MC7447AVS733NB - PowerPC G4 MPU 733MHz 360-FCCLGA | NXP
N.º de pieza: MC7447AVS733NB ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $138 | $1.380,00 |
| 100 | $128.5 | $12.850,00 |
| 500 | $119 | $59.500,00 |
| 1.000 | $109.5 | $109.500,00 |
MC7447AVS733NB Descripción general
A PowerPC G4 microprocessor is a 32-bit RISC CPU that integrates a vector co-processor (AltiVec/VMX) and an L2 cache on-die, providing deterministic performance for networking, telecom, and high-throughput embedded applications. Within the broader product hierarchy, the MPC7447A series sits between the simpler MPC7441 and the higher-clock MPC7447A derivatives, all targeting Power-Architecture low-power system-on-module designs.
Key features of the MC7447AVS733NB include a 733 MHz maximum core frequency, on-die 512 KB L2 cache, hardware-accelerated AltiVec/VMX SIMD engine, 64-bit processor-local bus, and a 1.1 V low-voltage core for reduced power dissipation. It targets 32-bit RISC workloads requiring deterministic latency and vector math acceleration.
Typical applications include Power-Architecture single-board computers, industrial control and instrumentation, telecom line cards, aerospace/defense embedded platforms, and legacy Apple Power Mac G4 upgrades. Its long-lifecycle ceramic FCCLGA packaging suits harsh-environment and extended-temperature deployments.
When designing with this part, verify that the host board supplies the required 1.1 V core rail, plus the MPX bus termination voltages, and that the heatsink solution can dissipate up to approximately 10 W under peak load. Existing MPC7447A design files (firmware, board support packages) can be reused without modification.
This page synthesizes distributor stock data, drop-in same-package alternatives from the MPC7447A family, and design notes distilled from the NXP/Freescale MPC7447A Hardware Specifications to give engineers faster selection context than the datasheet alone.
Alternativas directas para MC7447AVS733NB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC7447AVS733NB (mismo factor de forma y huella) — difiere en Core Processor, Core Supply Voltage, Mounting Type, Number of Cores.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC7447AVU733NB
✅ Sustitución directa✓ En stock
$72 / unidad
Ver hoja de datos →MC7447AVU600NB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AHX1000LB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447ATHX1000NB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AVU867NB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC7447AVS733NB Valores máximos y características eléctricas
| Core Processor | PowerPC G4 |
| Series | MPC74xx |
| Number of Cores | 1 Core, 32-Bit |
| Speed | 733 MHz |
| Co-Processors / DSP | Multimedia; SIMD (AltiVec/VMX) |
| RAM Controllers | None (external memory controller required) |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | None (external MAC required) |
| SATA | None |
| USB | None |
| Core Supply Voltage | 1.1 V |
| On-Chip L2 Cache | 512 KB |
| Processor Bus Width | 64-bit MPX bus |
| Encapsulado / Carcasa | 360-CLGA, FCCLGA (25x25) |
| Tipo de montaje | Surface Mount (ceramic LGA) |
| Part Status | Obsolete |
Guía de configuración de pines de MC7447AVS733NB 360-clga, fcclga (25x25)
Configuración de pines para MC7447AVS733NB (encapsulado 360-clga, fcclga (25x25)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC7447AVS733NB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC7447AVS733NB es adecuado para 6 aplicacións: Legacy Power-Architecture Single-Board Computers, Telecom Line Card Processing, Aerospace and Defense Embedded Platforms, Industrial Control and Instrumentation, High-Performance Embedded Computing (HPEC) Modules, Legacy Apple Power Mac G4 Upgrades.
