Motor Control, Secure Connected Sensors, USB-C Power Delivery Controllers.

🧩

Secure IoT Edge Nodes

The LPC55S69JBD100 is well-suited for secure IoT edge nodes where TrustZone-M isolation, CASPER hardware crypto, and 150 MHz dual-core throughput converge. Its 640 KB flash accommodates TLS stacks, OTA update partitions, and application firmware while keeping secrets in TrustZone-protected secure regions. The dual-core layout lets CPU1 handle always-on sensor polling at low power while CPU0 runs the connected Linux-style application stack, optimizing total energy per task.

🎧

USB-C Audio Devices

The integrated USB High-Speed PHY with on-chip transceiver makes the LPC55S69JBD100 ideal for USB-C audio peripherals such as USB headsets, DACs, and audio interfaces. The 150 MHz Cortex-M33 with FPU executes real-time audio mixing and DSP effects, while PowerQuad accelerates FIR filters and FFT analysis at low CPU overhead. The 640 KB flash stores USB audio class drivers, firmware, and DSP coefficient tables, with 320 KB SRAM serving as audio buffer memory.

📺

Human-Machine Interface (HMI) Panels

For industrial HMI panels, the LPC55S69JBD100's Cortex-M33 with FPU drives TFT LCD controllers via Flexcomm-configurable SPI, runs touch-sensor scanning on CPU1, and serves responsive graphics on CPU0. The 16-bit 1 Msps ADC handles analog front-end sensing for slider/wheel inputs, while SCTimer/PWM drives backlight dimming and status LEDs. TrustZone-M isolates the secure firmware-update channel from the user-facing UI code.

🏭

Industrial Motor Control

The LPC55S69JBD100 targets sensorless and FOC motor control with SCTimer/PWM for high-resolution center-aligned PWM outputs, the 1 Msps 16-bit ADC for back-EMF sampling, and PowerQuad accelerating Park/Clarke transforms in real time. Dual-core isolation lets CPU0 handle communication (CAN, USB, Flexcomm) while CPU1 runs the deterministic control loop at fixed cycle times, ensuring low jitter under heavy peripheral load.

🧩

Secure Connected Sensors

Battery-powered secure connected sensors benefit from the LPC55S69JBD100's dual-core architecture: CPU1 stays in low-power polling mode reading I2C sensors like the HDC1080DMBR, waking CPU0 only for BLE/Wi-Fi transmissions. TrustZone-M protects calibration certificates and signed firmware updates, while CASPER hardware crypto accelerates TLS handshakes without CPU overhead. 640 KB flash supports full TLS stacks with certificate caching.

⚡

USB-C Power Delivery Controllers

The LPC55S69JBD100's USB High-Speed PHY and rich Flexcomm peripherals make it an excellent USB-C PD controller host, negotiating power contracts over USB-C CC lines while monitoring VBUS through the 16-bit ADC. TrustZone-M protects USB-PD authentication certificates from cloned-charger attacks, while the Cortex-M33's deterministic interrupt latency ensures fast PD messaging. 640 KB flash holds the full USB-PD 3.1 stack.

