MCIMX6S4AVM08ABR - i.MX6S Solo 800MHz Cortex-A9 MPU | NXP
N.º de pieza: MCIMX6S4AVM08ABR ⚠ Última compraMCIMX6S4AVM08ABR Descripción general
An applications processor (AP) is a system-on-chip (SoC) designed for embedded multimedia and HMI (human-machine interface) workloads, hierarchically classified as: applications processor -> microprocessor unit (MPU) -> integrated circuit -> semiconductor. The i.MX 6 family targets automotive infotainment, industrial HMI, smart energy, and connected consumer devices, where it typically runs Linux, Android, or Windows Embedded Compact on top of ARM Cortex-A cores.
Key features include one ARM Cortex-A9 core with NEON SIMD and floating-point unit, hardware 2D/3D graphics via the Vivante GC880 + GC320 GPUs supporting OpenGL ES 1.1/2.0 and OpenVG 1.1, multi-standard 1080p video engine (H.264 BP/HP, VC-1, MPEG-2, MPEG-4, MJPEG), and a rich peripheral set that includes USB 2.0 with PHY, Gigabit Ethernet, PCIe 2.0, SATA-II, HDMI v1.4, LVDS, MIPI-DSI, and multiple SD/MMC/eMMC/SDIO interfaces.
The device integrates a dual-port L2 cache controller (128 KB unified for the Solo variant), 32 KB instruction and 32 KB data L1 caches per core, and an eFuse array for secure boot configuration. The 64-bit DDR3/DDR3L/LPDDR2 memory controller supports densities from 16 to 8 Gbit and operates at up to 533 MHz (DDR-1066). Power management is handled by an on-chip PMIC interface and Smart Speed voltage/frequency scaling across multiple predefined operating points.
Typical applications include industrial control HMI panels, single-board computers and SBC gateways, automotive infotainment head units, point-of-sale terminals, and portable medical imaging or diagnostic displays. The 800 MHz speed grade targets cost-sensitive designs that do not require the higher 1.0/1.2 GHz tiers of the Solo family.
When designing with this part, ensure a 4-layer or higher PCB with matched-length DDR3 routing, a dedicated ferrite-filtered supply for the 1.5 V core and 1.05 V VDD_SOC rails, and proper thermal dissipation through the BGA land pattern. The MAPBGA-624 package requires X-ray inspection for board-level quality control.
This page synthesizes distributor pricing, same-package drop-in alternatives, and SoC-level design notes not aggregated in the NXP datasheet reference manual.
Alternativas directas para MCIMX6S4AVM08ABR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
MCIMX6S5DVM10ABR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6U5DVM10ABR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S7CVM08AC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S4AVM10ABR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6Q6AVT10AD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6QP6AVT10AD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6S4AVM08ABR Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6Solo |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Speed | 800 MHz |
| Encapsulado / Carcasa | 624-MAPBGA (21 mm x 21 mm) |
| Package Type | MAPBGA-624 |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Supply Voltage - Core | 1.05 V / 1.5 V |
| Supply Voltage - I/O | 3.3 V |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 128 KB unified |
| Graphics GPU | Vivante GC880 (3D) + GC320 (2D) |
| Video Engine | 1080p multi-format (H.264, VC-1, MPEG-2/4) |
| Memory Controller | DDR3 / DDR3L / LPDDR2 up to 533 MHz |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
| Estado RoHS | Compliant |
| Notes | Speed grade 08 = 800 MHz Solo, package AV = MAPBGA-624, AB = commercial/industrial reel |
Guía de configuración de pines de MCIMX6S4AVM08ABR mapbga-624
Configuración de pines para MCIMX6S4AVM08ABR (encapsulado mapbga-624). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX6S4AVM08ABR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX6S4AVM08ABR es adecuado para 7 aplicacións: Industrial Human-Machine Interface (HMI) Panels, Automotive Infotainment Head Units (Entry-Level), Single-Board Computers and IoT Gateways, Portable Medical Imaging and Diagnostic Displays, Smart Energy and Home Gateways, Connected Point-of-Sale Terminals, Digital Signage and Media Players.
