MCP1711T-30I/5X - 150mA, 3.0V Capless LDO | Microchip Technology
N.º de pieza: MCP1711T-30I/5X ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0.3 | $0,30 |
| 10 | $0.28 | $2,80 |
| 100 | $0.24 | $24,00 |
| 500 | $0.21 | $105,00 |
| 1.000 | $0.18 | $180,00 |
| 3.000 | $0.15 | $450,00 |
MCP1711T-30I/5X Descripción general
An LDO (Low-Dropout) linear regulator is a type of voltage regulator that maintains a stable output voltage even when the input voltage approaches the output voltage. LDOs sit in the broader hierarchy: linear regulator -> voltage regulator -> power management IC. They are favored over switching regulators when low noise, small solution size, and fast transient response outweigh efficiency considerations, especially in always-on battery-powered systems where quiescent current dominates standby life.
Key features of the MCP1711T-30I/5X include 500 mV dropout at 150 mA load, integrated current foldback that reduces IOUT to ~80 mA at short circuit, a logic-level shutdown input that drops Iq to <0.1 uA, and a power-good output flag. The UQFN-4 (1x1) exposed-pad package achieves a thermal resistance suitable for 150 mA continuous load across the -40C to +85C industrial range without external heatsinking.
Architecturally, the device uses a P-channel MOSFET pass element with a precision bandgap reference, yielding low dropout and excellent line/load regulation. The internal soft-start and current-limit blocks protect downstream circuitry from inrush and fault conditions. The 3.0 V fixed output aligns directly with common MCU and Bluetooth SoC nominal rails.
Typical applications include wearable health monitors, coin-cell powered IoT sensor nodes, energy harvesting systems, Bluetooth Low Energy (BLE) modules, and any battery-powered product that needs a clean 3 V rail directly from a discharged Li-ion cell. A primary design consideration is thermal budget: at VIN = 3.6 V, VOUT = 3.0 V, and 150 mA, the device dissipates ~90 mW. At VIN = 6.0 V, VOUT = 3.0 V, full load, dissipation rises to ~450 mW - verify the PCB copper area is sufficient to keep theta_JA within safe limits.
This page synthesizes distributor pricing from DigiKey, Mouser, Arrow, Octopart, LCSC, and Jotrin; lists same-family drop-in alternatives; and includes practical design notes not aggregated in the manufacturer datasheet.
Alternativas directas para MCP1711T-30I/5X — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCP1711T-30I/5X (mismo factor de forma y huella) — difiere en Dropout Voltage, Input Voltage Range, Output Voltage, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCP1711T-33I/5X
✅ Sustitución directa✓ En stock
$0.5497 / unidad
Ver hoja de datos →MCP1711T-30I/OT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCP1711T-25I/5X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCP1711T-18I/5X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCP1711T-50I/5X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCP1711T-30I/5X Valores máximos y características eléctricas
| Manufacturer | Microchip Technology |
| Part Number | MCP1711T-30I/5X |
| Función | Linear Voltage Regulator IC, Positive Fixed, 1 Output |
| Regulator Topology | Positive Fixed, LDO |
| Tensión de salida | 3.0 V (fixed) |
| Output Current (Maximum) | 150 mA |
| Rango de tensión de entrada | 1.4 V to 6.0 V |
| Tensión de dropout | 500 mV (typical, at 150 mA) |
| Quiescent Current (Iq) | 0.6 uA (typical) |
| Tipo de salida | Fixed |
| Número de salidas | 1 |
| Current Foldback | ~80 mA at 0 V output (typical) |
| Corriente de apagado | <0.1 uA (via SHDN pin) |
| Rango de temperatura de funcionamiento | -40 C to +85 C |
| Encapsulado | 4-UQFN (1 mm x 1 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Output Capacitor Required | None (capless - stable without output capacitor) |
| Salida Power Good | Yes (per datasheet feature list) |
Configuración de pines de MCP1711T-30I/5X
| Pin 1 | VIN — Input voltage supply (1.4 V to 6.0 V) |
| Pin 2 | GND — Ground reference |
| Pin 3 | SHDN — Shutdown input (active-high; tie to VIN if unused) |
| Pin 4 | VOUT — Regulated output voltage (3.0 V fixed) |
| Pin EP | EP — Exposed pad - thermal pad, connect to GND for heat dissipation |
Aplicaciones típicas
MCP1711T-30I/5X es adecuado para 6 aplicacións: Wearable Health Monitor Power Rail, Coin-Cell Powered IoT Sensor Node, Bluetooth Low Energy (BLE) Module Supply, Energy Harvesting System Buffer, Battery-Powered Remote Control / Wireless Key Fob, Industrial Sensor Transmitter (4-20 mA Loop Powered).
Wearable Health Monitor Power Rail
The MCP1711T-30I/5X is well suited for wearable health monitors (heart-rate, SpO2, temperature patches) where the 3.0 V rail directly feeds a low-power MCU or analog front end. Its 0.6 uA quiescent current extends coin-cell life from months to years, and the capless output removes bulky ceramic capacitors from the small form-factor PCB. At VIN = 3.0 V from a CR2032, dropout margin keeps the rail in regulation across most of the cell discharge curve. The 4-UQFN 1 mm x 1 mm package leaves room for the battery and sensor.
