MCF5281CVF66 - 32-bit ColdFire V2 MCU 256KB Flash 66MHz | NXP
N.º de pieza: MCF5281CVF66 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $23.1 | $2.310,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $19.85 | $19.850,00 |
MCF5281CVF66 Descripción general
A ColdFire microcontroller is a 32-bit microprocessor core based on the Motorola 68000 instruction set architecture, optimized for embedded control with low power consumption and high code density. The MCF5281 sits within the broader taxonomy of 32-bit MCU -> microcontroller -> embedded processor -> semiconductor, targeting connected industrial and building-automation designs where deterministic response and Ethernet/CAN connectivity are required.
Key features include 256 KB (256K x 8) Flash program memory, 8 KB SRAM data memory, 10/100 Mbps Fast Ethernet MAC with MII/RMII interface, two CAN 2.0B controllers, four DMA channels, a 16-channel eTPU timer co-processor for complex timing, an 8-channel 10-bit ADC, and an integrated Phase-Locked Loop (PLL) clock generator. The ColdFire V2 core delivers 56 MIPS (Dhrystone 2.1) at 66 MHz while consuming very low active power, suitable for fanless industrial nodes.
The device integrates a 32-bit ColdFire V2 core with 4 GB unified address space, hardware multiply/accumulate, hardware divider, and JTAG/BDM debug interface. It uses a 3.3 V I/O supply with 1.5 V internal core voltage generated by the on-chip voltage regulator. The 256-MAPBGA package exposes a wide external bus (EMAC) for SDRAM and external peripherals, with PCI Revision 2.2 bus support on select package variants.
Typical applications include industrial Ethernet I/O blocks, building-automation controllers (BACnet, Modbus TCP), CAN-based motor and sensor gateways, point-of-sale terminals, and serial-to-Ethernet protocol converters. The 256 KB Flash is well suited to IPv4/IPv6 stacks with TLS, BACnet, and CANopen firmware profiles typical of these markets.
When designing with this part, allocate careful PCB layout for the BGA substrate escape and use at least four PCB layers with a continuous ground plane under the package. The integrated Ethernet MAC still requires an external PHY magnetics, RJ-45 jack, and termination network; the CAN transceivers and pull-ups are also external.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing the MCF5281CVF66 in 2026.
Alternativas directas para MCF5281CVF66 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF5281CVF66 (mismo factor de forma y huella) — difiere en Core Architecture, Program Memory, I2C, UART, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF5282CVF66
✅ Sustitución directa✓ En stock
$39.5 / unidad
Ver hoja de datos →MCF5280CVF66
✅ Sustitución directa✓ En stock
$15.2 / unidad
Ver hoja de datos →MCF5281CVF80
✅ Sustitución directa✓ En stock
$10.4 / unidad
Ver hoja de datos →MCF5216CVF66
✅ Sustitución directa✓ En stock
$17.25 / unidad
Ver hoja de datos →MCF5281CVF66 Valores máximos y características eléctricas
| Core Architecture | ColdFire V2 (32-bit) |
| Frecuencia de reloj máxima | 66 MHz |
| Program Memory | 256 KB Flash (256K x 8) |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage (I/O) | 3.3 V |
| Operating Voltage (Core) | 1.5 V (internal LDO) |
| Ethernet MAC | 10/100 Mbps Fast Ethernet (MII/RMII) |
| CAN Controllers | 2 x CAN 2.0B |
| UART | 3 x UART |
| I2C | 2 x I2C |
| SPI | 1 x QSPI |
| DMA Channels | 4 channels |
| ADC | 8-channel, 10-bit |
| Timers | 16-channel eTPU + GPT |
| Encapsulado | 256-MAPBGA (17x17 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Guía de configuración de pines de MCF5281CVF66 256-mapbga (17x17 mm)
Configuración de pines para MCF5281CVF66 (encapsulado 256-mapbga (17x17 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF5281CVF66.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF5281CVF66 es adecuado para 6 aplicacións: Industrial Ethernet I/O Block, Building Automation Controller, CAN-to-Ethernet Protocol Converter, Point-of-Sale Terminal Controller, Industrial Sensor Hub with Ethernet, Remote Equipment Telemetry Unit (RTU).
Industrial Ethernet I/O Block
The MCF5281CVF66 fits industrial I/O gateways because its integrated 10/100 Mbps Ethernet MAC and 66 MHz ColdFire V2 core deliver roughly 56 MIPS, enough to run a TCP/IP stack plus BACnet or Modbus TCP firmware within the 256 KB Flash budget. Designers commonly pair the part with an external PHY (KSZ8041 or DP83848), a 25 MHz crystal, and an SDRAM bank on the external bus to maintain connection tables. Unlike a Cortex-M3 design that requires an external MAC, this part saves PCB real estate; however, expect to provision a 4-layer PCB with a solid ground plane for the MAPBGA fan-out.
