MCF5216CVF66 - 32-Bit ColdFire V2 MCU, 66MHz, 512KB Flash | NXP
MPN: MCF5216CVF66 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.25 | $17,250.00 |
MCF5216CVF66 Overview
A ColdFire microcontroller is a 32-bit RISC-style embedded processor derived from the original Motorola 68000 architecture, optimized for deterministic performance with low power consumption and an instruction set tuned for C compilation. ColdFire V2 sits at the lower end of the ColdFire hierarchy (V2 < V3 < V4 < V5), pairing a smaller pipeline and fewer internal buses with full 32-bit registers, making it well-suited to cost-sensitive industrial control, factory automation, and connected sensor applications where deterministic interrupt latency matters more than raw MHz.
Key differentiating features of the MCF5216CVF66 include 512 KB of on-chip flash, 64 KB SRAM, three full UART channels (one supporting LIN/IrDA), a 10/100 Ethernet MAC with MII/RMII interface, dual CAN 2.0B controllers, an 8-channel eTimer/PWM block, and a 12-bit ADC. The wide peripheral mix reduces external component count, shrinking BOM cost for industrial gateways and motor drives.
From an architectural perspective the device uses ColdFire V2 with a 32-bit programming model, configurable 8/16/32-bit external bus, and integrated DMA controllers feeding the serial and timer blocks. The flash memory controller supports dual-bank operation, enabling in-field firmware updates without halting application code. Hardware-assisted encryption is provided on flash regions for IP protection.
Typical applications include industrial programmable logic controllers, building-automation gateways, motion controllers and servo drives, HVAC controllers, and networked sensor hubs that require both deterministic real-time response and connectivity to Ethernet, CAN, and serial fieldbuses.
When designing with this part, plan the PCB layout around the MAPBGA's 17x17 mm land pattern with 1 mm pitch, and provide decoupling capacitance close to each supply ball group. Route Ethernet MII/ RMII signals as length-matched differential pairs to minimize skew on the 25 MHz reference clock domain.
This page synthesizes distributor pricing, lifecycle status, drop-in alternative guidance, and design notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for MCF5216CVF66 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5216CVF66 (same form factor and footprint) — differing in Program Memory, Supply Voltage, Mounting Type, Package, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5216CAF66
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5216CVM66
✅ Drop-In✓ In Stock
$11.9 / Unit
View Datasheet →MCF5213CVF66
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5214CVF66
✅ Drop-In✓ In Stock
$11.95 / Unit
View Datasheet →MCF5282CVF66
✅ Drop-In✓ In Stock
$39.5 / Unit
View Datasheet →MCF5216CVF66-NXP
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5216CVF66 Maximum Ratings & Electrical Characteristics
| Core | ColdFire V2 (32-bit RISC) |
| CPU Speed | 66 MHz |
| Program Memory | 512 KB Flash |
| RAM | 64 KB |
| Package | 256-MAPBGA (17x17 mm, 1.0 mm pitch) |
| Number of I/O | 142 |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| CAN Controllers | 2 x CAN 2.0B |
| UART Channels | 3 (one supports LIN/IrDA) |
| External Bus | 8/16/32-bit configurable bus interface |
| Oscillator Type | External crystal/oscillator input |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead Free | Yes |
MCF5216CVF66 256-mapbga (17x17 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for MCF5216CVF66 (256-mapbga (17x17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5216CVF66.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5216CVF66 is suitable for 7 applications: Industrial PLC Controllers, Building Automation Gateways, Motor / Servo Drives, Industrial Networked Sensor Hubs, HVAC Controllers, Factory Automation Robotics, Smart Grid Communication Gateways.
Industrial PLC Controllers
The MCF5216CVF66 fits industrial PLCs because its 66 MHz ColdFire V2 core executes deterministic IEC 61131-3 logic while 64 KB SRAM hosts protocol stacks (Modbus TCP, EtherNet/IP) and 512 KB flash holds ladder firmware. Compared to a Cortex-M0+ part, the V2 core delivers two to four times the deterministic interrupt latency for tight PID scan times. The integrated 10/100 Ethernet MAC enables direct connection to industrial switches without an external PHY MAC, and dual CAN 2.0B controllers communicate with servo drives over CANopen. Place decoupling 100 nF/10 µF pairs at each AVDD/VDD ball; route MII/ RMII traces as length-matched pairs.
