MC9S08GT16ACFCE - 40MHz HCS08 8-bit MCU, 16KB Flash | NXP
N.º de pieza: MC9S08GT16ACFCE ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.12 | $4,12 |
| 10 | $3.71 | $37,10 |
| 100 | $3.3 | $330,00 |
| 500 | $2.96 | $1.480,00 |
| 1.000 | $2.64 | $2.640,00 |
| 3.000 | $2.31 | $6.930,00 |
MC9S08GT16ACFCE Descripción general
An 8-bit MCU (microcontroller unit) is a self-contained computing element that integrates a CPU, non-volatile program memory, working RAM, and a rich mix of analog and digital peripherals onto a single silicon die. The MC9S08GT16ACFCE belongs to the S08GT family of low-cost, high-performance general-purpose microcontrollers from NXP. Within the broader taxonomy, an MCU is a sub-class of microcontroller -> microprocessor -> semiconductor -> integrated circuit. The S08 family succeeds the legacy HC08 core while preserving the original HC08 instruction set and adding the BGND instruction for background-debug-mode support, which simplifies in-circuit development and flash programming.
Key features include 16 KB of Flash memory (16K x 8), 2 KB of SRAM, an internal clock source with trim, low-voltage detect (LVD), power-on reset (POR), pulse-width modulation (PWM) channels, a programmable watchdog timer (WDT), and software-selectable pull-ups on all port pins when configured as inputs. The 40-MHz bus frequency delivers 20 MHz effective instruction throughput with the S08's 2-cycle architecture, supporting up to 32 interrupt/reset sources and rapid context switching. The 32-HVQFN package with exposed thermal pad provides a compact footprint (5x5 mm) suitable for high-density PCB designs and offers good thermal dissipation for industrial environments.
Architecturally, the HCS08 core executes the HC08 instruction set with an enhanced bus structure, allowing single-cycle access to on-chip peripherals and Flash memory. The integrated voltage regulator supports wide operating voltages while maintaining low quiescent current, and the on-chip clock generator can be trimmed via a factory-stored value. These characteristics make the MC9S08GT16ACFCE well-suited for battery-powered and energy-conscious applications.
Typical applications include home appliances, white goods control boards, industrial sensor nodes, simple motor control loops, and consumer-electronics user-interface modules where deterministic 8-bit performance, generous Flash, and a small QFN footprint outweigh the need for a 32-bit processor. The wide operating voltage range also supports direct connection to single-cell lithium or multi-cell alkaline battery stacks.
Designers should plan adequate decoupling near the VDD pins and route the exposed pad of the HVQFN package to a solid ground copper pour for thermal and electrical performance. The internal LVD and POR circuits handle brownout and power-on sequencing automatically, reducing external component count.
This page synthesizes distributor availability, parametric specifications, and drop-in alternatives not always collocated on the manufacturer product page - enabling faster design and sourcing decisions for the MC9S08GT16ACFCE.
Alternativas directas para MC9S08GT16ACFCE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08GT16ACFCE (mismo factor de forma y huella) — difiere en Package, RoHS Status, Debug Interface, Number of I/O, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08GT16ACFBE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT16ACFGE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08GT8ACFCE
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08AC16CFGE
✅ Sustitución directa✓ En stock
$2.6 / unidad
Ver hoja de datos →MC9S08AC32CFGE
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MC9S08GT16ACFCE Valores máximos y características eléctricas
| Core | HCS08 (enhanced S08) |
| Core Size | 8-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory Type | Flash |
| Program Memory Size | 16 KB (16K x 8) |
| RAM Size | 2 KB (2K x 8) |
| Supply Voltage (Vcc/Vdd) | 1.8 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +85C (TA) |
| Number of I/O | 34 |
| Encapsulado | 32-HVQFN (5x5 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT |
| Connectivity | I2C, SCI, SPI |
| Interrupt Sources | Up to 32 |
| Instruction Set | HC08 with BGND |
| Estado RoHS | Compliant |
| Lifecycle Stage | Not Recommended for New Designs (NRND) |
Configuración de pines de MC9S08GT16ACFCE
| Pin 1 | PTB0/TCLK1 — Port B bit 0 / Timer channel 1 clock input |
| Pin 2 | PTB1 — Port B bit 1 |
| Pin 3 | PTB2/SPSCK1 — Port B bit 2 / SPI1 clock |
| Pin 4 | PTB3/MOSI1 — Port B bit 3 / SPI1 master out, slave in |
| Pin 5 | PTB4/MISO1 — Port B bit 4 / SPI1 master in, slave out |
| Pin 6 | PTB5/SS1 — Port B bit 5 / SPI1 slave select |
| Pin 7 | PTB6 — Port B bit 6 |
