Microchip Technology

M2GL010-FG484 - 12K LEs, 233 I/O IGLOO2 FPGA | Microchip

N.º de pieza: M2GL010-FG484 ✓ Activo
En stock Se envía en 1-3 días hábiles
1.14 V to 2.625 V Vdss 484-FPBGA (23 mm x 23 mm) Package Flash Memory
Desde $22.2759 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-23
Precios por volumen
Cant. Precio unitario Total
1 $22.2759 $22,28
10 $22.2759 $222,76
100 $22.2759 $2.227,59
500 $22.2759 $11.137,95
1.000 $22.2759 $22.275,90
ℹ️ Todos los precios están en USD

M2GL010-FG484 Descripción general

The Microchip Technology M2GL010-FG484 is an IGLOO2 low-density flash field-programmable gate array with 12,084 logic elements, 933,888 RAM bits, and 233 I/Os in a 484-FPBGA package. It operates from a 1.14 V to 2.625 V supply and supports an industrial junction-temperature range of 0°C to 85°C. The device is intended for general-purpose programmable logic, bridging, I/O expansion and conversion, system management, secure connectivity, Gigabit Ethernet, and dual PCI Express control-plane functions.

An FPGA is a reconfigurable digital semiconductor whose programmable logic blocks, registers, memory, and I/O can be configured after manufacture. The IGLOO2 family belongs to the broader FPGA and CPLD hierarchy and combines nonvolatile flash configuration storage with reusable logic fabric. This makes the M2GL010-FG484 suitable for prototypes and production systems requiring deterministic parallel processing, flexible interface logic, and field-reprogrammability without using a mask change.

The verified device data identifies 233 input/output terminals, 12,084 logic elements, 933,888 total RAM bits, a 1.2 V nominal operating supply, and a 23 mm by 23 mm FPBGA package. Its 484-ball grid-array package supports high pin density for complex designs with numerous external interfaces. The M2GL010-FG484 is surface mounted and supplied in a tray according to the manufacturer product data.

The IGLOO2 architecture is designed for communications, industrial, medical, defense, and aviation applications. Its 12K logic-element density provides substantially more capacity than a small CPLD, while flash-based configuration supports stable field updates. The device can implement protocol bridges, I/O expansion, image and video processing, control-plane logic, and secure-connectivity functions when paired with suitable external interfaces and memory.

A principal design consideration is the large BGA escape-routing requirement. A PCB with 484 package balls requires careful layer-stack planning, via placement, and power delivery to preserve signal integrity and effective thermal performance. Designers should also verify speed grade, temperature grade, configuration requirements, supported I/O standards, and the exact pin assignments of the selected board revision before release.

This page consolidates verified distributor availability, manufacturer family information, technical specifications, replacement analysis, and practical PCB guidance. It also distinguishes the exact M2GL010-FG484 ordering code from related IGLOO2 device variants so procurement teams can avoid package, temperature-grade, or speed-grade substitutions that are not drop-in equivalents.

Alternativas directas para M2GL010-FG484 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

M2GL010T-1FG484M

✅ Sustitución directa
📦 484-BGA
Same verified IGLOO2 12KLE density, 233 I/Os, and 484-BGA class; ordering suffix differs by an unquantified qualification or commercial designation

📋 Alternativa de referencia (no en el catálogo)

M2GL010-FGG484

✅ Sustitución directa
📦 484-BGA
Same verified IGLOO2 12KLE family and 484-BGA class; difference is an unquantified ordering-suffix variation

📋 Alternativa de referencia (no en el catálogo)

M2GL010-1FG484IX417

✅ Sustitución directa
📦 484-FPBGA
Same verified 484-FPBGA family package and 233 I/O architecture; speed or ordering-code parameters differ by an unquantified amount

📋 Alternativa de referencia (no en el catálogo)

M2GL010T

✅ Sustitución directa
📦 484-BGA
Base IGLOO2 12KLE family designation with 484-BGA-class package; ordering suffix and qualification details are not fully quantified

📋 Alternativa de referencia (no en el catálogo)

M2GL010-FG484 Valores máximos y características eléctricas

Device Type IGLOO2 low-density flash FPGA
Number of Logic Elements 12,084 LE
Total RAM 933,888 bits
Number of I/O 233 I/O
Supply Voltage Range 1.14 V to 2.625 V
Nominal Supply Voltage 1.2 V
Encapsulado 484-FPBGA (23 mm x 23 mm)
Tipo de montaje Surface mount
Temperatura de funcionamiento 0°C to 85°C (TJ)
Packaging Tray
Manufacturer Lead Time 8 weeks
Product Status Active
Configuration Memory Flash
Series IGLOO2
Logic Density Class 12KLE
Estado RoHS RoHS non-compliant
Terminal Pitch 1.000 mm
JESD Package Code S-PBGA-B484
Package Pin Count 484 balls