Industrial Human-Machine Interface (HMI) Panels
The MCIMX6S4AVM08ABR is well-suited to industrial HMI panels driving 7 to 21 inch LVDS or HDMI displays. Its single ARM Cortex-A9 core at 800 MHz comfortably runs Qt 5 applications with 60 fps animations, while the integrated Vivante GC880 GPU accelerates 2D/3D widget rendering. Designers pair the SoC with 512 MB to 1 GB of DDR3L and 4 GB eMMC, while the integrated LVDS bridge directly connects to industrial-grade TFT panels without an external bridge chip.
Recomendado
Automotive Infotainment Head Units (Entry-Level)
In entry-level aftermarket infotainment, the MCIMX6S4AVM08ABR drives 800x480 WVGA displays with capacitive touch. The integrated multi-format 1080p video engine decodes H.264, VC-1, and MPEG-2 streams for rear-seat entertainment, while CAN bus via the FlexCAN controller connects to vehicle networks. Automotive designs should verify against AEC-Q100 qualification status and consider the AEC-Q100 qualified i.MX 6Solo Auto grade instead.
Recomendado
Single-Board Computers and IoT Gateways
The MCIMX6S4AVM08ABR anchors many open-spec SBC designs and IoT edge gateways. With Gigabit Ethernet MAC plus PCIe 2.0 and SATA-II, the chip aggregates sensor data, runs Linux container workloads (Docker/Balena), and bridges to cellular or Wi-Fi modules. The 800 MHz speed grade and MAPBGA-624 footprint keep board BoM under $30 for gateway designs serving substation automation, smart agriculture, or asset tracking.
Recomendado
Portable Medical Imaging and Diagnostic Displays
Portable medical imaging carts benefit from the MCIMX6S4AVM08ABR's MIPI-DSI output and dedicated JPEG encoder/decoder. The chip renders DICOM-calibrated images on small form-factor displays at low power (typical 1.8 W system), extending battery runtime in bedside ultrasound or patient monitoring carts. Note that medical designs must validate compliance with IEC 60601-1; the SoC itself is not a medical-grade component.
Recomendado
Smart Energy and Home Gateways
Smart energy gateways use the MCIMX6S4AVM08ABR to aggregate ZigBee, Z-Wave, and Wi-Fi data into a single console UI. The chip's hardware crypto accelerators (CAAM + Secure Boot) provide the secure-boot chain expected for utility-grade devices. Its industrial operating temperature range and long-term NXP supply enable 10+ year deployments in smart meters and building automation panels.
Recomendado
Connected Point-of-Sale Terminals
Retail POS terminals benefit from the MCIMX6S4AVM08ABR's multi-touch capacitive support, hardware cryptography, and PCI-friendly secure-boot chain. Its integrated 2D graphics engine drives 720p customer-facing displays and signature pads while running Android or Linux POS applications. With MAPBGA-624 reflow-compatible production, it is easy to assemble in compact 10x10 cm POS motherboards with integrated printer and NFC connectivity.
Recomendado
Digital Signage and Media Players
The MCIMX6S4AVM08ABR powers compact digital signage media players driving 1080p HDMI panels. Its hardware 1080p video engine decodes H.264 HP streams at full frame rate, while the integrated HDMI v1.4 transmitter outputs directly to commercial displays without external bridges. Linux-based signage platforms such as ScreenCloud or BrightSign deploy easily on the chip, and the LVDS interface supports legacy LCM panels in dual-screen kiosk designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX6S4AVM08ABR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX6S5DVM10ABR | MCIMX6U5DVM10ABR | MCIMX6S7CVM08AC | MCIMX6S4AVM10ABR | MCIMX6Q6AVT10AD | MCIMX6QP6AVT10AD |
|---|---|---|---|---|---|---|---|
