MCIMX514AJM6CR2 - i.MX51 ARM Cortex-A8 600MHz MPU | NXP
N.º de pieza: MCIMX514AJM6CR2 ✓ ActivoMCIMX514AJM6CR2 Descripción general
An applications processor (AP) is a System-on-Chip class integrated circuit that integrates a CPU, GPU, memory controllers, and a wide range of application-specific peripherals onto a single die. In the i.MX hierarchy, the i.MX51 sits between the older i.MX31/i.MX35 and the newer i.MX53; it is the first i.MX family member to pair the Cortex-A8 core with a dedicated 2D/3D graphics engine, enabling rich user interfaces and acceleration for navigation map rendering.
Key features include 600 MHz ARM Cortex-A8 with NEON SIMD and VFPv3-D16 floating point, OpenGL ES 2.0 capable GPU, dual-display support, an integrated image processing unit (IPU), dedicated hardware video codec offload, and a comprehensive peripheral set (USB 2.0 OTG with PHY, SATA, PCIe, MMC/SD, CAN, UART, SPI, I2C, I2S, GPIO). The 600 MHz speed grade specifically targets power-efficient applications where 800 MHz-class performance is unnecessary.
The architecture combines an ARM Cortex-A8 superscalar core with an autonomous GPU, dedicated multimedia engines, and a high-bandwidth DDR2/LPDDR memory controller, allowing simultaneous OS execution, graphics rendering, and video decode/encode. The 529-ball MAPBGA package exposes the full peripheral set (including parallel display and camera interfaces) to the PCB.
Typical applications include in-vehicle infotainment (IVI), advanced human-machine interfaces (HMI), instrument clusters, telematics control units, portable navigation devices (PND), industrial HMI panels, and ruggedized multimedia terminals. The hardware graphics acceleration makes the i.MX51 particularly suited to navigation map rendering and automotive cluster UI work.
When designing with the MCIMX514AJM6CR2, careful attention must be paid to power-rail sequencing, DDR memory layout (controlled-impedance matched-length traces), and thermal management. The MAPBGA's 19x19 mm footprint requires a 0.8 mm ball pitch, demanding 4-layer-or-better PCB stack-ups for signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MCIMX514AJM6CR2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
MCIMX515AJM6CR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX512DJM6CR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX515CJM6CR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX513DJM6CR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX53SFA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX514AJM6CR2 Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-A8 |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Frecuencia de reloj máxima | 600 MHz |
| Series | i.MX51 |
| Package Type | 529-ball MAPBGA (LFBGA) |
| Package Dimensions | 19 x 19 mm |
| Ball Pitch | 0.8 mm |
| Operating Supply Voltage (Core) | 1.2 V |
| I/O Supply Voltage | 1.8 V to 3.3 V |
| GPU | Hardware-accelerated 2D and 3D (OpenGL ES 2.0) |
| Floating Point Unit | VFPv3-D16 + NEON SIMD |
| Memory Interface | DDR2 / LPDDR / mDDR |
| Display Support | Dual display, parallel LCD interface |
| Temperature Grade | Automotive |
| Tipo de montaje | Surface Mount |
| Estilo de montaje | SMD/SMT |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX514AJM6CR2 19 x 19 mm
Configuración de pines para MCIMX514AJM6CR2 (encapsulado 19 x 19 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX514AJM6CR2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX514AJM6CR2 es adecuado para 6 aplicacións: In-Vehicle Infotainment (IVI) Systems, Instrument Cluster Display, Portable Navigation Devices (PND), Industrial HMI Panels, Telematics Control Units, Medical Portable Diagnostic Devices.
