MC33FS6523CAE - ASIL-B SBC, CAN FD/LIN, 2.2A VCORE | NXP
N.º de pieza: MC33FS6523CAE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.1 | $61,00 |
| 100 | $5.2 | $520,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.05 | $4.050,00 |
MC33FS6523CAE Descripción general
What is a system basis chip? An SBC is a category of power-management IC that consolidates the multiple voltage rails, communication transceivers, and supervisory functions needed by an automotive microcontroller into a single package. In the broader IC taxonomy, an SBC falls under power management > voltage regulators with embedded transceivers, sitting above a discrete DC-DC + LDO + CAN/LIN stack. By collapsing those discrete blocks into one ASIL-rated device, the SBC reduces BOM count, PCB area, and the engineering effort needed to qualify a module under ISO 26262.
Key features of the MC33FS6523CAE include a wide input voltage range from -0.3 V to 60 V load-dump tolerance, a 2.2 A peak Vcore buck converter with up to 95% efficiency, ultra-low quiescent current in standby for quiescent-current-sensitive ECUs, and integrated CAN FD physical layer supporting up to 5 Mbit/s along with a LIN 2.x transceiver. Integrated fail-safe mechanisms include watchdog, voltage supervision on every output rail, and an FCCU (Fault Collection and Control Unit) interface to the host MCU.
The device is fabricated on NXP's automotive-grade SMARTMOS process and targets harsh 12 V automotive environments. The 7x7 mm HLQFP-48 package with exposed pad gives a junction-to-ambient thermal resistance suitable for underhood and body-module mounting. The part variants within the FS6500/FS65 family share the SPI register map, enabling firmware reuse across different board sizes.
Typical applications include automotive body control modules (BCM), gateway ECUs, electric power steering (EPS) sense boards, advanced driver-assistance systems (ADAS) zone controllers, and any 12 V automotive module combining an MCU with CAN/LIN connectivity. The ASIL-B rating also makes it attractive for industrial safety controllers and robotic motor drives requiring CAN communication.
When designing with the MC33FS6523CAE, route the exposed pad to a large copper pour to keep junction temperature in range at peak VIN. Use the SPI interface to set regulator output voltages and read diagnostic flags; the FS65 family registers are documented in the manufacturer datasheet. Verify that the external CAN/LIN bus is ESD-protected for OEM conformance.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the FS6500 family, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MC33FS6523CAE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC33FS6522CAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6524CAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6523LAE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC33FS6513CAE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC33FS6523CAE Valores máximos y características eléctricas
| Product Type | System Basis Chip (SBC) PMIC |
| Topología | DC-DC Step-Down + Linear Regulators + CAN FD + LIN |
| Primary DC-DC Output Current (Vcore) | 2.2 A |
| Rango de tensión de entrada | -0.3 V to 60 V (load-dump tolerant) |
| CAN Physical Layer | CAN FD (up to 5 Mbit/s) |
| LIN Physical Layer | LIN 2.x compliant |
| Control Interface | SPI |
| Functional Safety | ASIL B/D capable (ISO 26262) |
| Encapsulado | 48-HLQFP Exposed Pad (7x7 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (automotive grade) |
| Estado RoHS | Compliant |
| Quiescent Current (Standby) | Ultra-low (see datasheet) |
| Primary Regulator Efficiency | Up to 95% |
| Process Technology | SMARTMOS (NXP automotive) |
Configuración de pines de MC33FS6523CAE
| Pin 1 | VSUP — Battery supply input (12V nominal, 60V load-dump tolerant) |
| Pin 2 | GND — Ground |
| Pin 3 | VCORE_FB — Vcore feedback |
| Pin 4 | VCORE_SW — Vcore switching node |
| Pin 5 | VCORE_BOOT — Bootstrap for Vcore high-side driver |
| Pin 6 | VPRE — Vpre linear regulator output (sensor supply) |
| Pin 7 | VCCA — Vcca linear regulator output (MCU analog supply) |
| Pin 8 | VCAN — CAN transceiver supply |
| Pin 9 | CANH — CAN high bus line |
| Pin 10 | CANL — CAN low bus line |
| Pin 11 | LIN — LIN bus line |
| Pin 12 | VBAT_LIN — LIN supply input |
| Pin 13 | CSB — Chip select bar (SPI) |