Recomendado
Building Automation Controller
The MCF5281CVF66's dual CAN 2.0B controllers and three UARTs make it a strong fit for BACnet, LonWorks, or KNX gateway designs in HVAC and lighting controllers. With 8 KB of SRAM the MCU handles modest automation databases in-place, while 256 KB Flash accommodates BACnet/IP and Modbus TCP application stacks. Placed on a 3.3 V rail with proper CAN transceiver isolation (e.g., TJA1050), the device drives typical building-automation polling rates under 1 ms. Compared to a discrete Ethernet plus CAN solution, this single-chip integration reduces BOM and simplifies EMC compliance.
Recomendado
CAN-to-Ethernet Protocol Converter
Industrial protocol converters leverage the MCF5281CVF66 to bridge CANopen or DeviceNet on the CAN bus to Modbus TCP or HTTP on Ethernet. The hardware multiply/accumulate unit accelerates CRC and checksum routines critical for industrial protocols, while the 16-channel eTPU produces accurate CAN bit timing without CPU intervention. In typical 1 Mbps CAN-to-Ethernet bridging the 66 MHz core leaves ~30% headroom for diagnostics; designers wire the CAN transceivers through galvanic isolation (e.g., ADuM1411) for site-survivable operation.
Recomendado
Point-of-Sale Terminal Controller
The MCF5281CVF66 powers mid-range point-of-sale terminals by combining Ethernet MAC, multiple UARTs (for cash drawer, barcode scanner, magnetic-stripe reader), and SPI (for contactless card reader) in a single chip. The 256 KB Flash stores transaction firmware, the 8 KB SRAM caches order-line data, and the eTPU generates keypad-debounce timing in hardware. With the BGA package dissipating roughly 0.3 W under typical POS load, the part runs cool in sealed enclosures without forced airflow.
Recomendado
Industrial Sensor Hub with Ethernet
Deploying the MCF5281CVF66 in industrial sensor hubs, designers combine its 8-channel 10-bit ADC with dual CAN and Ethernet to aggregate analog/digital sensor data from multiple machines. The on-chip DMA channels move ADC samples to memory without CPU involvement, leaving cycles for protocol conversion and web server tasks. Estimated: at 1 MSPS aggregate ADC throughput and 100 Mbps Ethernet, CPU utilization stays below 70%. The wide 32-bit external bus also supports an external FIFO buffer for bursty sensor streams.
Recomendado
Remote Equipment Telemetry Unit (RTU)
Remote telemetry units for utility and oilfield automation rely on the MCF5281CVF66 for low-power, deterministic operation with concurrent CAN, serial, and Ethernet links. The ColdFire V2 core's deterministic interrupt latency makes the part well suited to SCADA polling; the 256 KB Flash accommodates DNP3 or IEC 60870 firmware with margin. Placed in a weatherproof enclosure with a 3.3 V wide-input DC-DC converter (e.g., TPS5430), the RTU survives industrial temperature swings and provides encrypted telemetry to the control center.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF5281CVF66 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF5282CVF66 | MCF5280CVF66 | MCF5281CVF80 | MCF5216CVF66 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Clock Frequency | 66 MHz | 66 MHz | 66 MHz | 80 MHz (+21%) | 66 MHz |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Integrated 10/100 Ethernet MAC with dual CAN in a single 256-MAPBGA (frente a MCF5280CVF66)
- Higher Flash density than MCF5280 in same package (frente a MCF5280CVF66)
- Stable 66 MHz operation vs speed-graded 80 MHz variant (frente a MCF5281CVF80)
Notas de diseño
The 256-MAPBGA (17x17 mm, 1.0 mm pitch) requires at least a 4-layer PCB with a continuous ground plane under the package. Use a via-in-pad or microvia process for inner-row balls, and provide adequate thermal vias under the die-expose area. Recommended pad diameter is 0.5 mm with 0.65 mm solder mask openings per IPC-7351.
Power the 3.3 V I/O rail from a low-noise LDO or DC-DC converter with at least 500 mA headroom to handle Ethernet MAC transmit bursts. The internal 1.5 V core LDO is powered from the 3.3 V rail; place 10 uF and 0.1 uF ceramic bypass capacitors within 5 mm of the VDD/VSS pairs per NXP's MCF5281 hardware design guide. Add a bulk 47 uF tantalum for transient margin.
Route the MII/RMII traces between the MCF5281CVF66 and the external PHY as a 50 ohm impedance-controlled bus with matched trace lengths (MII within +/- 2 mm). Keep PHY clocks short and isolated from switching power sections. Place a ferrite bead on the analog ETH supply rail feeding the PHY to attenuate common-mode noise coupling into the MAC.
Common pitfalls with the MCF5281CVF66 include missing the external reset supervisor (POR may not assert cleanly below 2.7 V), driving the external bus above 50 MHz without series damping resistors, and failing to enable the on-chip LDO sequencing bit in the System Control Module before applying clocks. Always validate the JTAG/BDM connection during bring-up before locking the JTAG fuse.
Información de cumplimiento
Lifecycle status is obsolete. RoHS, REACH, lead-free, and halogen-free data were not present in the verified web snippets; marked unknown pending confirmation from NXP product compliance documentation.