What is the core architecture of LPC55S69JBD100?
The LPC55S69JBD100 uses a dual-core ARM Cortex-M33 implementation built on the Armv8-M architecture with TrustZone-M, an integrated Floating Point Unit (FPU), and a Memory Protection Unit (MPU). According to the NXP product page, CPU0 runs at up to 150 MHz on device revision 1B, while CPU1 is an M33 co-processor used as a low-power offload engine. This dual-core configuration enables real-time secure/non-secure partitioning critical for PSA-Certified edge devices.
How much flash and SRAM does LPC55S69JBD100 have?
The LPC55S69JBD100 integrates 640 KB of on-chip flash and 320 KB of on-chip SRAM, per NXP datasheet summary. This memory is shared between CPU0 and CPU1, with TrustZone-M controlling secure/non-secure access regions. For applications needing more storage, the device supports external QSPI flash expansion up to the QSPI controller's maximum addressable range.
Does LPC55S69JBD100 have a built-in USB High-Speed PHY?
Yes. The LPC55S69JBD100 integrates a USB High-Speed on-chip PHY, eliminating the need for an external ULPI PHY chip. According to the NXP datasheet, this reduces BOM cost and PCB area for USB-C and USB-IF-compliant designs. The PHY supports USB 2.0 High-Speed (480 Mbps) and is paired with USB-FS device/host controllers on the same USB stack.
What security features does LPC55S69JBD100 provide?
The LPC55S69JBD100 includes TrustZone-M for hardware-isolated secure/non-secure firmware partitioning, a CASPER cryptographic co-processor for AES/SHA/RSA/ECC acceleration, immutable secure boot, and a root-of-trust key store. According to NXP product documentation, this combination supports PSA Certified Level 1+ security profiles and is suitable for secure element-adjacent applications in IoT edge nodes.
What is the package of LPC55S69JBD100?
The LPC55S69JBD100 ships in a 100-pin HLQFP package measuring 14x14 mm with 0.5 mm pitch, per NXP product page and DigiKey listing. The 100-pin HLQFP is hand-solderable and offers ample GPIO for typical embedded designs. The exposed thermal pad aids heat dissipation under high CPU loads.
Where can I buy LPC55S69JBD100 and what is the price?
The LPC55S69JBD100 is available from authorized distributors including DigiKey (as LPC55S69JBD100K with K denoting 1000-piece reel packaging) and Mouser, as of 2026-10-08. Unit pricing at qty 1 is approximately $11.50, dropping to $7.65 at qty 1000. XAIPART also stocks this part with same-day dispatch options; request a quote through the product page for current stock.
What is the lead time for LPC55S69JBD100?
Lead time for the LPC55S69JBD100 as of 2026-10-08 is typically 6-12 weeks from NXP authorized distributors, with DigiKey and Mouser often carrying factory stock of the K (reel) variant. For urgent prototyping needs, in-stock reels at XAIPART enable same-day shipping. Always confirm current lead time before placing production orders, as 2025-2026 MCU supply remains constrained.
Is LPC55S69JBD100 in stock right now?
Stock availability for the LPC55S69JBD100 as of 2026-10-08 varies by distributor: DigiKey lists factory stock with multi-week lead times, Mouser stocks both tray and reel variants, and XAIPART holds in-stock reels of LPC55S69JBD100K. The underlying NXP production status is active, but allocation through 2026 Q4 remains tight due to broader Cortex-M MCU demand.
LPC55S69JBD100 vs LPC55S66JBD100 - which is better?
The LPC55S69JBD100 and LPC55S66JBD100 share the same HLQFP-100 package and pinout (drop-in compatible), but differ in memory: the S69 variant includes 640 KB flash and 320 KB SRAM, while the S66 variant ships with reduced memory. Choose S69 for full memory headroom; choose S66 only when the smaller memory is sufficient for your firmware. Both have identical peripherals and security features.
What is the difference between LPC55S69JBD100 and LPC55S69JBD64?
The LPC55S69JBD100 ships in a 100-pin HLQFP package (14x14 mm) with maximum GPIO count, while the LPC55S69JBD64 ships in a 64-pin package with reduced pin count and fewer exposed peripherals. Both share the same dual-core Cortex-M33 architecture, 640 KB flash, and 320 KB SRAM. Choose JBD100 when full peripheral access is needed, JBD64 when PCB area is constrained.
What is the best drop-in replacement for LPC55S69JBD100?
The closest drop-in replacements for the LPC55S69JBD100 are other LPC55S6x family members in HLQFP-100: LPC55S66JBD100 (same package/pinout, reduced memory) and LPC55S69JBD100K (tape-and-reel packaging variant). Both share the identical HLQFP-100 footprint and pinout, enabling PCB reuse without rework. For non-NXP alternatives, cross-brand drop-ins in HLQFP-100 are not available in our verified data.
Can STM32H5 series replace LPC55S69JBD100?
The STM32H5 series from STMicroelectronics is a functional alternative but not a true drop-in replacement for the LPC55S69JBD100. While both use Cortex-M33 with TrustZone-M, the STM32H5 ships in different LQFP packages and pin counts that require PCB rework. Engineers migrating between these families must re-route the PCB layout, rewrite HAL drivers, and re-validate security provisioning flow.
Where to download LPC55S69JBD100 datasheet PDF?
The LPC55S69JBD100 datasheet PDF can be downloaded directly from the NXP product page at https://www.nxp.com/docs/en/data-sheet/LPC55S6x.pdf, or through Octopart's datasheet repository. According to the NXP datasheet bank, the document is 135 pages and covers electrical characteristics, peripheral configuration, and TrustZone-M programming. For hardware design, also review NXP application note AN13033 (LPC55(S)xx hardware design guidelines).
Where can I find the LPC55S69JBD100 pinout?
The LPC55S69JBD100 pinout is documented in section 3 of the NXP LPC55S6x datasheet (PDF link above). The 100-pin HLQFP package follows standard QFP pin numbering: pin 1 at the top-left corner with the dot marker, pins numbered counter-clockwise around the package perimeter. Critical pins include VDD, VSS, USB_DP/DM, RESET, SWDIO/SWCLK, and multiple GPIO with Flexcomm multiplexing.
What are the key specifications of LPC55S69JBD100 that engineers should know?
The LPC55S69JBD100 key specifications per the NXP datasheet are: dual-core Cortex-M33 up to 150 MHz with TrustZone-M and FPU; 640 KB flash; 320 KB SRAM; USB High-Speed with integrated PHY; PowerQuad DSP and CASPER crypto accelerators; 16-bit 1 Msps ADC; Flexcomm serial peripherals; SDIO; SCTimer/PWM; 100-pin HLQFP 14x14 mm package; -40C to +105C operating range. These specs make it well-suited for secure, connected edge IoT designs.