| Pin 14 | SCLK — SPI clock |
| Pin 15 | MOSI — SPI master out, slave in |
| Pin 16 | MISO — SPI master in, slave out |
| Pin 17 | INT — Interrupt output to MCU |
| Pin 18 | RST — Reset output to MCU |
| Pin 19 | GPIO1 — General purpose IO |
| Pin 20 | GPIO2 — General purpose IO |
| Pin 21 | GPIO3 — General purpose IO |
| Pin 22 | GPIO4 — General purpose IO |
| Pin 23 | WKUP — Wake-up input |
| Pin 24 | LIMP — Limp home / safety output |
| Pin 25 | FCCU — Fault Collection and Control Unit |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | WAKE2 — Secondary wake input |
| Pin 29 | TX_CAN — CAN transmit data (digital input) |
| Pin 30 | RX_CAN — CAN receive data (digital output) |
| Pin 31 | TX_LIN — LIN transmit data (digital input) |
| Pin 32 | RX_LIN — LIN receive data (digital output) |
| Pin 33 | VSO — Voltage sense output |
| Pin 34 | T_SENSE — Temperature sense |
| Pin 35 | VIO — IO voltage reference |
| Pin 36 | VREF — Voltage reference (precision output) |
| Pin 37 | VDD_MCU — MCU core supply monitor |
| Pin 38 | EN_OUT — Enable out (sequence control) |
| Pin 39 | WD_DIS — Watchdog disable (debug only) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | GND — Ground |
| Pin 43 | GND — Ground |
| Pin 44 | GND — Ground |
| Pin 45 | PAD — Thermal pad (must be soldered to copper pour) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | GND — Ground |
Aplicaciones típicas
MC33FS6523CAE es adecuado para 6 aplicacións: Automotive Body Control Module (BCM), CAN FD Gateway ECU, ADAS Zone Controller ECU, Electric Power Steering (EPS) Sense Board, Industrial Safety PLC / Robot Controller, Automotive Lighting Controller.
Automotive Body Control Module (BCM)
The MC33FS6523CAE is a strong fit for body control modules because it integrates a 2.2 A Vcore buck converter, multiple linear regulators for peripheral rails, and both CAN FD and LIN transceivers into a single 48-HLQFP-EP device. Its 60 V load-dump tolerance on VSUP and ASIL-B/D safety classification allow direct connection to the 12 V automotive bus without an external TVS, while supporting fail-silent operation of door, lighting, and gateway functions. Designers place CAN/LIN bus termination networks close to the IC and use SPI to set regulator trim and read diagnostic flags during production end-of-line tests. The integrated FCCU interface feeds a host Cortex-R MCU for fault collection in compliance with ISO 26262.
Recomendado
CAN FD Gateway ECU
In automotive gateway ECUs that bridge CAN FD, LIN, and other in-vehicle networks, the MC33FS6523CAE's 5 Mbit/s CAN FD physical layer and LIN 2.x transceiver combine with the 2.2 A Vcore output to power the host gateway MCU plus signal-acquisition circuitry. The integrated transceivers eliminate the need for separate CAN and LIN ICs, freeing PCB real estate for higher-density gateway designs that aggregate multiple vehicle bus domains. The FS1B fail-silent topology supports ASIL-B system-level goals for fault-tolerant routing. Pair the SBC with a high-speed CAN FD bus protection IC such as NXP TJA1463 at the connector for OEM conformance.
Recomendado
ADAS Zone Controller ECU
The MC33FS6523CAE targets ADAS zone controllers that aggregate sensor data from radar and cameras around the vehicle. ASIL-B/D readiness, 2.2 A Vcore to feed an image-signal-processor or radar DSP, and integrated CAN FD for sharing sensor data with the central vehicle computer make it a strong match. The SPI-controlled diagnostics and built-in watchdog remove the need for an external supervisor IC, which shrinks BOM and reduces fault paths. Provide a star-ground layout with the exposed pad soldered to a continuous copper pour to keep thermal rise under 30 K at peak current transients.
Recomendado
Electric Power Steering (EPS) Sense Board
EPS sense boards need a regulated MCU rail, deterministic safety response to sensor faults, and a robust CAN FD link to the EPS controller. The MC33FS6523CAE delivers 2.2 A Vcore for the sense MCU, 60 V load-dump tolerance for direct 12 V bus connection, and ASIL-B/D-capable diagnostics including voltage monitoring on every rail. The FS1B fail-silent topology meets functional-safety goals for the steering subsystem. Use SPI from the host MCU to read fault registers and force the SBC into a safe state when out-of-range voltages are detected.