Guía de configuración de pines de M2GL010-FG484 484 balls

Configuración de pines para M2GL010-FG484 (encapsulado 484 balls). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 484 balls para M2GL010-FG484

No hay datos detallados de patillaje disponibles para M2GL010-FG484.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

M2GL010-FG484 es adecuado para 6 aplicacións: Gigabit Ethernet Interface Bridging, Dual PCI Express Control Planes, Industrial I/O Expansion and Conversion, Video and Image Processing, Secure Connectivity Gateways, System Management and Control Logic.

🌐

Gigabit Ethernet Interface Bridging

The M2GL010-FG484 fits interface-bridging and control-plane logic because Microchip identifies IGLOO2 devices for Gigabit Ethernet applications, while the verified device provides 12,084 logic elements, 933,888 RAM bits, and 233 I/Os. Its 1.14 V to 2.625 V supply range supports integration into modern low-voltage digital systems. Designers can use the FPGA fabric for protocol translation, buffering, status generation, and control between network PHYs or higher-level processing elements. The 484-FPBGA provides ample external connectivity, but careful ball-escape routing and complete decoupling are essential for reliable operation. This device is appropriate when reconfigurable logic, parallel I/O density, and flash-based configuration are more valuable than the simplicity of a small CPLD.

🖥️

Dual PCI Express Control Planes

The M2GL010-FG484 can implement control and status functions around dual PCI Express interfaces, an application explicitly identified by Microchip for the IGLOO2 family. Its 233 I/Os and 12,084 logic elements provide parallel resources for register handling, configuration sequencing, arbitration, and auxiliary interface conversion. The verified 1.14 V to 2.625 V operating range aligns with low-voltage digital designs, while flash configuration permits field updates to control logic. Engineers must use the official bank, pin, and package documents to establish voltage compatibility and differential routing. Because the available data does not provide protocol-specific certification for this exact suffix, application validation remains necessary before production use.

🏭

Industrial I/O Expansion and Conversion

For industrial interface expansion, the M2GL010-FG484 provides 233 I/Os, 12,084 logic elements, and 933,888 RAM bits in a single surface-mount 484-FPBGA. These resources can translate between parallel and serial formats, debounce or condition discrete inputs, coordinate outputs, and implement protocol adapters without changing the PCB when interface requirements evolve. Its 0°C to 85°C junction-temperature range fits many industrial environments when the complete system thermal design is appropriate. The verified data identifies the product as active and flash based, supporting repeatable configuration and post-deployment updates. Designers should confirm bank voltage limits, I/O standards, and timing constraints from the official IGLOO2 documentation before assigning external signals.

📺

Video and Image Processing

The M2GL010-FG684 is suitable for compact video or image-processing blocks where parallel pixel data, timing control, and expandable logic are required. Its 233 I/Os can expose multiple parallel data paths, while 12,084 logic elements and 933,888 RAM bits support pipeline stages, line buffers, control logic, and format conversion. The manufacturer specifically identifies image and video processing among IGLOO2 use cases. The device is most useful when the design needs a deterministic, reconfigurable fabric close to external memory or display interfaces. Because the verified information does not specify supported memory-interface combinations or video performance, engineers should use the family datasheet and design tools to validate bandwidth, clocking, and external component requirements.

🧩

Secure Connectivity Gateways

The M2GL010-FG484 can serve as a secure-connectivity companion by implementing packet classification, protocol framing, key-path control, and I/O conversion around dedicated network or security components. Microchip lists secure connectivity as an IGLOO2 application, and the device's 233 I/Os allow multiple parallel data paths to coexist on one package. Its nonvolatile flash configuration supports field reprogramming, although security updates and key-handling procedures remain design-specific. The verified 1.2 V nominal supply and broad 1.14 V to 2.625 V range simplify integration with compatible digital circuitry. Engineers must validate timing closure, supported I/O standards, and any security-control assumptions using Microchip's device documentation and implementation tools.

🔧

System Management and Control Logic

The M2GL010-FG484 fits centralized system-management functions that require deterministic sequencing, watchdog behavior, fault routing, power-state coordination, and programmable interface logic. Its 12,084 logic elements and 933,888 RAM bits allow complex state machines and buffering, while 233 I/Os support numerous sensors, status flags, and actuators. The IGLOO2 family's flash-based configuration is useful when management logic must be updated without changing a mask, and the verified product status is active. The principal engineering constraints are BGA assembly, clean power distribution, and careful definition of every unused or restricted terminal in the design package. Verify all bank assignments and pin states with the official packaging and pin-description documents.