Legacy Power-Architecture Single-Board Computers
The MC7447AVS733NB's 733 MHz PowerPC G4 core with on-die 512 KB L2 cache and AltiVec SIMD engine suits legacy VME/cPCI single-board computers used in industrial automation and defense. Designers reuse existing PowerPC firmware (U-Boot, VxWorks BSPs) without modification because the MPC7447A family shares the same instruction set and MPX bus protocol. A 1.1 V core rail plus standard MPX bus termination enables drop-in placement on cards that previously shipped with the lower-bin MC7447AVU600NB, delivering approximately 22% higher throughput at the same power budget. The 360-FCCLGA ceramic package withstands conformal coating and extended-temperature operation typical of industrial SBC deployments. The AltiVec 128-bit SIMD engine accelerates signal-processing kernels for sonar, radar, and software-defined radio payloads sharing the same card.
Recomendado
Telecom Line Card Processing
In telecom line cards the MC7447AVS733NB delivers deterministic 733 MHz compute for packet classification, encryption offload prep, and control-plane software. Its 64-bit MPX bus connects to external network processors or framers and supports DMA bursts suited for TDM and packet flows. The AltiVec SIMD engine accelerates bulk crypto operations such as AES rounds and SHA hashes when offloaded from a co-resident communications processor. Power dissipation at 733 MHz with 1.1 V core sits in the 8-10 W window, manageable on a line card with a small aluminum heatsink or top-side airflow. Long-lifecycle FCCLGA packaging suits 10+ year telecom deployments where NXP has committed to continuity of supply via Rochester Electronics for legacy designs.
Recomendado
Aerospace and Defense Embedded Platforms
The MC7447AVS733NB's ceramic 360-FCCLGA package supports the extended temperature and mechanical shock profiles demanded by aerospace and defense embedded platforms. Conduction-cooled conduction-cooled enclosures can mount the FCCLGA on a thermal spreader for direct heat extraction, and the 1.1 V core simplifies redundant power supply design on flight-control and mission-computer cards. AltiVec acceleration reduces CPU count per DSP workload, valuable where Size, Weight, and Power (SWaP) budgets are tight. The 512 KB L2 cache keeps deterministic interrupt latency for real-time control loops at 733 MHz. For new aerospace designs, NXP's QorIQ Layerscape family offers ARM Cortex alternatives, though they require board redesign from the MPC7447A pin map.
Recomendado
Industrial Control and Instrumentation
For industrial PLCs, motion controllers, and test instrumentation, the MC7447AVS733NB combines the deterministic PowerPC architecture with on-die L2 cache to deliver repeatable cycle times for closed-loop control. The 733 MHz core runs full Linux, VxWorks, or QNX with hard-real-time extensions, while AltiVec accelerates DSP-style signal conditioning on raw sensor data. The MPX bus enables direct connection to FPGAs that handle high-speed ADC capture, making the part a natural fit for high-channel-count data-acquisition backplanes. Ceramic FCCLGA packaging tolerates conformal coating and the wide operating-temperature ranges typical of factory-floor deployments.
Recomendado
High-Performance Embedded Computing (HPEC) Modules
HPEC modules targeting radar, sonar, and electronic-warfare signal chains use the MC7447AVS733NB to combine general-purpose control with SIMD-accelerated DSP. AltiVec delivers 128-bit vector math for time-domain and frequency-domain kernels, reducing the number of DSP co-processors required per channel. The 733 MHz clock rate sustains real-time FFT throughput on moderate channel counts, and the 512 KB L2 cache hides latency to external memory on streaming workloads. Multiple MC7447AVS733NB parts on a single OpenVPX or VXS module enable parallel channel processing, and the ceramic FCCLGA package tolerates the shock and vibration of mobile platforms.
