MC9S12E256CFUE - HCS12 25MHz 256KB Flash MCU | NXP | 80-QFP
N.º de pieza: MC9S12E256CFUE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
MC9S12E256CFUE Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals onto one silicon die. The HCS12 architecture is the 16-bit evolution of NXP/Freescale's HC12 family; it sits in the broader taxonomy of embedded microcontrollers -> microprocessors -> semiconductor ICs. The MC9S12E256CFUE specifically uses the HCS12 CPU core with background debug mode (BDM) for non-intrusive in-circuit development, and its 16-bit registers and rich peripheral set make it well suited to automotive body controllers, industrial sensor aggregators, and consumer appliance control.
Key features include: 25 MHz bus speed yielding 25 MIPS of throughput, 256 KB of byte-erasable Flash, 16 KB of RAM and 4 KB of EEPROM, an 8-channel 10-bit ADC with 7 us conversion time, three SCI (UART) modules for multi-node serial networking, one SPI up to 5 MHz, one IIC up to 400 kHz, three TIM/PWM blocks for motor and lighting control, and an on-chip voltage regulator supporting 3.3 V-5 V single-supply operation. The 80-QFP (14x14) footprint provides generous I/O access while keeping PCB area compact.
The HCS12 core implements a Von Neumann architecture with a 16-bit ALU, dedicated index registers X/Y/SP/PC, and a hardware multiplier/divider that accelerates DSP-style routines. The device also includes a periodic interrupt timer (PIT) for RTOS tick generation, a watchdog timer, and low-voltage reset to improve field reliability. Background Debug Mode allows flash programming and breakpoints without external probes, reducing manufacturing test cost.
Typical applications for the MC9S12E256CFUE include industrial sensor hubs, automotive body and chassis ECUs, HVAC control boards, motor and pump controllers, and consumer appliances. The 256 KB Flash accommodates moderate protocol stacks (CAN, LIN, custom serial), while 16 KB RAM supports buffering for display or network traffic.
Design consideration: place decoupling capacitors (100 nF plus 4.7 uF bulk) within 5 mm of every VDD/VSS pair, route the BDM pins to a 6-pin standard debug header, and budget 25 MHz trace length matching when the oscillator drives external loads.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Distributor prices below are listed as of 2026-10-18.
Alternativas directas para MC9S12E256CFUE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S12E256CFUE (mismo factor de forma y huella) — difiere en Package, RAM Size, Operating Temperature, Supply Voltage, Core.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S12E128CFUE
✅ Sustitución directa✓ En stock
$10.65 / unidad
Ver hoja de datos →MC9S12E64CFUE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12E100CFUE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12E256CFUE Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | HCS12 / MC9S12E |
| Core Processor | HCS12 (16-bit) |
| Core Size | 16-bit |
| Maximum Bus Frequency | 25 MHz |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 16 KB |
| EEPROM Size | 4 KB |
| Number of I/O Pins | 60 (approx., package-dependent) |
| Data Converters | A/D 8x10-bit |
| Connectivity | 3x SCI (UART), 1x SPI, 1x IIC |
| Timers/PWM | 3x TIM (4-channel 16-bit), 1x 6-channel 8-bit PWM |
| Tensión de alimentación de funcionamiento | 2.5 V core (5 V I/O tolerant) |
| Encapsulado | 80-QFP (14x14 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Estado RoHS | Compliant |
Guía de configuración de pines de MC9S12E256CFUE 80-qfp (14x14 mm)
Configuración de pines para MC9S12E256CFUE (encapsulado 80-qfp (14x14 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S12E256CFUE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S12E256CFUE es adecuado para 6 aplicacións: Automotive Body Control Module, Industrial Sensor Hub, HVAC and Appliance Control Board, Motor and Pump Controller, Consumer Appliance User Interface, Battery-Powered Remote Sensor Node.
Automotive Body Control Module
The MC9S12E256CFUE fits automotive body ECUs because its HCS12 core delivers 25 MHz of deterministic 16-bit processing for real-time tasks like seat/door/lamp control, while 256 KB Flash holds body-control firmware plus a CAN/LIN secondary-bootloader stub. The 8-channel 10-bit ADC reads multiplexed sensor inputs (door switches, potentiometers) with 7 us conversion time. Unlike higher-end S12X parts, the E256 keeps the BOM simple with a single 5 V rail and integrated voltage regulator. Pair it with an external LIN transceiver (e.g., TJA1027) for body network nodes.
Recomendado
Industrial Sensor Hub
In factory sensor aggregation, the MC9S12E256CFUE's three SCI modules serve as UARTs to bridge RS-485 / RS-232 sensor clusters, while SPI drives a fast external ADC or DAC and IIC reads local EEPROM. 16 KB RAM buffers streaming sensor data before forwarding to a host PLC over Modbus RTU. The 25 MHz HCS12 core handles multi-protocol framing without RTOS overhead. Industrial -40C to +85C rating plus the 80-QFP's thermal margin suit sealed control cabinets. Pair with a 3.3 V RS-485 transceiver for industrial fieldbus nodes.