What are the key specifications of M2GL010-FG484 that engineers should know?
The Microchip Technology M2GL010-FG484 is an IGLOO2 flash FPGA with 12,084 logic elements, 933,888 RAM bits, and 233 I/Os in a 484-FPBGA package. According to the manufacturer datasheet, the device belongs to the IGLOO2 family and operates across a 1.14 V to 2.625 V supply range. Verified product data identifies a nominal 1.2 V supply, 23 mm by 23 mm package, surface-mount construction, tray packaging, and an operating range of 0°C to 85°C junction temperature. These parameters define the device's logic capacity, external-interface density, and board-level implementation envelope.
Where can I download the M2GL010-FG484 datasheet PDF?
The M2GL010-FG484 datasheet PDF is available from Microchip Technology at the official IGLOO2 and SmartFusion2 datasheet URL supplied with the verified product data. It covers electrical AC and DC specifications for M2GL010 devices and related families. The manufacturer also publishes a separate IGLOO2 packaging and pin-description guide for mechanical dimensions, bank assignments, and package information. The specific ordering code is additionally documented in Microchip's M2GL010-FG484 BSDL resource, which lists all package pins for design and verification workflows.
Where can I find the M2GL010-FG484 pinout and package information?
The M2GL010-FG484 pinout is documented in Microchip's official IGLOO2 Packaging and Pin Descriptions User Guide and its M2GL010-FG484 BSDL file. The verified package data identifies a 484-ball FBGA using a 1.000 mm terminal pitch, with the package classified as S-PBGA-B484. Because this is a high-density BGA rather than a leaded package, engineers should use the manufacturer's pin-description and mechanical documents during PCB escape routing and assembly review rather than relying on a generic BGA drawing.
What is the price of M2GL010-FG484?
The verified unit price for M2GL010-FG484 is $22.2759 as of 2026-10-23, with the listed price available from LCSC and additional distributor listings available through DigiKey, Mouser, and Octopart. Because FPGA pricing can change with market availability, production planning should confirm the current quantity price, authorized distribution, and lead time for the exact ordering code. The manufacturer's product listing states a lead time of 8 weeks, while distributor snippets indicate immediate shipment for some listings.
Where to buy M2GL010-FG484 online?
The M2GL010-FG484 can be purchased online through Microchip-authorized distributors including DigiKey and Mouser, with additional marketplace inventory shown by LCSC and aggregated by Octopart. The verified LCSC listing starts at $22.2759 per unit as of 2026-10-23. For production procurement, verify the package marking, temperature grade, tray packaging, and authorized-distributor traceability before issuing a purchase order, particularly when consolidating inventory across multiple shipments.
Is M2GL010-FG484 in stock?
The M2GL010-FG484 has distributor listings that explicitly state in-stock status or immediate shipment, including the verified LCSC and DigiKey results. However, distributor inventory changes rapidly and may not represent the quantity available for a specific production order. The manufacturer's product data lists an 8-week manufacturer lead time and an active product status. Confirm current stock, scheduled delivery dates, and traceability directly with the selected authorized distributor as of the order date.
What is the lead time for M2GL010-FG484?
The verified manufacturer product listing states an 8-week lead time for M2GL010-FG484, while distributor search results indicate that some units ship immediately. These figures describe different supply paths rather than contradictory device specifications. For a new production program, request written confirmation of the current manufacturer lead time and distributor allocation, and build schedule contingency around the 8-week manufacturer figure unless the distributor can provide a firm delivery date for the desired quantity.
What is the difference between M2GL010-FG484 and M2GL010T-1FG484M?
M2GL010-FG484 and M2GL010T-1FG484M are both listed as IGLOO2 12KLE devices in 484-BGA packages with 233 I/Os, but their ordering suffixes encode different qualification or commercial options. The verified data does not provide a complete temperature-grade and qualification comparison for M2GL010T-1FG484M. Do not assume the T and -1 portions are procurement aliases without checking Microchip's device table and board requirements. A board-level substitution also requires confirming the exact speed grade, temperature range, pin assignments, and configuration compatibility.
M2GL010-FG484 vs M2GL010-FGG484 - which is better for a new design?
