MC33FS6514LAE - FS6500 SBC, 1.5A VCORE, CAN FD, LIN, LQFP-48 | NXP
N.º de pieza: MC33FS6514LAE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.06 | $70,60 |
| 100 | $6.28 | $628,00 |
| 500 | $5.65 | $2.825,00 |
| 1.000 | $5.02 | $5.020,00 |
MC33FS6514LAE Descripción general
A System Basis Chip (SBC) is a mixed-signal power-management IC that consolidates the voltage regulators, communication transceivers, and supervisory housekeeping logic that surround an automotive microcontroller. SBCs sit one tier above a standalone PMIC and one tier below the ECU power distribution network; they reduce PCB area, BOM count, and quiescent current by replacing discrete supplies and interface ICs, while centralizing diagnostics, watchdog, and fail-safe behavior under SPI control.
Key features include a 1.5 A peak Vcore buck regulator with low quiescent current, ASIL B/D-capable safety architecture with windowed watchdog, integrated CAN FD physical layer (ISO 11898-1 compliant), LIN 2.x transceiver, Vkam (keep-alive memory) supply, and ultra-low-power STOP/SLEEP modes with wake-up capability. The SPI interface allows host MCU control, diagnostics, and OTP trimming. The integrated physical-layer networking eliminates external transceivers, shrinking BOM and simplifying EMC design.
Internally, the device combines a synchronous buck converter (with internal MOSFETs), low-dropout regulators, bandgap reference, oscillator, SPI slave logic, and physical-layer interface circuitry on a single mixed-signal die. The exposed pad (EP) on the LQFP-48 package provides a low theta_JB for dissipating Vcore converter losses into the PCB copper, essential for continuous 1.5 A operation.
Typical applications include body control modules, BCM gateways, instrument clusters, HVAC controllers, seat and mirror modules, lighting ECUs, and powertrain sub-systems. It also fits industrial CAN/LIN nodes requiring functional safety and a small footprint. The wide automotive input range (typically up to 40 V load-dump tolerant) supports 12 V battery systems.
When designing, prioritize a large copper pour under the EP for thermal relief, place bypass capacitors close to the regulator pins, and reserve adequate SPI lines for diagnostic polling. Confirm OTP configuration matches your Vcore voltage and CAN/LIN enable map before locking the PCB layout.
This page synthesizes distributor pricing, drop-in alternatives within the FS65 family, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MC33FS6514LAE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC33FS6512LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6513LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6524LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6522LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6523LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS4510LAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6514LAE Valores máximos y características eléctricas
| Product Type | Safety Power System Basis Chip (SBC) |
| Series | FS6500 |
| Vcore DC/DC Output Current | 1.5 A |
| Encapsulado | 48-HLQFP (7x7 mm) with Exposed Pad |
| Número de pines | 48 |
| Tipo de montaje | Surface Mount |
| Integrated CAN Transceiver | Yes, CAN FD (ISO 11898-1) |
| Integrated LIN Transceiver | Yes, LIN 2.x compliant |
| Communication Interface | SPI (control & diagnostics) |
| Functional Safety Level | ASIL B/D capable |
| Vkam (Keep-Alive Memory) Supply | Yes |
| Low-Power Modes | STOP / SLEEP with wake-up |
| Watchdog | Windowed watchdog, ASIL B/D capable |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de MC33FS6514LAE
| Pin 1 | VSUP — Battery supply input |
| Pin 2 | VSUP — Battery supply input |
| Pin 3 | WKUP — Wake-up input |
| Pin 4 | LIN — LIN bus line |
| Pin 5 | GND — Ground |
| Pin 6 | CANL — CAN low line |
| Pin 7 | CANH — CAN high line |
| Pin 8 | VSENSE — Battery voltage sense |
| Pin 9 | VCC_LIN — LIN supply |
| Pin 10 | VBOS_LDO — Battery sense LDO output |
| Pin 11 | VCCA — Auxiliary analog supply |
| Pin 12 | VCORE — VCORE DC/DC output feedback |
| Pin 13 | VCORE_SNS — VCORE sense |
| Pin 14 | LX1 — DC/DC switch node |
| Pin 15 | PGND — DC/DC power ground |
| Pin 16 | LX2 — DC/DC switch node |
| Pin 17 | BST — Bootstrap for high-side switch |
| Pin 18 | VCORE_PG — VCORE power-good |
| Pin 19 | VCCA_PG — VCCA power-good |
| Pin 20 | VTRK — Tracking regulator output |
| Pin 21 | VKAM — Keep-alive memory supply |
| Pin 22 | EN — Enable input |
| Pin 23 | RST — Reset output |
| Pin 24 | WD — Watchdog input |
| Pin 25 | SPI_MOSI — SPI data in |
| Pin 26 | SPI_MISO — SPI data out |
| Pin 27 | SPI_SCK — SPI clock |
| Pin 28 | SPI_CS — SPI chip select |
| Pin 29 | INT — Interrupt output to MCU |
| Pin 30 | FAULT — Fault output |
| Pin 31 | DBG — Debug/Test pin |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | NC — Not connected (per datasheet) |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | EP — Exposed thermal pad (must be soldered to copper pour) |
Aplicaciones típicas
MC33FS6514LAE es adecuado para 6 aplicacións: Body Control Module (BCM), Instrument Cluster ECU, HVAC Control Module, Seat and Mirror Control Module, Lighting ECU (Exterior/Interior), Powertrain Sub-System / Sensor Node.