| Pin 8 | PTB7 — Port B bit 7 |
| Pin 9 | VDD — Positive supply (1.8-3.6 V) |
| Pin 10 | VSS — Ground reference |
| Pin 11 | PTA0/TXD1 — Port A bit 0 / SCI1 transmit |
| Pin 12 | PTA1/RXD1 — Port A bit 1 / SCI1 receive |
| Pin 13 | PTA2/SDA — Port A bit 2 / I2C data |
| Pin 14 | PTA3/SCL — Port A bit 3 / I2C clock |
| Pin 15 | PTA4/TPM1CH0 — Port A bit 4 / TPM1 channel 0 |
| Pin 16 | PTA5/TPM1CH1 — Port A bit 5 / TPM1 channel 1 |
| Pin 17 | PTA6 — Port A bit 6 |
| Pin 18 | PTA7 — Port A bit 7 |
| Pin 19 | PTC0/ADP0 — Port C bit 0 / ADC channel 0 |
| Pin 20 | PTC1/ADP1 — Port C bit 1 / ADC channel 1 |
| Pin 21 | PTC2/ADP2 — Port C bit 2 / ADC channel 2 |
| Pin 22 | PTC3/ADP3 — Port C bit 3 / ADC channel 3 |
| Pin 23 | PTC4/ADP4 — Port C bit 4 / ADC channel 4 |
| Pin 24 | PTC5/ADP5 — Port C bit 5 / ADC channel 5 |
| Pin 25 | PTC6/ADP6 — Port C bit 6 / ADC channel 6 |
| Pin 26 | PTC7/ADP7 — Port C bit 7 / ADC channel 7 |
| Pin 27 | PTD0/ADP8 — Port D bit 0 / ADC channel 8 |
| Pin 28 | PTD1/ADP9 — Port D bit 1 / ADC channel 9 |
| Pin 29 | PTD2/KBI0 — Port D bit 2 / Keyboard interrupt 0 |
| Pin 30 | PTD3/KBI1 — Port D bit 3 / Keyboard interrupt 1 |
| Pin 31 | RESET — Reset input, active low |
| Pin 32 | EPAD — Exposed thermal pad - tie to VSS |
Aplicaciones típicas
MC9S08GT16ACFCE es adecuado para 7 aplicacións: Home Appliance Control Board, Industrial Sensor Node, Consumer Electronics User Interface, Battery-Powered Wireless Sensor, Simple Motor Control Loop, White Goods / Smart Metering Edge Node, Automotive Body Electronics (Non-Safety).
Home Appliance Control Board
The MC9S08GT16ACFCE fits home-appliance control boards because its 40 MHz HCS08 core delivers deterministic 8-bit performance at low BOM cost, and the 16 KB Flash stores washing-machine cycle tables, dry-cycle profiles, and small UI state machines. Its 2 KB RAM buffers sensor samples and HMI button matrices. The 1.8-3.6 V supply window lets the MCU run from a single-cell Li-ion backup during power-line brownouts while the integrated LVD and POR circuits handle brownout recovery. The 10-channel 12-bit ADC reads thermistor, water-level, and motor-current inputs. Compared with discrete HC08 designs, the integrated HCS08 core and on-chip peripherals reduce part count while the 32-HVQFN (5x5) package fits inside the tight control-box enclosures typical of front-load washers and dishwashers.
Recomendado
Industrial Sensor Node
The MC9S08GT16ACFCE powers low-cost industrial sensor nodes measuring temperature, pressure, or flow because the HCS08 core runs the 4-20 mA loop protocol, HART stack fragment, or IO-Link device firmware at 40 MHz with deterministic interrupt latency across the 32 source slots. Its 34 I/O pins accommodate multiple SPI sensors, an I2C EEPROM for calibration data, and UART connectivity to a host PLC. The wide 1.8-3.6 V supply supports direct connection to 24 V industrial rails via a 3.3 V LDO downstream. The -40C to +85C operating range meets the industrial environment, and the 32-HVQFN exposed pad dissipates heat generated when the MCU wakes at full 40 MHz to perform measurements. This is a drop-in design win over older HC908 designs at the same price tier.
Recomendado
Consumer Electronics User Interface
The MC9S08GT16ACFCE drives consumer-electronics UI modules - remote controls, microwave keypads, and air-conditioner thermostats - because the 34 GPIO pins handle matrix keypads, LED row/column drivers, and IR transmit/receive circuits simultaneously without external I/O expanders. The 16 KB Flash holds UI state machines, beep patterns, and small display fonts. The integrated PWM channels drive LED backlights and buzzer tones. The 1.8-3.6 V supply range supports two AA cells or a single Li-ion directly, while the low quiescent current extends battery life. The compact 32-HVQFN (5x5) footprint enables slim remote-control form factors, and the wide -40C to +85C operating range covers outdoor thermostats and garage-door keypads.
Recomendado
Battery-Powered Wireless Sensor
The MC9S08GT16ACFCE serves battery-powered wireless sensor endpoints such as door/window contact sensors, and simple weather stations because its 1.8-3.6 V wide supply matches single-cell CR2032 and 2x AA battery chemistries without boost converters. The HCS08 core's fast wake-up from stop modes extends battery life, while the 40 MHz peak clock bursts through sub-GHz radio packet handling. The 16 KB Flash holds radio configuration plus simple encryption routines, and 2 KB RAM buffers sensor data. The integrated WDT and LVD protect against battery droop. The 32-HVQFN (5x5) footprint fits inside miniaturized sensor enclosures, and the SCI/SPI ports connect directly to popular sub-GHz transceivers without glue logic.