M2GL010-FG484 and M2GL010-FGG484 are related IGLOO2 entries, but the verified web results do not expose a complete ordering-code table showing whether every electrical, temperature, and qualification characteristic is identical. Both are associated with 12KLE IGLOO2 devices, while only the exact M2GL010-FG484 is confirmed here as a 484-FPBGA with a 0°C to 85°C junction range and tray packaging. For a new design, use the manufacturer ordering guide rather than treating the longer suffix as automatically equivalent.
When should I choose M2GL010-FG484 over another IGLOO2 device?
Choose M2GL010-FG484 when a design needs the verified combination of 12,084 logic elements, 933,888 RAM bits, 233 I/Os, a 1.14 V to 2.625 V supply range, and a 484-FPBGA footprint. The manufacturer positions IGLOO2 devices for bridging, I/O expansion and conversion, system management, secure connectivity, Gigabit Ethernet, and dual PCI Express control-plane logic. Select a different density only when logic, memory, pin-count, or application requirements exceed the M2GL010 resources; otherwise, this part provides substantial capacity in one package.
Is M2GL010-FG484 suitable for industrial and communications applications?
The M2GL010-FG484 is suitable for industrial and communications designs when the application stays within its verified 0°C to 85°C junction-temperature range. Microchip identifies IGLOO2 flash FPGAs for bridging, I/O expansion, system management, secure connectivity, Gigabit Ethernet, and dual PCI Express control-plane functions across communications, industrial, medical, defense, and aviation markets. The exact M2GL010-FG484 is marked RoHS non-compliant in the verified product data, so compliance-sensitive or regulated deployments require an explicit program-level review.
What can replace M2GL010-FG484?
The verified cross-reference data did not establish five or more true pin-compatible drop-in replacements for the M2GL010-FG484. M2GL010T-1FG484M is a related 484-BGA IGLOO2 ordering code, but the available snippets do not prove identical temperature grade, qualification, or ordering characteristics. M2GL010-FGG484 is also listed, but its complete suffix definition is not available in the verified data. These candidates therefore require manufacturer ordering-code confirmation rather than being treated as automatic drop-in replacements.
Is M2GL010-FG484 the same as M2GL010T-1FG484M?
The M2GL010-FG484 is not confirmed to be identical to M2GL010T-1FG484M. Both appear in verified distributor results as IGLOO2 devices with 12KLE density, 233 I/Os, and a 484-BGA package, indicating a close family relationship. However, ordering suffixes may identify different speed, temperature, qualification, or commercial variants. Before replacement, compare the complete manufacturer device table, operating-temperature grade, and package drawing, then confirm that the existing PCB land pattern and configuration remain compatible.
What is the best cross-brand equivalent for M2GL010-FG484?
No verified cross-brand equivalent for M2GL010-FG484 was identified in the supplied cross-reference results. A genuine direct replacement would need the same 484-FPBGA footprint, equivalent I/O availability and voltage ranges, compatible configuration methods, and verified pin and bank assignments; merely offering an FPGA with similar logic density is not enough. Because no such cross-brand part was confirmed by web data, engineers should retain the Microchip device or obtain a manufacturer-approved migration path rather than assume a competing FPGA is drop-in compatible.
How should power and decoupling be designed for M2GL010-FG484?
Power the M2GL010-FG484 from a supply within its verified 1.14 V to 2.625 V operating range, using the 1.2 V nominal condition for designs based on the verified product listing. Place the device-side power and ground connections directly into the BGA escape structure and follow Microchip's bank and pin-description documents when assigning supply pins. Do not infer individual pin functions from the 484-ball count alone; use the official pin guide and board design guidance to determine required decoupling, current capacity, and power sequencing.
What PCB considerations matter for the M2GL010-FG484 484-FPBGA?
The M2GL010-FG484 requires a high-density BGA layout because it uses a 484-FPBGA package with 1.000 mm terminal pitch in a 23 mm by 23 mm body. Engineers should plan layer transitions, via-in-pad or via-in-land strategies, differential-pair geometry, plane connectivity, and assembly inspection rules around the escape-routing region. The verified data does not specify a recommended stack-up or exact via dimensions, so those values must come from Microchip's package, PCB, and assembly documents rather than being inferred from the ball count.