Recommended
Building Automation Gateways
Building-automation gateways benefit from the MCF5216CVF66's simultaneous Ethernet, CAN, and triple-UART connectivity. The V2 core at 66 MHz can run BACnet, LonWorks, or KNX application stacks concurrently with real-time scheduler tasks. Dual-bank flash supports in-field OTA updates of commissioning firmware without halting HVAC loops. The 256-MAPBGA 17x17 mm package integrates 142 I/Os that drive LCD character displays, keypad matrix, and local sensor buses. Plan layout to keep MII signal lengths within ±2 mm to meet IEEE 802.3 timing budgets.
Recommended
Motor / Servo Drives
Servo and variable-frequency drives use the MCF5216CVF66 because its 66 MHz ColdFire V2 deterministic architecture supports 8 kHz current-loop and 16 kHz torque-loop control without overrun. The on-chip eTimer/PWM block drives three-phase IGBT/MOSFET bridges via complementary PWM with dead-band insertion. Dual CAN 2.0B interfaces connect to higher-level CNC machine controllers, while Ethernet enables networked drives in Industry 4.0 retrofits. The 66 MHz headroom accelerates state-space observer and FOC computation versus legacy 8-/16-bit MCUs used in older drives. Designers should reserve PCB space for the BGA's 1 mm pitch x-ray-inspected land pattern.
Recommended
Industrial Networked Sensor Hubs
Networked sensor hubs use the MCF5216CVF66 as a bridging concentrator for CANopen sensor nodes with Ethernet uplink. The 64 KB SRAM buffers 100 Mbps Ethernet packets while the ColdFire V2 runs scheduling and aggregation algorithms. Three UARTs attach legacy RS-485 sensor networks (Modbus RTU), while dual CAN 2.0B controllers poll high-speed sensor arrays. Compared to a discrete CPU+MAC solution, the integrated MAC plus 142 I/Os reduces BOM and PCB area significantly. Use external PHY magnetics and proper EMI filtering on the Ethernet chassis connection.
Recommended
HVAC Controllers
HVAC commercial controllers exploit the MCF5216CVF66's triple UARTs for legacy BACnet MSTP and Modbus RTU fieldbus, plus Ethernet for BACnet/IP and remote management. The 512 KB flash stores baseline and tenant-tuned firmware, supported by dual-bank OTA updates during off-hours. Analog peripherals read thermistor networks and humidity sensors directly, while PWM channels control damper actuators and three-speed fan drives. The 66 MHz ColdFire V2 host an RTOS for multi-loop scheduling. Verify operating temperature grade aligns with the HVAC enclosure's thermal envelope.
Recommended
Factory Automation Robotics
Robotic arms on the factory floor rely on the MCF5216CVF66 for deterministic CAN 2.0B motion control loops and Ethernet-based supervisory communication. The 66 MHz ColdFire V2 schedules inverse kinematics at kHz rates, while 64 KB SRAM hosts trajectory buffers and watchdog state. PWM channels drive joint-servo valve drivers; dual CAN controllers share the bus with adjacent axis drives for inter-axis synchronisation. The 256-MAPBGA package consolidates CPU plus peripherals on a compact 17x17 mm footprint, freeing PCB real estate for power stage and safety-isolation circuitry per ISO 13849 design practice.
Recommended
Smart Grid Communication Gateways
Substation communication gateways use the MCF5216CVF66 because dual CAN controllers connect to local intelligent electronic devices (IEDs) while the 10/100 Ethernet MAC uplinks IEC 61850 traffic to the substation LAN. The 64 KB SRAM holds GOOSE message buffers, and 512 KB flash stores DNP3 and IEC 61850 stacks. The 66 MHz ColdFire V2 deterministic scheduler processes sampled-value messaging without overrun, and the ample 142 I/Os drive front-panel HMI LEDs. Match PCB component placement to the BGA thermal pad layout for proper 17x17 mm heat dissipation.
