MCIMX357CVM5B557 - i.MX35 ARM1136 532MHz MPU | NXP | 400-LFBGA
N.º de pieza: MCIMX357CVM5B557 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $15.2177 | $15,22 |
| 10 | $14.5 | $145,00 |
| 100 | $13.2 | $1.320,00 |
| 500 | $11.85 | $5.925,00 |
| 1.000 | $10.4 | $10.400,00 |
MCIMX357CVM5B557 Descripción general
What is an applications microprocessor? An applications microprocessor (MPU) is a high-integration System-on-Chip (SoC) class device that runs a full operating system (typically Linux, WinCE, or a real-time OS) and exposes memory, graphics, and I/O controllers on-chip. The i.MX35 sits within NXP's MPU hierarchy as follows: MPU -> applications processor -> ARM11-class SoC -> multimedia-enabled embedded processor. This category contrasts with microcontrollers (MCUs) which run bare-metal or RTOS on smaller cores without MMU-class memory management.
Key features of the MCIMX357CVM5B557 include an integrated LCD controller with up to WVGA resolution, an Image Processing Unit (IPU) for camera and display pipeline, dual CAN controllers, a 10/100 Ethernet MAC, USB 2.0 high-speed OTG, MMC/SD card interfaces, and hardware accelerated video processing. The device supports LPDDR, DDR2, and mobile SDRAM memory types, with a 16-bit external bus and NAND flash controller for boot media.
Architecturally, the MCIMX357CVM5B557 uses an ARM1136JF-S core with 8-stage pipeline, Thumb-2 compatible instruction set, and a vector floating-point unit. The SoC integrates a multi-layer bus matrix with separate AHB and IP buses, allowing concurrent peripheral DMA and CPU execution. Security features include secure boot ROM and hardware random number generator (when configured via the 557 suffix option bits).
Typical applications include industrial human-machine interfaces (HMI), point-of-sale terminals, portable medical devices, automotive telematics and infotainment head units, smart energy metering, and connected consumer devices requiring Linux or WinCE support. The 400-LFBGA package enables high-density board layouts while supporting extended commercial temperature grades.
Design consideration: The 400-LFBGA requires microvia-compatible PCB fabrication (typically 4+ layers with 0.4 mm pitch BGA fanout). Power sequencing must follow NXP's reference manual: VDDIO must rise before or simultaneously with VDDA, and the reset release timing window must respect the 8 ms PLL lock requirement for reliable boot.
This page synthesizes distributor pricing for the MCIMX357CVM5B557, drop-in same-package alternatives from the i.MX35 and i.MX family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para MCIMX357CVM5B557 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX357CVM5B557 (mismo factor de forma y huella) — difiere en Core Architecture, Ethernet, Memory Interface, Package, USB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX357CVM5B
✅ Sustitución directa✓ En stock
$21.5 / unidad
Ver hoja de datos →MCIMX357CVM5B53
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX357DVMN5B
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX357CJM5B
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX357DVMN5BR2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX357CVM5B557 Valores máximos y características eléctricas
| Core Architecture | ARM1136JF-S (32-bit RISC) |
| Core Count | 1 |
| Maximum Core Frequency | 532 MHz |
| Floating Point Unit | VFP (Vector Floating Point) |
| Java Acceleration | Yes (Jazelle) |
| Encapsulado | 400-LFBGA 17x17 mm |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial grade) |
| Memory Interface | LPDDR, DDR2, mobile SDRAM (16-bit) |
| NAND Flash Controller | Yes (boot support) |
| LCD Controller | Yes, up to WVGA resolution |
| Image Processing Unit (IPU) | Yes (camera + display pipeline) |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | USB 2.0 High-Speed OTG + USB Host |
| CAN | 2x CAN 2.0B controllers |
| MMC/SD | MMC 4.3 / SD 2.0 host |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX357CVM5B557 400-lfbga 17x17 mm
Configuración de pines para MCIMX357CVM5B557 (encapsulado 400-lfbga 17x17 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX357CVM5B557.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX357CVM5B557 es adecuado para 6 aplicacións: Industrial Human-Machine Interface (HMI), Point-of-Sale (POS) Terminals, Portable Medical Devices, Automotive Infotainment and Telematics, Smart Energy Metering and IoT Gateways, Industrial Printers and Label Makers.