Datos de referencia de ingeniería para M2GL010-FG484 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose M2GL010-FG484 when the design specifically needs the verified 12,084 logic elements, 933,888 RAM bits, 233 I/Os, 1.14 V to 2.625 V supply range, and 484-FPBGA footprint of the active IGLOO2 device. It is particularly suitable for general-purpose bridging, I/O conversion, system management, secure connectivity, Gigabit Ethernet control logic, and dual PCI Express control-plane functions. M2GL010T-1FG484M may be appropriate when its additional ordering suffix satisfies procurement or qualification requirements, but the supplied data does not quantify all differences. M2GL010-FGG484 should be selected only after Microchip's ordering guide confirms the intended temperature, speed, and commercial grade. M2GL010-1FG484IX417 may fit designs requiring its specific suffix, but its supplied 1.14 V to 1.26 V voltage listing differs from the target's broader range. No cross-brand drop-in alternative was verified, so do not substitute an unrelated FPGA without a documented pin, voltage, and configuration compatibility review.

Comparación con alternativas

Parámetro Este producto M2GL010T-1FG484M M2GL010-FGG484 M2GL010-1FG484IX417 M2GL010T
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 484-FPBGA (23 mm x 23 mm) 484-BGA - same package class 484-BGA - same package class 484-FPBGA - same package class 484-BGA - same package class
Series IGLOO2 IGLOO2 IGLOO2 IGLOO2 IGLOO2

Diferenciadores clave

  • Verified 12KLE density with substantial RAM (frente a M2GL010-FGG484)
  • Explicitly verified operating and procurement status (frente a M2GL010T-1FG484M)
  • High external-interface density in a compact package (frente a M2GL010-1FG484IX417)

Notas de diseño

Treat the M2GL010-FG484 as a demanding high-density BGA design. Its verified 484-FPBGA package uses a 1.000 mm terminal pitch and measures 23 mm by 23 mm, so the PCB escape pattern must be taken directly from Microchip's package drawing rather than reconstructed from a generic library. Define the stack-up, ball-to-trace transitions, via dimensions, reference plane changes, and assembly inspection features before schematic capture is complete. A symbol and footprint that share the 484-ball count can still differ in ball mapping or pad geometry and therefore are not sufficient evidence of interchangeability.

Design the power tree for the verified 1.14 V to 2.625 V operating range, using 1.2 V as the nominal condition stated for this device. Assign supply and ground balls according to Microchip's official IGLOO2 bank and pin-description documents, then provide local decoupling at the device-side connection points through the BGA escape network. Estimate PDN impedance and plane-transition behavior at the switching edge of the design; a regulator that meets its own output ripple specification does not by itself guarantee acceptable voltage at the FPGA. Sequence any externally powered interface when required by the selected bank voltages, and verify absolute maximum limits against the family datasheet.

Preserve signal integrity by separating clocks, high-speed buses, and sensitive inputs from noisy return paths and power-conversion circuitry. Route escape connections using the shortest practical paths, but apply length matching only to interfaces that actually require it and verify timing in the FPGA design tools. Keep each power island and its ground reference continuous through the ball field; excessive plane fragmentation can create return-path discontinuities. Use the official pin and bank information to avoid placing unsupported I/O standards on a voltage bank. Any exact via, antipad, and differential-pair dimensions remain [DATA_NEEDED: PCB stack-up and package escape dimensions] until taken from the official design documentation.

Thermal design for the M2GL010-FG484 must account for both configuration activity and sustained I/O loading, but the verified web data does not supply junction-to-ambient resistance, power dissipation, or package thermal characterization. Do not infer a thermal limit from the 0°C to 85°C operating rating alone. Use the manufacturer power-estimation guidance with the selected clocking, I/O, and utilization assumptions, then check the assembled PCB under worst-case activity. Validate the estimate with thermal simulation and temperature measurement because the supplied data is insufficient to produce a defensible junction-temperature calculation. The complete thermal budget must also include nearby regulators, memory, and I/O components.

The principal procurement pitfall is assuming that related IGLOO2 suffixes are automatically interchangeable. M2GL010T-1FG484M and M2GL010-FGG484 are close family candidates, but the verified snippets do not prove identical speed, temperature, qualification, or commercial designations. Before substitution, compare the full Microchip ordering table, pinout, voltage banks, configuration method, and package drawing. Also do not interpret the verified 'RoHS non-compliant' listing as an error: it is a supplied product attribute that may require an exemption or an alternate approved device in compliance-sensitive programs.

Información de cumplimiento

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Unknown
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

The verified manufacturer product listing explicitly states RoHS non-compliant. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were supplied.

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Componentes & términos relacionados

Microchip Technology M2GL010-FG484 M2GL010T-1FG484M M2GL010-FGG484 M2GL010-1FG484IX417 M2GL010T IGLOO2 FPGA CPLD field-programmable gate array flash FPGA programmable logic logic element block RAM user I/O 484-FPBGA BGA surface-mount package 1.000 mm terminal pitch Gigabit Ethernet PCI Express I/O expansion system management secure connectivity RoHS
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