Body Control Module (BCM)
The MC33FS6514LAE is well suited as the central power and bus IC for automotive body control modules: it supplies the host MCU core at up to 1.5 A from its Vcore DC/DC, generates auxiliary rails for sensors and actuators, and provides both CAN FD (ISO 11898-1) and LIN physical-layer interfaces for door, lighting, and mirror nodes. ASIL B/D-capable safety mechanisms, including the windowed watchdog, detect MCU lock-up events and force a deterministic reset, which is critical for safety-relevant BCM functions. Compared to discrete solutions (separate DC/DC + CAN + LIN + watchdog ICs), this SBC saves 50-70 percent of PCB area and lowers quiescent current through its STOP/SLEEP modes with wake on LIN/CAN. Engineers designing BCMs typically pair this SBC with an NXP S32K or MPC56xx MCU and reserve SPI lines for OTP configuration and diagnostics.
Recomendado
Instrument Cluster ECU
Instrument clusters need a deterministic low-noise power source and robust in-vehicle networking for body-CAN messages and local actuator drives. The MC33FS6514LAE provides a 1.5 A Vcore supply for cluster MCUs and graphics processors, while its integrated CAN FD transceiver handles high-speed body/chassis communication and the LIN transceiver drives stepper motors for gauges. The exposed-pad LQFP-48 package enables compact PCB layouts with thermal headroom for continuous operation. Source: NXP FS6500 reference designs. Typical companion parts include NXP S32K MCUs and small-signal LIN-driven stepper drivers, both of which benefit from the SBC's low quiescent current in SLEEP modes (when the vehicle is parked).
Recomendado
HVAC Control Module
HVAC modules require both LIN nodes (for blower and flap actuators) and CAN connectivity to the body network, plus a reliable MCU supply across automotive temperature extremes. The MC33FS6514LAE delivers 1.5 A Vcore for the HVAC MCU, integrates the LIN transceiver for distributed actuator nodes, and provides CAN FD for body network communication. ASIL B/D-capable safety ensures fail-safe HVAC behavior under fault conditions. Per the NXP FS6500 datasheet, the device is qualified for automotive temperature grades, supporting under-dash thermal environments. Typical companion devices include the S32K1xx HVAC MCU and LIN-driven stepper controllers.
Recomendado
Seat and Mirror Control Module
Power seat and mirror modules require multiple LIN nodes for motor control, plus body-CAN connectivity for high-level commands. The MC33FS6514LAE supplies the seat MCU at 1.5 A Vcore and integrates both CAN FD and LIN physical layers, eliminating external transceiver ICs and reducing BOM cost. The windowed watchdog and ASIL B/D-capable diagnostics ensure correct motor command sequencing even under transient fault conditions. Engineers can pair this SBC with NXP S32K MCUs and dedicated BLDC/PWM motor drivers. Compared to a discrete regulator + external transceivers, the integrated approach cuts PCB area significantly, which is important for module packaging under the seat.
Recomendado
Lighting ECU (Exterior/Interior)
LED headlamp and matrix-lighting controllers need clean, low-noise power rails to drive high-current LED drivers, plus LIN/CAN for body-network integration. The MC33FS6514LAE's 1.5 A Vcore DC/DC supplies the lighting MCU and pre-regulator stages with deterministic voltage; its integrated CAN FD and LIN physical layers connect to body and chassis networks. The exposed-pad LQFP-48 package provides thermal relief for continuous Vcore operation. Reference NXP FS6500 documentation recommends 2 oz copper pours under the EP for reliable 1.5 A continuous operation. Companion parts include NXP S32K MCUs and NXP LED driver ICs for matrix-lighting designs.