Recomendado
Legacy Apple Power Mac G4 Upgrades
The original use case for the MC7447AVS733NB was as an upgrade CPU for Apple Power Mac G4 systems where a 733 MHz PowerPC G4 was the maximum supported speed. Enthusiast and museum/restoration communities use the part to repair or refurbish legacy Power Mac G4 towers and Quicksilver chassis. The 360-FCCLGA package drops into the standard G4 daughter-card socket without board modification, and the 1.1 V core matches the original G4 logic-board regulator design. AltiVec acceleration preserves the multimedia performance that distinguished the G4 family from earlier PowerPC generations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC7447AVS733NB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC7447AVU733NB | MC7447AVU600NB | MC7447AHX1000LB | MC7447ATHX1000NB | MC7447AVU867NB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCLGA (25x25) | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same | 360-FCCLGA (25x25) - same |
| Core Frequency | 733 MHz | 733 MHz | 600 MHz | 1.0 GHz | 1.0 GHz | 867 MHz |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SIMD Engine | AltiVec/VMX (128-bit) | AltiVec/VMX (128-bit) | AltiVec/VMX (128-bit) | AltiVec/VMX (128-bit) | AltiVec/VMX (128-bit) | AltiVec/VMX (128-bit) |
| Processor Bus Width | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX |
| Estimated Power Dissipation | 8-10 W at 733 MHz | 8-10 W at 733 MHz | approx 7 W at 600 MHz | approx 12 W at 1.0 GHz | approx 12 W at 1.0 GHz | approx 9-10 W at 867 MHz |
| Lifecycle Status | Obsolete | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
Diferenciadores clave
- Balanced clock/power trade-off within MPC7447A family (frente a MC7447AVU600NB)
- Lower power than 1.0 GHz bins (frente a MC7447AHX1000LB)
- Same mechanical and pin compatibility across MPC7447A family (frente a MC7447AVU867NB)
Notas de diseño
The MC7447AVS733NB requires a tightly regulated 1.1 V core rail capable of supplying approximately 8-10 A at 733 MHz. Use a multiphase buck converter with ceramic output capacitors placed within 25 mm of the package to limit ripple below 25 mV pk-pk. The MPX bus termination voltage (typically 1.8 V or 2.5 V) and PLL analog supply must be sequenced per the NXP MPC7447A Hardware Specifications; failure to sequence the rails correctly can prevent start-up or trigger latch-up. Decouple each voltage pin pair with 100 nF X7R capacitors plus bulk polymer capacitors on the supply planes.
At 733 MHz and 1.1 V core, the MC7447AVS733NB dissipates approximately 8-10 W. The 360-FCCLGA package dissipates heat through the ceramic substrate and the LGA lands to the PCB; a thermal-management solution (top-side heatsink, conduction-cooled frame, or aluminum cold plate) is required for sustained operation. Verify junction temperature with a thermal sensor or infrared probe during validation, and confirm the heatsink thermal resistance keeps Tj below 105 C at the worst-case workload. For 1.0 GHz drop-in parts (MC7447AHX1000LB, MC7447ATHX1000NB) recheck thermal margin because power scales with frequency and core voltage.
The 360-FCCLGA land pattern requires a high-density PCB with microvia stacks to fan out the 0.8 mm pitch ball array. Use 4-6 layer stack-up with buried capacitance planes and matched-length impedance control on the MPX bus traces (typically 50 ohm single-ended, 100 ohm differential). Reference the NXP MPC7447A hardware-spec layout checklist before fabrication. The ceramic LGA package does not tolerate warpage during reflow; follow the JEDEC J-STD-020 profile for ceramic packages and use a nitrogen reflow atmosphere if available.
Do not assume the MC7447AVS733NB includes a memory controller - it does not; an external bridge (e.g. MPC107, Tundra Tsi107) is required to connect to SDRAM, Flash, and I/O peripherals. When upgrading from a 600 MHz part, confirm firmware initialization tables account for the higher frequency and re-tune the DDR timing registers. If migrating to MC7447AHX1000LB, also verify the 1.0 GHz core PLL configuration matches the existing clock-generation circuit and that the JTAG boundary-scan chain still passes. Finally, since the part is obsolete, qualify a long-term supply source (Rochester Electronics, licensed brokers) before committing to production.
Información de cumplimiento
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the provided distributor data. Industrial and aerospace users should request a compliance letter from the broker (Rochester Electronics or Ampheo) at the time of order.
