MC9S12E256MFUE - 16-bit HCS12 MCU 256KB Flash 80-QFP | NXP
N.º de pieza: MC9S12E256MFUE ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.6312 | $8,63 |
| 10 | $7.85 | $78,50 |
| 100 | $6.63 | $663,00 |
| 500 | $5.92 | $2.960,00 |
| 1.000 | $5.45 | $5.450,00 |
MC9S12E256MFUE Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and peripheral interfaces into one IC. Within the embedded hierarchy, the MC9S12E256 belongs to the 16-bit automotive-grade MCU class, sitting between 8-bit microcontrollers and 32-bit ARM Cortex-M devices. It targets cost-sensitive applications that require deterministic interrupt latency, CAN-style connectivity, and on-chip analog without the software complexity of an RTOS-driven Cortex platform.
Key features include 256KB of byte-erasable Flash EEPROM supporting in-application reprogramming, 60 general-purpose I/O lines, an external bus interface (EBI/EMI) for memory expansion, a periodic interrupt timer, a watchdog timer, and an on-chip voltage regulator for single 5V or 3.3V supply operation. The HCS12 CPU delivers 25 MHz performance with BDM (Background Debug Mode) for non-intrusive in-circuit debugging.
The MC9S12E256 family uses a von-Neumann architecture with a 16-bit ALU, 20-bit addressing via PPAGE/GPAGE registers, and hardware-based multiply/divide instructions. The integrated Flash controller supports fast page erase and program operations, and the chip-level ESD rating exceeds HBM 2 kV, meeting AEC-Q100 expectations for underhood automotive electronics.
Typical applications include automotive body controllers, instrument cluster MCUs, HVAC control modules, central body electronics, industrial PLC I/O expanders, and CAN node peripherals. The wide operating temperature range (-40C to +125C) makes it well-suited for engine-bay and chassis-mounted ECUs.
When designing with this part, ensure the BDM interface is accessible via a 6-pin header for production firmware updates, and observe the recommended decoupling network of 100 nF + 10 uF near each VDD pin. Note that the part is marked Obsolete by some sources, so verify lifecycle status before committing to new designs.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para MC9S12E256MFUE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S12E256MFUE (mismo factor de forma y huella) — difiere en Package, Connectivity, Timer Modules, Core Processor, IIC Modules.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S12E256CFUE
✅ Sustitución directa✓ En stock
$9.75 / unidad
Ver hoja de datos →MC9S12E256VFUE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8.57 / unidad
Ver hoja de datos →MC9S12E256MPVE
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$18.2 / unidad
Ver hoja de datos →MC9S12E256MFUE Valores máximos y características eléctricas
| Core Processor | HCS12 |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Maximum CPU Speed | 25 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 16 KB |
| Number of I/O Pins | 60 |
| Encapsulado | 80-LQFP (14x14 mm) |
| Tipo de montaje | Surface Mount |
| Tensión de alimentación | 3.3 V / 5 V |
| Temperatura de funcionamiento | -40C to +125C (Automotive) |
| Connectivity | EBI/EMI, I2C, SCI, SPI |
| Peripherals | POR, PWM, WDT, 10-bit ADC |
| PWM Channels | 6 |
| Timer Modules | 3 x TIM (4-channel, 16-bit) |
| SCI Modules | 3 |
| SPI Modules | 1 |
| IIC Modules | 1 |
| ADC Resolution | 10-bit |
| Estado RoHS | ROHS3 Compliant |
Guía de configuración de pines de MC9S12E256MFUE 80-lqfp (14x14 mm)
Configuración de pines para MC9S12E256MFUE (encapsulado 80-lqfp (14x14 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S12E256MFUE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S12E256MFUE es adecuado para 6 aplicacións: Automotive Body Control Module, HVAC Control Module, Instrument Cluster MCU, Industrial PLC I/O Expander, CAN Node Peripheral, Automotive Seat Control Module.
Automotive Body Control Module
The MC9S12E256MFUE's 256KB Flash, 60 I/O lines, three SCI channels, and 6-channel PWM are well-matched to a centralized body control module that drives door locks, lighting relays, mirror adjusters, and wiper motors. Its -40C to +125C automotive temperature grade and HCS12 BDM debug port let engineers field-update door-zone firmware via the CAN-style SCI bus while maintaining underhood thermal margin. Pin-compatible S12 family variants allow scaling to 8-pinless BCMs without PCB redesign.
Recomendado
HVAC Control Module
In HVAC control modules, the MC9S12E256MFUE's 10-bit ADC reads mixed-temperature sensors and potentiometers while the three 16-bit timers drive triac-fired blower-speed PWM signals. Its 16KB RAM supports lookup-table-based PID loops for cabin climate control, and the HCS12 CISC instruction set simplifies bit-manipulation of multi-zone mode registers. The wide VIN tolerance (single 5V supply) eliminates the need for an external LDO in 12V-battery automotive systems.