Recomendado
HVAC and Appliance Control Board
The MC9S12E256CFUE is well matched to HVAC and home appliance controllers because its three 4-channel 16-bit TIM modules generate precise PWM for triac-fired heater elements, fan motors, and valve actuators. The 6-channel 8-bit PWM block drives LED indicators and display backlights directly. 256 KB Flash stores user-interface state machines, while 4 KB EEPROM retains user-set temperature and timer values across power cycles. The wide 5 V-tolerant I/O simplifies direct interface to mains-isolated optotriac drivers.
Recomendado
Motor and Pump Controller
Pump and small-motor controllers benefit from the MC9S12E256CFUE's combination of three TIM modules for back-EMF sensing, six 8-bit PWM channels for low-side FET drive, and an 8-channel ADC for current/voltage feedback. The 25 MHz HCS12 core runs sensorless trapezoidal commutation algorithms in firmware, while 16 KB RAM holds commutation state tables for brushless DC control loops. The internal voltage regulator simplifies 24 V industrial-rail designs when paired with a front-end buck converter.
Recomendado
Consumer Appliance User Interface
Front-panel UI boards for washers, ovens, and coffee machines use the MC9S12E256CFUE to drive character LCDs or 7-segment displays via SPI, scan capacitive or resistive keypads via the 10-bit ADC, and talk to the main power board over UART. The 256 KB Flash accommodates multi-language UI strings and rotary-knob debounce state machines. BDM background-debug mode speeds firmware iteration in production. The 80-QFP footprint gives board designers enough I/O for keypad + LCD + buzzer without external I/O expanders.
Recomendado
Battery-Powered Remote Sensor Node
In battery-powered sensor remotes, the MC9S12E256CFUE's low-power HCS12 core with periodic interrupt timer (PIT) enables duty-cycled sleep modes that drop consumption to single-digit mA between transmissions. The 8-channel ADC reads environmental sensors (temperature, humidity, light), while one SCI/UART drives a low-power RF module such as a sub-GHz transceiver. 256 KB Flash accommodates OTA update slots for protocol changes. Pair with a primary lithium cell and an LDO for multi-year field deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S12E256CFUE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S12E128CFUE | MC9S12E64CFUE | MC9S12E100CFUE |
|---|---|---|---|---|
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 256 KB | 128 KB | 64 KB | 100 KB |
| RAM | 16 KB | 16 KB | 8 KB | 12 KB |
| EEPROM | 4 KB | 2 KB | 1 KB | 2 KB |
| ADC | 8x 10-bit | 8x 10-bit | 8x 10-bit | 8x 10-bit |
| CAN Module | No | No | No | No |
| Approximate 1k-unit Price (USD) | $9.75 | Lower | Lower | Lower |
Diferenciadores clave
- Largest Flash in the 80-QFP HCS12E sub-family (frente a MC9S12E128CFUE)
- Highest RAM in the 80-QFP HCS12E sub-family (frente a MC9S12E64CFUE)
- Maintains HCS12 simplicity without XGATE co-processor (frente a MC9S12XA256CAAR)
Notas de diseño
The MC9S12E256CFUE integrates an on-chip voltage regulator that derives the 2.5 V core supply from a single external 5 V rail; place a 100 nF decoupling capacitor within 5 mm of every VDD/VSSX pair and add a 4.7 uF bulk capacitor near the regulator input pin. Designers who pull 5 V from a noisy switching source should add an LC pi-filter to keep digital switching noise out of the MCU analog references. Do not connect external loads to the internal regulator output.
Route the BDM (Background Debug Mode) pins to a standard 6-pin header (VCC, GND, BKGD, MODC, RESET, NC) placed at the board edge for in-circuit flash programming. Keep oscillator trace lengths under 10 mm and guard the EXTAL/XTAL pair with a ground pour to avoid EMI coupling. Place the ADC reference decoupling (0.1 uF + 1 uF ceramic) within 3 mm of the VRH/VRL pins and avoid switching signals under the analog ground pour.
When driving external peripherals via SPI at the maximum 5 MHz bus rate, keep SPI trace lengths matched within 25 mm and add 33 ohm series resistors at the driver outputs to dampen reflections. For IIC buses longer than 50 mm or with multiple slaves, enable the internal pull-ups only as a fallback - external 4.7 kohm pull-ups to VDD provide cleaner rise times for 400 kHz Fast-Mode operation.
Do not write to the Flash while executing code from the same Flash bank without first enabling the Flash page-erase protection mechanism - unintended writes can corrupt the firmware. Set the COP watchdog in production firmware to recover from hung states, and never leave the MODC pin floating during reset - tie it to ground for normal single-chip mode or to VDD for expanded modes per the NXP datasheet.
Información de cumplimiento
RoHS compliance per NXP product page; the MC9S12E256CFUE is not AEC-Q100 qualified (use S12XE or S12XS derivatives for automotive).