In-Vehicle Infotainment (IVI) Systems
The MCIMX514AJM6CR2's 600 MHz ARM Cortex-A8 with hardware-accelerated 2D/3D OpenGL ES 2.0 graphics engine is purpose-built for automotive in-vehicle infotainment head units. The 529-ball MAPBGA exposes dual-display interfaces that let designers drive a center stack LCD and instrument cluster simultaneously from a single SoC, eliminating the need for two MCUs. The dedicated image processing unit (IPU) handles camera input for rear-view or surround-view systems without loading the CPU, while the integrated USB 2.0 OTG with PHY supports media connectivity. Operating at 600 MHz with automotive temperature grade, the part keeps BOM cost low while still delivering responsive touch UI rendering for navigation maps and media browsers typical of mid-range IVI systems.
Recomendado
Instrument Cluster Display
Automotive digital instrument clusters benefit from the MCIMX514AJM6CR2's hardware 2D/3D graphics and dual-display capability, allowing simultaneous rendering of gauge graphics on one display while updating navigation arrows or turn indicators on another. The ARM Cortex-A8 core at 600 MHz provides ample headroom for real-time graphics overlay and vehicle CAN data ingestion. The integrated IPU handles graphics layer composition and color-space conversion directly, reducing CPU load. Automotive temperature grade qualification (-40 C to +85 C junction) ensures cluster operation across cold-start and high-ambient-temperature conditions. The MAPBGA package footprint keeps PCB area compact enough for placement behind the cluster LCD module.
Recomendado
Portable Navigation Devices (PND)
Portable navigation devices leverage the MCIMX514AJM6CR2's 600 MHz Cortex-A8 with NEON SIMD and VFPv3 floating point to render map tiles, GPS-derived overlays, and 3D building extrusions in real time. The hardware 3D GPU accelerates vector map rendering through OpenGL ES 2.0 while consuming minimal CPU cycles, leaving headroom for route calculation algorithms. The DDR2/LPDDR memory controller sustains the throughput needed for tile cache handling at typical navigation zoom levels. With automotive temperature grade and the compact 529-ball MAPBGA footprint, the SoC fits inside handheld or dashboard-mounted PND enclosures with battery or 12 V automotive supply input.
Recomendado
Industrial HMI Panels
Industrial human-machine interface panels use the MCIMX514AJM6CR2 for its deterministic graphics performance, multi-protocol industrial networking (PCIe, USB, CAN, UART, SPI, I2C), and automotive temperature grade ensuring reliability on factory floors. The 600 MHz Cortex-A8 drives multi-line status displays, trend graphs, and touch-responsive controls, while the dual-display output supports secondary status screens. The automotive-grade qualification translates directly to industrial thermal and vibration endurance. With extensive peripheral connectivity including Ethernet, USB, and serial buses, the SoC interfaces directly with PLCs, sensors, and motor controllers common in factory automation without external bus bridges.
Recomendado
Telematics Control Units
Telematics control units (TCUs) for fleet management and connected-vehicle services rely on the MCIMX514AJM6CR2's combination of automotive-grade qualification, wireless peripheral interfaces (USB 2.0 OTG for modem tethering), CAN bus integration, and 600 MHz processing for data aggregation. The SoC runs vehicle diagnostics collection, GPS position logging, and cellular/wireless modem management concurrently without context-switching bottlenecks. The hardware graphics engine can drive local status displays while the DDR2/LPDDR memory controller maintains buffers for logged telemetry data. The compact 529-ball MAPBGA keeps PCB footprint small enough for TCU integration behind dashboards or in OBD-II plug-in enclosures.