Industrial Human-Machine Interface (HMI)
The MCIMX357CVM5B557 fits industrial HMI panels because its integrated LCD controller supports up to WVGA resolution and the IPU handles real-time image rotation, color-space conversion, and overlay blending without CPU intervention. Operating at 532 MHz, the ARM1136JF-S core runs embedded Linux (LTIB or Yocto) with Qt/Embedded for responsive touch UI; the 16-bit mobile-DDR controller keeps BOM cost low while the dual CAN 2.0B ports connect to industrial field buses. The -40C to +85C industrial temperature grade ensures reliable operation in factory-floor cabinets, and the 400-LFBGA package supports the dense board layout typical of slim HMI panels. Compared to discrete MPU-plus-LCD-controller solutions, the integrated design cuts PCB area by 40-50% and reduces component count significantly.
Recomendado
Point-of-Sale (POS) Terminals
Retail POS terminals benefit from the MCIMX357CVM5B557's integrated 10/100 Ethernet MAC, USB 2.0 HS OTG, and LCD controller in a single chip. The 532 MHz ARM11 core runs Linux with payment-terminal application frameworks; hardware cryptography and secure boot (where supported by 557 option bits) help meet PCI requirements. The 400-LFBGA package enables compact card-reader and printer peripheral integration, while industrial temperature rating suits semi-outdoor retail environments. Compared to i.MX6-based POS designs, the MCIMX357CVM5B557 offers lower BOM cost at sufficient performance for typical cashier terminals. The MMC 4.3 / SD 2.0 host supports biometric and smart-card peripherals directly.
Recomendado
Portable Medical Devices
Portable medical devices such as patient monitors and handheld diagnostics leverage the MCIMX357CVM5B557's low-power ARM11 core, integrated LCD support for bedside displays, and USB OTG for tethering to PCs. The vector floating-point unit accelerates signal-processing algorithms common in pulse oximetry and ECG front-ends. The 16-bit mobile-DDR controller minimizes power draw during active display updates, and the -40C to +85C industrial temperature range covers most clinical environments. Compared to microcontroller-based medical designs, the MPU-based architecture simplifies FDA-cleared software stacks built on Linux. The 400-LFBGA package's thermal profile suits battery-powered enclosures with modest heatsinking.
Recomendado
Automotive Infotainment and Telematics
Automotive cabin applications such as head-unit displays and telematics control units use the MCIMX357CVM5B557 for its dual CAN 2.0B interfaces, integrated LCD controller, and IPU camera pipeline. Operating at 532 MHz, the ARM1136JF-S core handles audio streaming, navigation rendering, and CAN stack processing concurrently via Linux/WinCE. Note that this part is NOT AEC-Q100 qualified; for full automotive Grade-2 environments, NXP recommends the i.MX35 automotive-grade family members. The 400-LFBGA package is compatible with high-density automotive PCB designs. Compared to host MCU + external LCD controller stacks, the integrated approach reduces EMI susceptibility and simplifies CAN-LIN gateway code paths.
Recomendado
Smart Energy Metering and IoT Gateways
Smart meters and IoT edge gateways use the MCIMX357CVM5B557 to consolidate metering, display, and communication functions on one chip. The 10/100 Ethernet MAC and dual CAN controllers handle AMI (Advanced Metering Infrastructure) backhaul and home-area networking; the LCD controller drives local displays for user feedback. Embedded Linux with the i.MX35 BSP supports standard smart-energy application protocols. The industrial temperature rating ensures outdoor cabinet reliability. Compared to MCU-based smart meters, the MPU architecture simplifies secure firmware upgrade over the air (FOTA). The 400-LFBGA package's moderate footprint suits meter-form-factor designs with constrained PCB area.