Recomendado
Simple Motor Control Loop
The MC9S08GT16ACFCE handles small brushed-DC and stepper motor control loops in fans, pumps, and small appliances because its 10-channel 12-bit ADC reads back-EMF and current-sense signals while the PWM channels drive H-bridges or stepper drivers at up to 40 MHz peripheral bus speed. The 34 I/O pins support end-stop switches, quadrature encoders, and tachometer feedback. The 16 KB Flash stores trapezoidal velocity profiles and ramp tables, and the 2 KB RAM buffers motion trajectories. The 1.8-3.6 V supply tolerates 24 V industrial bus rails after regulation, and the -40C to +85C temperature range suits under-hood automotive and outdoor industrial environments where competing 8-bit MCUs without proper qualification often fail.
Recomendado
White Goods / Smart Metering Edge Node
The MC9S08GT16ACFCE anchors white-goods and smart-metering edge nodes where deterministic 8-bit processing, low cost, and an extended industrial temperature range are essential. The HCS08 core executes metering algorithms, calibration, and simple tamper-detection routines at 40 MHz, while the integrated 12-bit ADC reads CT/VT inputs. The 16 KB Flash holds firmware update images and signed firmware bootloaders. The 2 KB RAM buffers pulse counts and load-profile data. The 32-HVQFN (5x5) footprint enables slim metering form factors, and the 1.8-3.6 V supply window is ideal for direct 3.3 V regulation from the meter's main supply rail. The LVD and POR circuits simplify external reset circuitry.
Recomendado
Automotive Body Electronics (Non-Safety)
The MC9S08GT16ACFCE can serve non-safety automotive body modules such as ambient lighting controllers, seat-position memories, and HVAC blend-door actuators because its -40C to +85C operating range tolerates cabin temperatures. The 34 I/O pins drive LED strings, button matrices, and small DC motor bridges. The HCS08 core runs simple LIN slave stacks via UART, and the 16 KB Flash holds configuration tables. The 1.8-3.6 V supply accepts regulated 12 V battery rails after a 3.3 V LDO. The 32-HVQFN (5x5) package fits inside limited-footprint PCBAs behind dashboards. Note that AEC-Q100 grade 0/1 qualification is required for safety-relevant modules - for those, choose a Kinetis E or S32K part instead.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08GT16ACFCE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08GT16ACFBE | MC9S08GT16ACFGE | MC9S08GT8ACFCE | MC9S08AC16CFGE | MC9S08AC32CFGE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-HVQFN (5x5) | 32-HVQFN (5x5) - same | 32-HVQFN (5x5) - same | 32-HVQFN (5x5) - same | 32-HVQFN (5x5) - same | 32-HVQFN (5x5) - same |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| Max CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB | 32 KB (+100%) |
| RAM Size | 2 KB | 2 KB | 2 KB | 1 KB (-50%) | 2 KB | 2 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Number of I/O | 34 | 34 | 34 | 34 | 34 | 34 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | Active | Active | NRND | Active | Active |
Diferenciadores clave
- Largest Flash in the GT16A sub-family at 16 KB (frente a MC9S08GT8ACFCE)
- GT family branding with long-term NXP support infrastructure (frente a MC9S08AC16CFGE)
- Same 32-HVQFN footprint across the entire S08GT16A family (frente a MC9S08GT16ACFDE)
Notas de diseño
Place a 100 nF decoupling capacitor as close as possible to every VDD pin and a bulk 4.7 uF ceramic at the supply rail. The 32-HVQFN exposed thermal pad must be soldered to a continuous ground copper pour of at least 1 square inch for proper heat dissipation and electrical ground return. Estimated: at 40 MHz internal bus, the HCS08 core draws roughly 20 mA, so a 3.3 V linear regulator with at least 50 mA headroom is recommended.
Do not leave the RESET pin floating - tie it to VDD through a 10 kohm pull-up with a 100 nF capacitor to ground for a clean power-on reset. Configure unused I/O pins as outputs driven low to minimize current consumption in stop modes. Programming pins (BKGD, SDA/SCL if used) require external pull-ups during flash programming; NXP's BDM debugger expects 4.7 kohm pull-ups on the BKGD pin.
Route analog ADC inputs away from PWM and digital switching signals on adjacent PCB layers to avoid crosstalk. The HCS08 ADC achieves 12-bit effective resolution only when the analog supply is well-decoupled and traces are kept short - use a guard ring around ADC traces connected to analog ground. The exposed pad's ground copper also serves as the reference plane for ADC accuracy, so do not split this pour.
Estimated: at 40 MHz bus and typical peripherals active, the HCS08 core dissipates approximately 50 mW. The 32-HVQFN package's theta_JA of approximately 35 C/W yields a 1.75 C junction rise over ambient at room temperature - well within the 85 C ceiling. Above 70 C ambient, ensure airflow across the MCU or de-rate the peripheral clock to reduce self-heating.
Información de cumplimiento
RoHS compliant per DigiKey product page. Not AEC-Q100 qualified - for automotive safety applications, migrate to a Kinetis E or S32K part. Reach compliance declared by NXP.