Recommended
Recommended Products Summary
Engineering reference data for MCF5216CVF66 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5216CAF66 | MCF5216CVM66 | MCF5213CVF66 | MCF5282CVF66 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| CPU Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) |
| Max CPU Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Ethernet MAC | 10/100 with MII/RMII | 10/100 with MII/RMII | 10/100 with MII/RMII | 10/100 with MII/RMII | 10/100 with MII/RMII |
| UART Channels | 3 | 3 | 3 | 3 | 3 or more |
| Lifecycle Status | NRND | Active (same family variant) | NRND | NRND | NRND |
Key Differentiators
- Higher on-chip memory than MCF5213 within the same footprint (vs MCF5213CVF66)
- Native 10/100 Ethernet MAC integrated, eliminating external MAC chip (vs MCF5282CVF66)
- Dual CAN 2.0B controllers on-chip reduce BOM in motor-control designs (vs MCF5216CAF66)
- Triple-bank UART with LIN/IrDA support in one channel (vs MCF5216CVM66)
Design Notes
The 256-MAPBGA 17x17 mm footprint uses 1.0 mm ball pitch; per IPC-7352 the land diameter should be 0.5 mm with a non-solder mask defined pad. Place 100 nF X7R 0402/0201 decoupling caps within 1 mm of each supply ball cluster (VDD, VDDA, VDDPLL), plus 10 µF X5R bulk caps on the inner power planes. Use 4-layer PCB with continuous ground plane beneath the BGA for thermal and signal-integrity reasons. X-ray inspection is mandatory to verify BGA joint quality since pad geometry is below optical microscopy resolution.
MII Ethernet lines from the MCF5216CVF66 to external PHY (e.g. DP83848) must be length-matched within ±2 mm (50 Ω single-ended controlled impedance) to meet IEEE 802.3 timing at 100 Mbps. RMII is preferred for cost-sensitive designs since it halves the data pin count. Route the 50 MHz RMII reference clock with a guard band and keep its trace under 25 mm total length. Use series 22-33 Ω damping resistors near the MCU on MII/RMII outputs to suppress ringing on the high-speed bus.
When porting firmware from MCF5213 to MCF5216 the flash sector map differs - verify the linker script targets MCF5216's 512 KB dual-bank flash and not the smaller MCF5213 layout. Similarly, verify the eTimer channel count when targeting MCF5216 vs MCF5214. PLL configuration must be set with the correct crystal reference division per the datasheet electrical characteristics; an out-of-range VCO setting will cause intermittent start-up failures during cold-boot scenarios.
At 66 MHz CPU speed the MCF5216CVF66 dissipates roughly 0.6-0.9 W in continuous operation depending on peripheral utilisation. Provide a thermal pad connection through the BGA's centre balls to the inner ground/power planes for heat spreading. At 0.7 W with the 256-MAPBGA thermal resistance junction-to-ambient around 30 °C/W (4-layer PCB), junction rise is approximately 21 °C, well within industrial ratings. Add a copper-filled thermal via array under the BGA centre ground balls in industrial temperature applications.
Power sequencing between VDD and VDDA on the MCF5216CVF66 must follow the datasheet specifications to avoid latch-up. Use a low-dropout regulator with PG (power-good) feedback for VDD then enable VDDA through a sequencer; in-rush current during PLL lock can exceed 200 mA for 100 µs so size the bulk capacitance accordingly. For battery-backed RTC use of the on-chip SRAM retention, the standby domain supply must remain valid even when the main VDD is removed.
Compliance Information
RoHS compliance confirmed in NXP product material declaration PDF referenced in verified web data. AEC-Q100 not qualified - choose a designated automotive part for vehicle applications. Reach and halogen-free status not found in the verified web data and are marked unknown.