Recomendado
Instrument Cluster MCU
The MC9S12E256MFUE is frequently deployed as the secondary MCU behind instrument clusters, handling gauge stepper-motor drive and telltale LED multiplexing via its PWM and GPIO resources. Its 25 MHz HCS12 core provides deterministic interrupt response for CAN message turnaround, while the 256KB Flash holds graphics-state tables and diagnostic trouble code buffers. The on-chip 10-bit ADC samples fuel-level and thermistor inputs with adequate resolution for cockpit telemetry.
Recomendado
Industrial PLC I/O Expander
Beyond automotive, the MC9S12E256MFUE serves as a sub-MCU in industrial PLC distributed-I/O racks, where its three SCI channels enable daisy-chained RS-485 polling and the SPI port interfaces to digital-isolator front-ends. The 80-LQFP package gives ample GPIO for 32 opto-isolated inputs and 16 MOSFET-driven outputs, while the HCS12's hardware multiply accelerates 16-bit PID setpoint math. Its deterministic interrupt latency outperforms Cortex-M0 in scan-time-critical PLC scan loops.
Recomendado
CAN Node Peripheral
As a CAN-node peripheral MCU, the MC9S12E256MFUE pairs with an external CAN transceiver to provide a smart sensor or actuator interface with local preprocessing. The three SCI channels handle firmware update, debug, and auxiliary serial links, while the 16-bit timers generate precise PWM outputs for proportional valve control. Its 256KB Flash accommodates CANopen or J1939 stack libraries plus application logic.
Recomendado
Automotive Seat Control Module
In seat-control modules, the MC9S12E256MFUE drives multiple brushed-DC motors for seat-position memory, lumbar pumps, and heating elements through its 6-channel PWM and SCI-controlled relay logic. The 256KB Flash stores user-position presets and end-of-line calibration data, while the 10-bit ADC reads Hall-effect position sensors with sufficient accuracy for 0.1 mm repeatability. Pin compatibility with the broader MC9S12E family supports hardware scaling across trim levels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S12E256MFUE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S12E256CFUE | MC9S12E256VFUE | MC9S12E256MPVE |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 80-LQFP (14x14 mm) | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same |
| Core Processor | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) - same | HCS12 (16-bit CISC) - same | HCS12 (16-bit CISC) - same |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM Size | 16 KB | 16 KB | 16 KB | 16 KB |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +70C | Automotive -40C to +125C | Automotive -40C to +125C |
Diferenciadores clave
- Automotive temperature grade in the same LQFP package (frente a MC9S12E256CFUE)
- Larger Flash and RAM versus lower-memory siblings (frente a MC9S12E32CFU)
- Triple SCI + SPI + IIC connectivity in one device (frente a MC9S12E64MFU)
Notas de diseño
The MC9S12E256MFUE integrates an on-chip voltage regulator that accepts a single 5V supply on the VDDR pin and produces the 2.5V internal core voltage. Place a 100 nF + 10 uF decoupling network within 5 mm of every VDD/VSS pair to suppress switching noise from the internal regulator. The VDDA/VSSA pins powering the 10-bit ADC require an additional ferrite bead and dedicated 100 nF cap for analog noise isolation, especially when sampling low-amplitude sensor signals.
Route the BDM (Background Debug Mode) interface to a 6-pin standard header (BKGD, GND, RESET, VDD, PD, ALERT) to enable in-circuit firmware updates and debug during production. Keep the BDM trace length under 50 mm and shield it from PWM and ADC analog traces. The 80-LQFP package offers ample board real estate; however, ensure all 60 GPIO have proper ESD protection (TVS diodes) since automotive load-dump events can exceed 8 kV HBM.
Do not exceed the absolute maximum junction temperature of 150C; in sealed enclosures at 1W dissipation this can be reached with only modest ambient rises. The HCS12's 20-bit addressing via PPAGE/GPAGE registers can cause subtle bugs if the C compiler startup code is misconfigured - always verify with the Freescale/NXP CodeWarrior or Cosmic toolchain. The Flash EEPROM endurance is rated for 10,000 program/erase cycles, so use wear-levelling for non-volatile data storage rather than rewriting Flash on every event.
Información de cumplimiento
ROHS3 compliant per IC-Components distributor data. AEC-Q100 automotive qualification implied by -40C to +125C automotive temperature grade in the suffix 'M' designation, though no explicit certificate number was found in the verified web data. Reach and halogen status not stated in available sources.