Technische Referenzdaten für LPC55S69JBD100 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the LPC55S69JBD100 when you need a dual-core Cortex-M33 MCU with TrustZone-M security, integrated USB High-Speed PHY, and 640 KB flash in a 100-pin HLQFP for secure connected edge designs. Choose the LPC55S66JBD100 if your firmware fits in the S66's reduced memory at lower cost. Choose the LPC55S69JBD64 when PCB area is constrained and you accept fewer GPIO. Choose the LPC55S69JEV98 for the smallest footprint in BGA packaging. For non-NXP migration to STM32H5 or RA6M5, plan for PCB rework, HAL rewrite, and security re-provisioning - these are functional alternatives, not drop-in parts.

Vergleich mit Alternativen

Parameter Dieses Produkt LPC55S66JBD100 LPC55S69JBD100K LPC55S69JBD64 LPC55S69JEV98 LPCS66JBD100
Package 100-pin HLQFP (14x14 mm) 100-pin HLQFP (14x14 mm) - same 100-pin HLQFP (14x14 mm) - same 64-pin package - different VFBGA-98 - different 100-pin HLQFP (14x14 mm) - same
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Core Dual Cortex-M33 (CPU0 + CPU1) Dual Cortex-M33 Dual Cortex-M33 (same die) Dual Cortex-M33 Dual Cortex-M33 (same die) Dual Cortex-M33
Max Frequency 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz 150 MHz
USB HS PHY Integrated Integrated Integrated Integrated Integrated Integrated
TrustZone-M Yes Yes Yes Yes Yes Yes (limited)

Wichtigste Unterscheidungsmerkmale

  • Dual-core Cortex-M33 with CPU1 co-processor for low-power offload (vs. Single-core Cortex-M33 MCUs)
  • TrustZone-M + CASPER hardware crypto accelerators (vs. LPC546xx (no TrustZone-M))
  • Integrated USB High-Speed PHY (480 Mbps) (vs. MCUs requiring external ULPI PHY)

Designhinweise

Estimated: at 150 MHz dual-core operation with all peripherals enabled, the LPC55S69JBD100 consumes approximately 60-80 mA active current per NXP datasheet figures; in deep power-down it drops below 10 uA. When designing battery-powered applications, use CPU1 for always-on sensor polling at <1 MHz to keep CPU0 powered down. Decouple each VDD/VSS pair with 100 nF ceramic as close to the pins as possible plus a bulk 4.7 uF on each voltage rail.

The USB High-Speed PHY requires 90-character differential traces for D+/D- with matched length within 150 mil. Per NXP application note AN13033 (LPC55(S)xx hardware design guidelines), keep USB traces short, route over a continuous ground plane, and place the ESD protection array within 3 mm of the USB connector. Maintain 4-layer PCB stackup with dedicated ground and power planes for best SI/EMI performance on the 480 Mbps USB signals.

TrustZone-M pin assignments are irrevocable after secure provisioning. According to NXP documentation, plan your secure pin selection early in PCB layout because changing secure GPIO functions requires full re-provisioning with new debug certificates. Expose SWDIO/SWCLK pins to a 10-pin or 20-pin Cortex Debug connector for production programming and field recovery.

Do not skip the external 32.768 kHz crystal for RTC operation - internal RC oscillator drift exceeds RTC accuracy requirements. Configure QSPI flash wait-states when using high-speed external flash above 50 MHz SCK. When migrating from LPC546xx or LPC54S0xx, the Flexcomm peripheral multiplexing differs - the I2C pin assignment is not identical. Validate full peripheral driver compatibility before board bring-up.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per NXP product page. AEC-Q100 qualification not specified - this is an industrial-grade part, not automotive-grade.

Daten verifiziert am: 2026-10-08 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors LPC55S69JBD100 LPC55S66JBD100 LPC55S69JBD100K LPC55S69JBD64 LPC55S69JEV98 ARM Cortex-M33 Armv8-M TrustZone-M FPU MPU PowerQuad CASPER USB High-Speed Flexcomm SDIO SCTimer/PWM PLU PSA Certified HLQFP-100 surface mount RoHS USB-C USB Power Delivery IoT edge node secure boot
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