M2GL010-FG484 - 12K LEs, 233 I/O IGLOO2 FPGA | Microchip
Teilenummer: M2GL010-FG484 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.2759 | $22,28 |
| 10 | $22.2759 | $222,76 |
| 100 | $22.2759 | $2.227,59 |
| 500 | $22.2759 | $11.137,95 |
| 1.000 | $22.2759 | $22.275,90 |
M2GL010-FG484 Übersicht
An FPGA is a reconfigurable digital semiconductor whose programmable logic blocks, registers, memory, and I/O can be configured after manufacture. The IGLOO2 family belongs to the broader FPGA and CPLD hierarchy and combines nonvolatile flash configuration storage with reusable logic fabric. This makes the M2GL010-FG484 suitable for prototypes and production systems requiring deterministic parallel processing, flexible interface logic, and field-reprogrammability without using a mask change.
The verified device data identifies 233 input/output terminals, 12,084 logic elements, 933,888 total RAM bits, a 1.2 V nominal operating supply, and a 23 mm by 23 mm FPBGA package. Its 484-ball grid-array package supports high pin density for complex designs with numerous external interfaces. The M2GL010-FG484 is surface mounted and supplied in a tray according to the manufacturer product data.
The IGLOO2 architecture is designed for communications, industrial, medical, defense, and aviation applications. Its 12K logic-element density provides substantially more capacity than a small CPLD, while flash-based configuration supports stable field updates. The device can implement protocol bridges, I/O expansion, image and video processing, control-plane logic, and secure-connectivity functions when paired with suitable external interfaces and memory.
A principal design consideration is the large BGA escape-routing requirement. A PCB with 484 package balls requires careful layer-stack planning, via placement, and power delivery to preserve signal integrity and effective thermal performance. Designers should also verify speed grade, temperature grade, configuration requirements, supported I/O standards, and the exact pin assignments of the selected board revision before release.
This page consolidates verified distributor availability, manufacturer family information, technical specifications, replacement analysis, and practical PCB guidance. It also distinguishes the exact M2GL010-FG484 ordering code from related IGLOO2 device variants so procurement teams can avoid package, temperature-grade, or speed-grade substitutions that are not drop-in equivalents.
Drop-in-Alternativen für M2GL010-FG484 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M2GL010T-1FG484M
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010-FGG484
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010-1FG484IX417
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M2GL010-FG484 Grenzwerte & elektrische Eigenschaften
| Device Type | IGLOO2 low-density flash FPGA |
| Number of Logic Elements | 12,084 LE |
| Total RAM | 933,888 bits |
| Number of I/O | 233 I/O |
| Supply Voltage Range | 1.14 V to 2.625 V |
| Nominal Supply Voltage | 1.2 V |
| Gehäuse | 484-FPBGA (23 mm x 23 mm) |
| Montageart | Surface mount |
| Betriebstemperatur | 0°C to 85°C (TJ) |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
| Configuration Memory | Flash |
| Series | IGLOO2 |
| Logic Density Class | 12KLE |
| RoHS-Status | RoHS non-compliant |
| Terminal Pitch | 1.000 mm |
| JESD Package Code | S-PBGA-B484 |
| Package Pin Count | 484 balls |
M2GL010-FG484 484 balls Pinbelegungsleitfaden
Pinbelegung für M2GL010-FG484 (484 balls-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M2GL010-FG484.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M2GL010-FG484 ist geeignet für 6 Anwendungs: Gigabit Ethernet Interface Bridging, Dual PCI Express Control Planes, Industrial I/O Expansion and Conversion, Video and Image Processing, Secure Connectivity Gateways, System Management and Control Logic.
Gigabit Ethernet Interface Bridging
The M2GL010-FG484 fits interface-bridging and control-plane logic because Microchip identifies IGLOO2 devices for Gigabit Ethernet applications, while the verified device provides 12,084 logic elements, 933,888 RAM bits, and 233 I/Os. Its 1.14 V to 2.625 V supply range supports integration into modern low-voltage digital systems. Designers can use the FPGA fabric for protocol translation, buffering, status generation, and control between network PHYs or higher-level processing elements. The 484-FPBGA provides ample external connectivity, but careful ball-escape routing and complete decoupling are essential for reliable operation. This device is appropriate when reconfigurable logic, parallel I/O density, and flash-based configuration are more valuable than the simplicity of a small CPLD.
Empfohlen
Dual PCI Express Control Planes
The M2GL010-FG484 can implement control and status functions around dual PCI Express interfaces, an application explicitly identified by Microchip for the IGLOO2 family. Its 233 I/Os and 12,084 logic elements provide parallel resources for register handling, configuration sequencing, arbitration, and auxiliary interface conversion. The verified 1.14 V to 2.625 V operating range aligns with low-voltage digital designs, while flash configuration permits field updates to control logic. Engineers must use the official bank, pin, and package documents to establish voltage compatibility and differential routing. Because the available data does not provide protocol-specific certification for this exact suffix, application validation remains necessary before production use.
Empfohlen
Industrial I/O Expansion and Conversion
For industrial interface expansion, the M2GL010-FG484 provides 233 I/Os, 12,084 logic elements, and 933,888 RAM bits in a single surface-mount 484-FPBGA. These resources can translate between parallel and serial formats, debounce or condition discrete inputs, coordinate outputs, and implement protocol adapters without changing the PCB when interface requirements evolve. Its 0°C to 85°C junction-temperature range fits many industrial environments when the complete system thermal design is appropriate. The verified data identifies the product as active and flash based, supporting repeatable configuration and post-deployment updates. Designers should confirm bank voltage limits, I/O standards, and timing constraints from the official IGLOO2 documentation before assigning external signals.
