MC33911BACR2528 - LIN SBC with DC Motor Pre-Driver | NXP
N.º de pieza: MC33911BACR2528 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.62 | $2.310,00 |
| 1.000 | $4.1 | $4.100,00 |
MC33911BACR2528 Descripción general
A System Basis Chip is a power-management IC that combines a communications transceiver (LIN/CAN) with regulators and driver outputs in a single die. By integrating the LIN physical layer, voltage regulation, and motor-driver outputs, an SBC replaces a discrete transceiver plus LDO plus half-bridge, saving PCB area, BOM cost, and reducing quiescent-current overhead compared to multi-chip implementations.
Key features include LIN Protocol 2.0/2.1 (G5AC) compliance with selectable waveshaping for higher data rates, a 5V/60mA LDO for local rail, and protected low-side switches capable of driving inductive loads up to 160mA continuous. The 32-LQFP package provides a manageable 7x7mm footprint with standard reflow compatibility. Operating voltage range covers automotive 12V systems with transient robustness typical of NXP SBC products.
The MC33911BAC variant uses a precision bandgap-based LIN physical layer with thermal shutdown, current limiting on the low-side drivers, and diagnostic feedback. The die is qualified per NXP's standard automotive process flow. Internal protection circuits guard the LIN bus against automotive load-dump and jump-start transients when used with the recommended external protection network.
Typical applications include automotive door modules, seat adjusters, mirror controllers, HVAC damper drivers, and generic LIN slave nodes requiring local regulation plus low-power motor control. The high-side + dual low-side topology suits DC motor direction control with PWM speed command via LIN bus. The integrated LIN-to-LIN-to-standby wake path supports ISO 9141-like networks.
When designing with this part, verify the LIN bus protection network (typically a reverse-battery diode + TVS + series resistor) per NXP application note AN2463 and ensure adequate thermal copper for the LQFP-32 power pad to dissipate low-side driver losses during stall conditions. Do not exceed the 60mA high-side or 160mA per-low-side continuous ratings.
This page synthesizes distributor pricing, drop-in alternatives, application context, and engineering guidance that goes beyond what the manufacturer datasheet provides in isolation.
Alternativas directas para MC33911BACR2528 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
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✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
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✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
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MC33911BACR2528 Valores máximos y características eléctricas
| Product Type | System Basis Chip (SBC) / PMIC - Specialized |
| Communication Interface | LIN Protocol 2.0 / 2.1 (G5AC) |
| Integrated LDO | 1 x 5.0 V / 60 mA |
| High-Side Switch | 1 x 60 mA |
| Low-Side Switches | 2 x 160 mA |
| DC Motor Pre-Driver | Yes (H-bridge capable with external FETs) |
| Waveshaping | Selectable (for higher data rates) |
| Encapsulado | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (automotive) |
| LIN Compliance | LIN 2.0 and LIN 2.1 |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| AEC-Q100 | Qualified (automotive SBC family) |
Configuración de pines de MC33911BACR2528
| Pin 1 | VDD — 5V LDO output |
| Pin 2 | RXD — LIN receive data output |
| Pin 3 | TXD — LIN transmit data input |
| Pin 4 | EN — Enable input |
| Pin 5 | LIN — LIN bus pin |
| Pin 6 | VBB — Battery supply voltage |
| Pin 7 | HS1 — High-side switch 1 output |
| Pin 8 | LS1 — Low-side switch 1 output |
| Pin 9 | LS2 — Low-side switch 2 output |
| Pin 10 | GND — Ground |
| Pin 11 | WAKE — Wake-up input |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | NC — Not connected (per datasheet) |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | EP — Exposed thermal pad - tie to GND |
Aplicaciones típicas
MC33911BACR2528 es adecuado para 6 aplicacións: Automotive Door Module, HVAC Damper Motor Controller, Power Mirror Controller, Seat Position Adjuster, Generic LIN Slave Node with Local Regulation, Industrial LIN-J1939 Bridge Node.