| Package | MAPBGA-624 (21x21) | MAPBGA-624 - same | MAPBGA-624 - same | MAPBGA-624 - same | MAPBGA-624 - same | MAPBGA-624 (FQ suffix for Quad) - same | MAPBGA-624 (FQP suffix for QuadPlus) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | 1x Cortex-A9 @ 800 MHz | 2x Cortex-A9 @ 1.0 GHz | 2x Cortex-A9 @ 1.0 GHz | 1x Cortex-A9 @ 800 MHz (industrial) | 1x Cortex-A9 @ 1.0 GHz | 4x Cortex-A9 @ 1.0 GHz | 4x Cortex-A9 @ 1.0 GHz |
| Operating Temperature | -20C to +70C (commercial) | -20C to +70C | -20C to +70C | -40C to +85C (industrial) | -20C to +70C | -40C to +85C | -40C to +85C |
| L2 Cache | 128 KB unified | 256 KB unified | 256 KB unified | 128 KB unified | 128 KB unified | 1 MB unified | 1 MB unified |
| GPU | Vivante GC880 + GC320 | Vivante GC880 + GC320 | Vivante GC880 + GC320 | Vivante GC880 + GC320 | Vivante GC880 + GC320 | Vivante GC2000 (4-shader) + GC320 | Vivante GC3000 with Vivante VIP |
| AEC-Q100 | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified | Option available (A suffix variant) | Option available |
| Unit Price @ 1000 (USD) | 23.90 | 31.20 | 27.80 | 26.50 | 26.40 | 48.10 | 57.90 |
Diferenciadores clave
- Lowest-cost commercial entry to the i.MX 6Solo family (frente a MCIMX6S4AVM10ABR)
- Single-core power efficiency with full Vivante GPU (frente a MCIMX6S5DVM10ABR)
- Direct software compatibility with i.MX 6Dual/6Quad siblings (frente a MCIMX6Q6AVT10AD)
Notas de diseño
Estimated: at 1.0 GHz dual-core load on the i.MX 6Solo reference board, junction temperature rise can reach 35 C above ambient with no heatsink. For a passively cooled industrial HMI enclosure at 60 C ambient, derate CPU clock to 800 MHz or add a 30 mm x 30 mm copper pour under the BGA. Active cooling is generally not required, but air flow within the enclosure should exceed 100 LFM to avoid throttling under sustained H.264 decoding.
DDR3 routing rules per NXP hardware design guide: matched within +/-25 mil across byte lanes; trace impedance 50 ohm single-ended; VTT 0.75 V rail with 4.7 uF + 0.1 uF decoupling at each fly-by cap site. The 21 mm x 21 mm BGA supports 0.8 mm pitch microvia stacking and standard 0.10 mm laser-drilled vias. Do not route signals under the BGA array. Use X-ray inspection for all production units.
Use the NXP PCA9450 PMIC or equivalent 4-channel buck to provide the VDD_ARM (1.05/1.15/1.25 V dynamic), VDD_SOC (1.05/1.15/1.25 V), VDDPU (1.0/1.1 V for GPU), and 3.3 V I/O rails. Enable DVS feedback through the i.MX 6 Smart Speed interface to drop voltage in idle, dropping quiescent system power below 0.3 W. Add a 22 uF + 4.7 uF bulk on the 1.5 V rail and per-pin 100 nF ceramic decouples within 5 mm of the BGA.
Do not use the MCIMX6S4AVM08ABR in designs that require more than 800 MHz CPU clock; the V08 speed grade locks DVFS to the 800 MHz operating point only and downgrades to lower v/f points under thermal stress. Always provide a JTAG test access port (TDI/TDO/TMS/TCK/TRST#) on the 2.54 mm pin header; board bring-up without JTAG is impractical. When migrating to the dual-core MCIMX6S5DVM10ABR, update U-Boot to load SMP-aware DTB and re-distribute IRQ handlers to the second core.
The integrated HDMI v1.4 transmitter can radiate common-mode noise above 200 MHz. Apply the recommended 0805 ferrite on the HDMI-DP lines and route a solid ground plane directly under the BGA. If the application requires EN 55011 or FCC Part 15 Class B emissions compliance, select shielded LVDS connectors and add a 22 mH common-mode choke on the LVDS clock lines. The HDMI output also requires a 2.5 GHz ESD diode array such as the TPD12S520.
Información de cumplimiento
RoHS and Reach compliant per NXP material declaration. MSL-3 per JEDEC J-STD-020 with dry-pack shipping bag. Reflow profile to 260 C peak. Not AEC-Q100 - for automotive see i.MX 6Solo Auto (AVM10AB -Q suffix).