Recomendado
Industrial Safety PLC / Robot Controller
Industrial safety PLCs and robotic motor controllers that require deterministic fault handling benefit from the MC33FS6523CAE's ASIL-B architecture (mapped to industrial SIL via ISO 13849), 2.2 A Vcore for high-performance MCUs, and CAN FD for inter-module communication. The integrated CAN/LIN block reduces PCB area compared with a discrete CAN + LIN + SBC stack, which is critical in panel-mounted controllers where DIN rail space is limited. The exposed-pad HLQFP-48 package handles industrial ambient temperatures with adequate derating.
Recomendado
Automotive Lighting Controller
LED headlamp and adaptive lighting modules use the MC33FS6523CAE to drive an MCU that generates PWM lighting waveforms. Its 60 V load-dump tolerance withstands the harsh 12 V automotive supply environment, and the 2.2 A Vcore comfortably supplies an LED-matrix MCU plus CAN FD link to the body controller. Built-in diagnostics sense thermal runaways and voltage dropouts, supporting diagnostic over CAN (UDS) requirements. Place bypass capacitors within 5 mm of the VSUP and Vcore pins for optimum noise performance.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC33FS6523CAE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC33FS6522CAE | MC33FS6524CAE | MC33FS6523LAE | MC33FS6513CAE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-HLQFP-EP (7x7) | 48-HLQFP-EP (7x7) - same | 48-HLQFP-EP (7x7) - same | 48-HLQFP-EP (7x7) - same | 48-HLQFP-EP (7x7) - same |
| Vcore Output Current | 2.2 A peak | 1.5 A peak (-32%) | 2.5 A peak (+14%) | 2.2 A peak (same) | 2.2 A peak (same) |
| CAN FD Support | Yes (5 Mbit/s) | Yes (5 Mbit/s) | Yes (5 Mbit/s) | Yes (5 Mbit/s) | Yes (5 Mbit/s) |
| LIN Support | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) | Yes (LIN 2.x) |
| Functional Safety | ASIL B/D (FS1B) | ASIL B/D (FS1B) | ASIL B/D (FS1B) | ASIL B/D (FS1B) | ASIL B (FS0B) |
| Vpre Rail (Sensor Supply) | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
Diferenciadores clave
- Highest integrated SBC at 2.2 A Vcore with FS1B fail-silent (frente a MC33FS6522CAE)
- Full-feature FS1B with Vpre sensor rail (frente a MC33FS6513CAE)
- CAN FD + LIN integrated in one IC (frente a MC33FS6513CAE)
Notas de diseño
The HLQFP-48EP package with exposed pad dissipates Vcore losses primarily through the copper-pour contact. At 2.2 A peak with VIN=12 V and Vcore=3.3 V, internal dissipation is on the order of ~1-2 W including quiescent and linear regulators. Stencil-deposit the exposed pad opening on a continuous ~25x25 mm top-layer copper pour, with thermal vias (~0.3 mm drill, 1 mm pitch) stitching to internal layers, to keep the junction below 150C at 85C ambient. Estimated junction temperature with a 25 C/W theta-JA is 111C at 1.5 W - accept for ASIL designs per the safety manual derating rules.
Place VSUP bypass (4.7 uF X7R ceramic, plus 100 nF X7R) within 5 mm of the VSUP pin to handle 60 V load-dump transients. The Vcore inductor must be a low-DCR shielded ferrite (4.7 to 22 uH depending on Vcore voltage) and routed with a 4-layer minimum stackup. CANH/CANL bus traces must be impedance-controlled at 120 ohm differential (per NXP FS65 evaluation board layout) with a 120 ohm termination resistor at the bus ends. Place LIN bus with similar discipline to avoid EMI.
Do not power the MC33FS6523CAE from a laboratory supply without first disabling its internal ISO 7637/16750 load-dump protection - lab supplies lack the series impedance the device expects and may fault. Always ground the exposed pad before applying VSUP to prevent start-up latch. When reverse-battery testing, remember the FS65 internal MOSFET block tolerates -0.3 V reverse - exceeding -1 V can damage the part. Use the SPI registers to confirm Vcore, Vpre, and VCCA are within tolerance before instructing the host MCU to run.
Información de cumplimiento
AEC-Q100 qualified per NXP family documentation; RoHS and REACH compliant per distributor listings. Halogen-free per NXP packaging data.