Recomendado
Industrial Printers and Label Makers
Industrial thermal-transfer and label printers benefit from the MCIMX357CVM5B557's USB 2.0 high-speed OTG for fast data transfer, integrated LCD controller for operator panels, and Ethernet MAC for networked printer fleets. The 532 MHz ARM11 core runs Linux with CUPS-based printer firmware stacks and ZPL/EPL emulation. The IPU accelerates label rendering and barcode preprocessing. Industrial temperature rating suits warehouse environments, and the 400-LFBGA package supports high-density PCB layouts. Compared to MCU-based printers, the MPU architecture simplifies WYSIWYG label-preview rendering and supports complex graphics files directly.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX357CVM5B557 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX357CVM5B | MCIMX357CVM5B53 | MCIMX357DVMN5B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 400-LFBGA 17x17 mm | 400-LFBGA 17x17 mm - same | 400-LFBGA 17x17 mm - same | 400-LFBGA 17x17 mm - same |
| Core Architecture | ARM1136JF-S 532 MHz | ARM1136JF-S 532 MHz | ARM1136JF-S 532 MHz | ARM1136JF-S 532 MHz |
| LCD Controller | Yes (WVGA) | Yes (WVGA) | Yes (WVGA) | Yes (WVGA) |
| Ethernet MAC | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII |
| CAN Controllers | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B | 2x CAN 2.0B |
| Operating Temperature | -40C to +85C industrial | -40C to +85C industrial | -40C to +85C industrial | -40C to +85C industrial |
| Option-Bit Suffix | 557 | base (no suffix) | 53 | DVMN5B variant |
Diferenciadores clave
- Full software-stack support including NXP-maintained Linux BSP and WinCE (frente a MCIMX357CVM5B (base part))
- Industrial temperature grade in 400-LFBGA (frente a MCIMX357DVMN5B)
- Integrated dual CAN 2.0B + 10/100 Ethernet + USB HS OTG (frente a External CAN/Ethernet/USB controllers)
Notas de diseño
The 400-LFBGA package at 0.8 mm pitch requires microvia-compatible PCB fabrication with at least 4 layers. Recommended stackup: top layer for BGA fanout with 0.4 mm laser-drilled microvias, internal planes for power/ground, bottom layer for signal escape. Per NXP design guide, maintain a continuous ground plane directly under the BGA for thermal spreading and EMI suppression. Estimated: a 1.0 oz copper pour of at least 25x25 mm on top + inner plane reduces theta-JA by approximately 30%.
Power sequencing for the MCIMX357CVM5B557 must follow NXP's i.MX35 reference manual: VDDIO must ramp before or simultaneously with VDDA, and the reset release must respect the 8 ms PLL lock time. Use a dedicated reset supervisor IC (e.g., NXP MC33470 or MAX174-class) with adjustable delay. Estimated: inrush current peaks at 800 mA during boot due to PLL stabilization; the upstream 3.3 V regulator must source at least 1 A with 22 uF bulk + 100 nF decoupling at each IC pin. Never use a generic POR circuit without verified timing margins.
The MCIMX357CVM5B557 at 532 MHz full-load can dissipate approximately 1.5-2.0 W typical, depending on peripheral activity. Estimated: with a standard 4-layer PCB and the recommended copper pour, theta-JA is approximately 25 C/W, resulting in a 50C junction temperature rise above ambient at full load. Industrial-temperature operation up to +85C ambient is achievable with no additional heatsink if the recommended layout is followed. If the design uses a 2-layer PCB, attach a small 15x15 mm heatsink with thermal pad to maintain thermal margin.
Common pitfalls: (1) using 4-layer PCB stackup without microvias causes BGA opens at assembly - order PCB fabrication explicitly rated for 0.4 mm microvia pitch; (2) failing to initialize the SDRAM controller in low-level boot code leads to silent boot failures - use NXP's provided DDR stress test tool before OS bring-up; (3) mis-configuring the LCD panel power-on sequence causes display artifacts on first power-up; (4) neglecting to enable the boot-mode pins correctly causes boot-loop on production units. Always validate with NXP's i.MX35 manufacturing test reference design before mass production.
Información de cumplimiento
RoHS compliant per NXP environmental data. NOT AEC-Q100 qualified - for full automotive Grade-2 environments, use i.MX35 automotive-grade family members (different option suffixes). REACH SVHC declaration available on request from NXP.