Recomendado
Powertrain Sub-System / Sensor Node
Distributed powertrain sensor nodes (knock, MAP, lambda) often need a small, robust SBC with CAN FD and wake-on-bus capability. The MC33FS6514LAE fits by providing 1.5 A Vcore for sensor MCUs, integrated CAN FD for high-speed sensor data, and ultra-low-power SLEEP with CAN wake-up for quiescent-current-sensitive battery management. ASIL B/D-capable safety makes it suitable for safety-relevant powertrain sub-systems. The LQFP-48 footprint is well matched to sealed automotive sensor housings. Source: NXP FS6500 datasheet typical applications. Engineers commonly pair this SBC with NXP MPC56xx or S32K MCUs and automotive-qualified sensors.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC33FS6514LAE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC33FS6512LAE | MC33FS6513LAE | MC33FS6524LAE | MC33FS6522LAE | MC33FS6523LAE | MC33FS4510LAE |
|---|---|---|---|---|---|---|---|
| Package | LQFP-48 (7x7) EP | LQFP-48 (7x7) EP - same | LQFP-48 (7x7) EP - same | LQFP-48 (7x7) EP - same | LQFP-48 (7x7) EP - same | LQFP-48 (7x7) EP - same | LQFP-48 (7x7) EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Vcore DC/DC Output Current | 1.5 A | 1.0 A | 1.2 A | 2.0 A | 1.7 A | 1.9 A | 1.5 A |
| CAN FD Transceiver | Yes (integrated) | Yes | Yes | Yes | Yes | Yes | No (CAN 2.0B only) |
| LIN Transceiver | Yes (integrated) | Yes | Yes | Yes | Yes | Yes | Yes |
| Functional Safety Level | ASIL B/D capable | ASIL B/D capable | ASIL B/D capable | ASIL B/D capable | ASIL B/D capable | ASIL B/D capable | ASIL B capable |
| Family | FS6500 | FS6500 | FS6500 | FS6500 | FS6500 | FS6500 | FS4500 |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Balanced Vcore current within the FS6500 family (frente a MC33FS6512LAE)
- Includes CAN FD physical layer (frente a MC33FS4510LAE)
- Lower cost than the 2.0 A FS6524 variant (frente a MC33FS6524LAE)
Notas de diseño
Estimated: At 1.5 A continuous Vcore output and a typical 12 V to 3.3 V conversion efficiency of 80 percent, the IC dissipates approximately 0.6 W (1.5 A x (12 V - 3.3 V) x 0.20). The LQFP-48 with exposed pad has theta_JA near 25 C/W with 2 oz copper pours, so junction temperature rise above 85 C ambient is roughly 15 C - within automotive AEC-Q100 Grade 1 limits. Use at least 1 sq. in. of copper under the EP and 2 oz copper on inner layers for sustained 1.5 A operation.
Place input bulk capacitors (>= 47 uF electrolytic + 100 nF ceramic) within 5 mm of VSUP pins to suppress automotive load-dump and cranking transients. Place Vcore DC/DC output capacitors (22 uF X7R ceramic) within 3 mm of LX1/LX2/PGND to minimize switching-node ringing. The exposed thermal pad must be soldered to a continuous copper plane with multiple thermal vias for heatsinking; do not route signal traces under the EP.
Do not exceed 40 V transients on VSUP or reverse-connect the battery (use external reverse-battery protection if the harness is uncertain). Ensure SPI lines are pulled to a defined logic level when the host MCU is in reset to avoid false SPI transactions. Verify OTP configuration (Vcore trim, CAN/LIN enable, watchdog window) before locking the PCB layout - changing OTP requires re-ordering parts. Source: NXP FS6500 datasheet safety section.
Keep CAN_H and CAN_L traces as a 100-ohm differential pair (about 100-120 ohm impedance) routed symmetrically to the bus connector; avoid 90-degree bends. LIN traces should be routed away from switching nodes (LX1, LX2, BST) to minimize EMI coupling. Use a ground plane under the IC and stitch vias around high-current return paths to minimize EMI emissions and meet automotive CISPR 25 EMC requirements.
Información de cumplimiento
AEC-Q100 qualified per NXP FS6500 product family page. RoHS and REACH compliant per NXP product environmental compliance statements. Halogen-free status not explicitly stated in the verified web data - left as 'unknown'.