Empfohlen
Video and Image Processing
The M2GL010-FG684 is suitable for compact video or image-processing blocks where parallel pixel data, timing control, and expandable logic are required. Its 233 I/Os can expose multiple parallel data paths, while 12,084 logic elements and 933,888 RAM bits support pipeline stages, line buffers, control logic, and format conversion. The manufacturer specifically identifies image and video processing among IGLOO2 use cases. The device is most useful when the design needs a deterministic, reconfigurable fabric close to external memory or display interfaces. Because the verified information does not specify supported memory-interface combinations or video performance, engineers should use the family datasheet and design tools to validate bandwidth, clocking, and external component requirements.
Empfohlen
Secure Connectivity Gateways
The M2GL010-FG484 can serve as a secure-connectivity companion by implementing packet classification, protocol framing, key-path control, and I/O conversion around dedicated network or security components. Microchip lists secure connectivity as an IGLOO2 application, and the device's 233 I/Os allow multiple parallel data paths to coexist on one package. Its nonvolatile flash configuration supports field reprogramming, although security updates and key-handling procedures remain design-specific. The verified 1.2 V nominal supply and broad 1.14 V to 2.625 V range simplify integration with compatible digital circuitry. Engineers must validate timing closure, supported I/O standards, and any security-control assumptions using Microchip's device documentation and implementation tools.
Empfohlen
System Management and Control Logic
The M2GL010-FG484 fits centralized system-management functions that require deterministic sequencing, watchdog behavior, fault routing, power-state coordination, and programmable interface logic. Its 12,084 logic elements and 933,888 RAM bits allow complex state machines and buffering, while 233 I/Os support numerous sensors, status flags, and actuators. The IGLOO2 family's flash-based configuration is useful when management logic must be updated without changing a mask, and the verified product status is active. The principal engineering constraints are BGA assembly, clean power distribution, and careful definition of every unused or restricted terminal in the design package. Verify all bank assignments and pin states with the official packaging and pin-description documents.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M2GL010-FG484 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M2GL010T-1FG484M | M2GL010-FGG484 | M2GL010-1FG484IX417 | M2GL010T |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FPBGA (23 mm x 23 mm) | 484-BGA - same package class | 484-BGA - same package class | 484-FPBGA - same package class | 484-BGA - same package class |
| Series | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
Wichtigste Unterscheidungsmerkmale
- Verified 12KLE density with substantial RAM (vs. M2GL010-FGG484)
- Explicitly verified operating and procurement status (vs. M2GL010T-1FG484M)
- High external-interface density in a compact package (vs. M2GL010-1FG484IX417)
Designhinweise
Treat the M2GL010-FG484 as a demanding high-density BGA design. Its verified 484-FPBGA package uses a 1.000 mm terminal pitch and measures 23 mm by 23 mm, so the PCB escape pattern must be taken directly from Microchip's package drawing rather than reconstructed from a generic library. Define the stack-up, ball-to-trace transitions, via dimensions, reference plane changes, and assembly inspection features before schematic capture is complete. A symbol and footprint that share the 484-ball count can still differ in ball mapping or pad geometry and therefore are not sufficient evidence of interchangeability.
Design the power tree for the verified 1.14 V to 2.625 V operating range, using 1.2 V as the nominal condition stated for this device. Assign supply and ground balls according to Microchip's official IGLOO2 bank and pin-description documents, then provide local decoupling at the device-side connection points through the BGA escape network. Estimate PDN impedance and plane-transition behavior at the switching edge of the design; a regulator that meets its own output ripple specification does not by itself guarantee acceptable voltage at the FPGA. Sequence any externally powered interface when required by the selected bank voltages, and verify absolute maximum limits against the family datasheet.
Preserve signal integrity by separating clocks, high-speed buses, and sensitive inputs from noisy return paths and power-conversion circuitry. Route escape connections using the shortest practical paths, but apply length matching only to interfaces that actually require it and verify timing in the FPGA design tools. Keep each power island and its ground reference continuous through the ball field; excessive plane fragmentation can create return-path discontinuities. Use the official pin and bank information to avoid placing unsupported I/O standards on a voltage bank. Any exact via, antipad, and differential-pair dimensions remain [DATA_NEEDED: PCB stack-up and package escape dimensions] until taken from the official design documentation.
Thermal design for the M2GL010-FG484 must account for both configuration activity and sustained I/O loading, but the verified web data does not supply junction-to-ambient resistance, power dissipation, or package thermal characterization. Do not infer a thermal limit from the 0°C to 85°C operating rating alone. Use the manufacturer power-estimation guidance with the selected clocking, I/O, and utilization assumptions, then check the assembled PCB under worst-case activity. Validate the estimate with thermal simulation and temperature measurement because the supplied data is insufficient to produce a defensible junction-temperature calculation. The complete thermal budget must also include nearby regulators, memory, and I/O components.
The principal procurement pitfall is assuming that related IGLOO2 suffixes are automatically interchangeable. M2GL010T-1FG484M and M2GL010-FGG484 are close family candidates, but the verified snippets do not prove identical speed, temperature, qualification, or commercial designations. Before substitution, compare the full Microchip ordering table, pinout, voltage banks, configuration method, and package drawing. Also do not interpret the verified 'RoHS non-compliant' listing as an error: it is a supplied product attribute that may require an exemption or an alternate approved device in compliance-sensitive programs.
Compliance-Informationen
The verified manufacturer product listing explicitly states RoHS non-compliant. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were supplied.