Recomendado
Medical Portable Diagnostic Devices
Portable medical diagnostic equipment such as handheld ultrasound probes and point-of-care analyzers benefit from the MCIMX514AJM6CR2's 600 MHz ARM Cortex-A8 with NEON and VFPv3 floating point, enabling real-time signal processing on imaging data streams. The hardware 2D/3D graphics engine accelerates medical image rendering (B-mode, M-mode ultrasound overlays, ECG waveforms) on integrated LCD panels. The integrated DDR2/LPDDR memory controller sustains the throughput needed for continuous sample buffering at kilohertz rates. Automotive temperature grade (which exceeds consumer-grade requirements) and the compact MAPBGA footprint translate to portable, battery-powered device form factors with reliable operation in clinical and field environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX514AJM6CR2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX515AJM6CR2 | MCIMX512DJM6CR2 | MCIMX515CJM6CR2 | MCIMX513DJM6CR2 | MCIMX53SFA |
|---|---|---|---|---|---|---|
| Package | 529-ball MAPBGA (19x19 mm, 0.8 mm pitch) | 529-ball MAPBGA (19x19 mm) | 529-ball MAPBGA (19x19 mm) | 529-ball MAPBGA (19x19 mm) | 529-ball MAPBGA (19x19 mm) | 529-ball MAPBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | ARM Cortex-A8 600 MHz | ARM Cortex-A8 600 MHz | ARM Cortex-A8 600 MHz | ARM Cortex-A8 600 MHz | ARM Cortex-A8 600 MHz | ARM Cortex-A8 1 GHz |
| GPU | 2D + 3D OpenGL ES 2.0 | 2D + 3D OpenGL ES 2.0 | 2D only | 2D + 3D OpenGL ES 2.0 | 2D only | 2D + 3D OpenGL ES 2.0 + OpenVG |
| Display Support | Dual display | Dual display, higher resolution | Single display | Dual display, video decode | Single display | Dual display, 1080p capable |
| Memory Interface | DDR2/LPDDR/mDDR | DDR2/LPDDR/mDDR | DDR2/LPDDR/mDDR | DDR2/LPDDR/mDDR | DDR2/LPDDR/mDDR | DDR2/DDR3/LPDDR2 |
| Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive | Automotive / Industrial |
Diferenciadores clave
- Cost-optimized i.MX51 with full 3D GPU (frente a MCIMX512DJM6CR2)
- Lower power at 600 MHz (frente a MCIMX515CJM6CR2)
- Mature automotive-grade silicon with full i.MX51 ecosystem (frente a MCIMX53SFA)
Notas de diseño
The 529-ball MAPBGA at 0.8 mm ball pitch requires 4+ layer PCB stack-up with controlled-impedance routing for DDR2 traces, length-matched data/address/command, and continuous reference planes. Fan-out vias should be micro-via-in-pad (0.2 mm/0.4 mm) with filled and capped plating to avoid solder wicking during BGA assembly. Refer to the NXP i.MX51 hardware design guide for ball-out details and routing recommendations.
i.MX51 power sequencing requires core (1.2 V) and I/O (1.8-3.3 V) rails to come up in proper order with specific timing relationships to avoid latch-up. Use a dedicated PMIC such as the MC34712 or MC13892 rather than discrete LDOs; these PMICs implement the correct sequencing and provide DDR reference voltage, RTC supply, and USB OTG VBUS handling in a single device.
Estimated: At 600 MHz Cortex-A8 full load plus 3D GPU utilization, die power dissipation reaches approximately 1.5-2.0 W. The MAPBGA's exposed die is best cooled with thermal vias to inner copper layers and (if possible) a small top-side thermal pad bonded to a chassis spreader. In enclosed automotive enclosures with high ambient, derate CPU frequency to 400-500 MHz via DVFS to maintain junction below 105 C.
Do not assume the i.MX51 boot ROM maps the same peripheral boot mode as the i.MX53; fuses must be set per the i.MX51 reference manual. Mistaking i.MX51 and i.MX53 pin assignments in the same MAPBGA footprint causes silent boot failures requiring board respins. Also, DDR2 VREF must be calibrated per board (typically 0.49 x VDDQ) before training; ignore this and you will see intermittent memory corruption under temperature cycling.
Información de cumplimiento
RoHS and REACH compliance per NXP product documentation. Automotive temperature grade qualifies the part for use under AEC-Q100-style environmental stress but is not formal AEC-Q100 qualification. Verify halogen-free status with NXP for the latest regulatory attestations.