Automotive Door Module
The MC33911BACR2528 fits automotive door modules because its integrated LIN 2.0/2.1 transceiver, 5V/60mA LDO, and H-bridge pre-driver outputs eliminate the need for a separate LIN transceiver plus LDO plus half-bridge driver IC. The IC connects to a door-window/seat-adjustment MCU via the LIN bus; the 5V rail powers the local MCU and Hall-effect position sensors; the high-side + dual low-side switches drive external N-channel MOSFETs forming the window or mirror-fold H-bridge. AEC-Q100 qualification plus -40C to +125C operation handles underhood thermal stress. Compared to discrete LIN + LDO + driver implementations, the SBC reduces PCB area, BOM count, and standby current, while the LIN waveshaping control improves bus signal integrity across long cable runs typical of door-to-BCM wiring harnesses.
Recomendado
HVAC Damper Motor Controller
For HVAC blend and mode damper actuators, the MC33911BACR2528's LIN interface communicates damper position commands from the HVAC control module, while the integrated 5V LDO supplies the local position-feedback MCU and the 60mA high-side plus dual 160mA low-side switches control the small DC motor driving the damper. The SBC's AEC-Q100 qualification supports the underhood-dashboard thermal environment. The IC's selectable LIN waveshaping allows the same part to operate on legacy LIN 1.x networks or newer LIN 2.1 networks, simplifying HVAC module platform reuse. Compared to stepping-motor damper designs, brushed DC + MC33911BAC is lower BOM cost and easier to drive with simple position feedback, while retaining full LIN diagnostics for end-of-line test and field service.
Recomendado
Power Mirror Controller
The MC33911BACR2528 suits power-side-mirror control because its 60mA high-side + dual 160mA low-side outputs can drive external MOSFETs forming the mirror-fold/extend H-bridge, while the LIN bus carries fold/unfold commands from the body control module. The 5V/60mA integrated LDO powers the local mirror-position MCU without needing a separate voltage regulator. AEC-Q100 qualification plus 7x7mm LQFP thermal performance handle the A-pillar thermal environment. Compared to a discrete implementation, the MC33911BAC reduces PCB area significantly and provides integrated diagnostics on the LIN bus for short-circuit, open-load, and overtemperature faults on the mirror motor outputs - critical for ASIL-rated mirror systems.
Recomendado
Seat Position Adjuster
For seat position adjusters in automotive seats, the MC33911BACR2528 provides a single-chip LIN-attributed motor-control solution. The high-side + dual low-side pre-driver outputs feed external N-FETs forming the seat-track H-bridge, while the LIN bus interfaces to the seat-control module. The integrated 5V LDO powers local position-sensor and Hall-effect logic. AEC-Q100 plus extended -40 to +125C operating range handles the seat-foam thermal environment. Compared to a discrete LIN + driver solution, the SBC integrates overcurrent and overtemperature protection per switch, plus LIN-based diagnostics that simplify seat-module end-of-line test and field service. Designers should verify the 160mA per-low-side limit against the seat motor stall current with adequate margin.
Recomendado
Generic LIN Slave Node with Local Regulation
Beyond motor control, the MC33911BACR2528 also fits generic LIN-attributed slave nodes that need local 5V regulation, such as ambient-light sensors, rain-light modules, or roof-console keypads. The integrated LIN 2.x transceiver communicates with the BCM, and the 5V/60mA LDO powers local MCU and signal-conditioning circuitry. The 60mA high-side switch can drive a small relay or LED indicator, while the low-side switches can sink indicator LEDs or signal lines. AEC-Q100 plus the small 32-LQFP footprint allows direct placement in space-constrained roof modules. Compared to a discrete LIN transceiver + separate LDO, the SBC simplifies the BOM, reduces quiescent current, and provides integrated LIN-bus diagnostics for field-service troubleshooting.
Recomendado
Industrial LIN-J1939 Bridge Node
In industrial machinery that uses LIN subnets to consolidate sensor wiring, the MC33911BACR2528 can serve as a LIN-attributed node controller. The integrated LIN 2.0/2.1 transceiver supports both legacy 1.x and modern 2.1 networks, simplifying retrofit and new-platform designs. The 5V LDO plus motor pre-driver outputs handle small actuator loads. The 32-LQFP package is industrial-rugged when paired with conformal coating. Compared to a generic LIN transceiver, the integrated SBC form factor reduces PCB area and BOM cost for industrial sensor/actuator nodes. Note: industrial environments without the automotive transient profile may use the part outside the AEC-Q100 rated envelope, so verify EMI/ESD performance against your specific industrial environment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC33911BACR2528 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC33911BACR2 | MC33911G5 | MC33912G5 | MC33661PEFR2 | TLE7269G |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon Technologies |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-QFP - same family |
| LIN Compliance | LIN 2.0 / 2.1 (G5AC) | LIN 2.0 / 2.1 | LIN 2.1 | LIN 2.1 | LIN 2.0 / 2.1 | LIN 2.2 |
| Integrated LDO Output | 5V / 60mA | 5V / 60mA | 5V / 60mA | 5V / 60mA | None | 5V / 100mA |
| Low-Side Driver Count | 2 x 160mA | 2 x 160mA | 2 x 160mA | 2 x 160mA | None | Integrated low-side drivers |
| High-Side Switch | 1 x 60mA | 1 x 60mA | 1 x 60mA | 1 x 60mA | None | Integrated |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Diferenciadores clave
- Integrated LIN + LDO + motor pre-driver on a single die (frente a MC33661PEFR2)
- Pin-compatible with MC33911G5 / MC33912G5 silicon revisions (frente a MC33911G5)
- Higher LDO output current than Infineon alternative (frente a TLE7269G)
Notas de diseño
The MC33911BACR2528 VBB pin requires external reverse-battery protection (typically a Schottky diode in series or P-MOSFET) plus a load-dump TVS clamp per ISO 7637-2. Per NXP application note AN2463, a 100nF ceramic bypass directly at the IC plus a 10uF bulk capacitor at the LIN connector are recommended. The integrated 5V LDO requires its own 1uF-10uF output capacitor; check the datasheet for ESR stability requirements.
Estimated: at VBB=12V, low-side driver conducting 160mA into a motor with 1V drop across the switch, each low-side dissipates 0.16W. Both low-sides plus quiescent losses yield approximately 0.5W worst-case dissipation. The 32-LQFP package with standard JEDEC test board has theta_JA of approximately 75 C/W, so junction rise is roughly 38C above ambient - well within the 125C limit. For higher-current external H-bridge configurations, reflow the LQFP thermal pad to a 1 sq inch copper pour.
Place the VBB decoupling capacitor (100nF ceramic + 10uF bulk) within 5mm of the VBB pin. Place the 5V LDO output capacitor within 3mm of the VDD pin. Route the LIN bus trace as a 100-ohm differential-style trace or twisted-pair with a ground reference, kept short to minimize EMI. The exposed thermal pad must be soldered to a copper pour tied to GND for thermal dissipation.
Do not exceed 160mA continuous per low-side switch without external FETs. Verify the LIN master termination (typically 1k pull-up + diode on the master node) - LIN slaves do not terminate the bus. Do not apply voltage to the LIN pin beyond the datasheet absolute maximum, even during jump-start testing. The waveshaping selection must be configured per NXP SPI/SCI commands; verify the LIN stack driver matches the selected mode.
Información de cumplimiento
AEC-Q100 qualified automotive SBC per NXP product family documentation. RoHS/REACH compliant per DigiKey product listing. Halogen-free status not confirmed in provided data - flagged as unknown.