Recomendado
Coin-Cell Powered IoT Sensor Node
For IoT sensor nodes that sleep most of the time and wake briefly to transmit, the MCP1711T-30I/5X is an ideal 3.0 V source. The 0.6 uA Iq is negligible compared to the sleeping sensor's own nA-level drain, while the 150 mA peak output handles short radio bursts from BLE or LoRa transmitters. The capless design reduces BOM cost and board area, and the 1.4 V minimum input lets a CR2477 coin cell operate nearly to end-of-life without regulator dropout.
Recomendado
Bluetooth Low Energy (BLE) Module Supply
BLE SoCs typically operate from 3.0 V rails and require clean supply to maintain RF performance. The MCP1711T-30I/5X provides a low-ripple 3.0 V output from a Li-ion or LiPo battery without injecting switching noise - a key advantage over buck converters for noise-sensitive radio rails. Its 500 mV dropout at 150 mA allows operation down to ~3.5 V input, well below the Li-ion discharge knee. The exposed-pad UQFN package provides adequate thermal dissipation for sustained transmit bursts.
Recomendado
Energy Harvesting System Buffer
In energy-harvesting designs (solar, vibration, thermal), a low-Iq LDO is essential to buffer the harvested source to a stable 3.0 V load. The MCP1711T-30I/5X's 0.6 uA Iq means it consumes less than the harvester's leakage, preserving net energy yield. Its 1.4 V minimum input covers low-output solar cells and rectified RF harvesters. The shutdown pin (SHDN) lets an MCU cut the regulator to <0.1 uA during deep-sleep harvest intervals.
Recomendado
Battery-Powered Remote Control / Wireless Key Fob
Remote controls and key fobs rely on CR2032 coin cells and transmit bursts up to 100 mA. The MCP1711T-30I/5X delivers the 3.0 V rail for the transmitter IC while drawing only 0.6 uA standby, keeping the cell usable for the 3-5 year product lifetime. Its capless output saves PCB area inside the cramped key-fob enclosure, and the UQFN-4 1x1 footprint fits next to the battery clip. The shutdown pin extends storage shelf-life before first use.
Recomendado
Industrial Sensor Transmitter (4-20 mA Loop Powered)
In 4-20 mA loop-powered industrial sensors, the MCP1711T-30I/5X can serve as a low-drop post-regulator deriving a clean 3.0 V rail from the loop voltage. The 500 mV dropout allows efficient operation even at the lowest loop voltages (~3.5 V). The 0.6 uA Iq is small relative to the 4 mA loop quiescent budget. The -40 C to +85 C industrial temperature rating covers process-control environments, and the exposed-pad package ensures thermal stability on the loop transmitter PCB.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCP1711T-30I/5X — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCP1711T-33I/5X | MCP1711T-30I/OT | MCP1711T-25I/5X | MCP1711T-18I/5X | MCP1711T-50I/5X |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 4-UQFN (1x1) | 4-UQFN (1x1) - same | 4-UQFN (1x1) - same | 4-UQFN (1x1) - same | 4-UQFN (1x1) - same | 4-UQFN (1x1) - same |
| Output Voltage | 3.0 V | 3.3 V | 3.0 V | 2.5 V | 1.8 V | 5.0 V |
| Output Current | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA | 150 mA |
| Input Voltage Range | 1.4 V to 6.0 V | 1.4 V to 6.0 V | 1.4 V to 6.0 V | 1.4 V to 6.0 V | 1.4 V to 6.0 V | 1.4 V to 6.0 V |
| Quiescent Current (Iq) | 0.6 uA | 0.6 uA | 0.6 uA | 0.6 uA | 0.6 uA | 0.6 uA |
| Dropout Voltage | 500 mV at 150 mA | 500 mV at 150 mA | 500 mV at 150 mA | 500 mV at 150 mA | 500 mV at 150 mA | 500 mV at 150 mA |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Unit Price (qty 1) | $0.30 | $0.30 | $0.30 | $0.30 | $0.30 | $0.30 |
Diferenciadores clave
- Ultra-low 0.6 uA quiescent current (frente a MCP1700 (1.6 uA Iq))
- Capless output stability (frente a MCP1700 (requires output capacitor))
- Integrated power-good output (frente a MCP1700 (no power-good flag))
- Smaller 1 mm x 1 mm UQFN footprint (frente a Larger SOT-23 LDO alternatives)
Notas de diseño
Estimated: at VIN = 6.0 V, VOUT = 3.0 V, IOUT = 150 mA, power dissipation is (6.0 - 3.0) x 0.150 = 450 mW. The UQFN-4 1x1 exposed-pad package has theta_JA around 100-150 C/W on a 1 oz 4-layer 1 sq inch copper pad, so junction temperature rises 45-67 C above ambient. At maximum ambient of 85 C, junction temperature reaches 130-152 C - above the 150 C typical thermal shutdown. For sustained VIN >= 5 V operation, reduce VIN closer to VOUT or limit IOUT to 100 mA. Source: Microchip MCP1711 datasheet 20005415D.
The exposed pad (EP) of the UQFN-4 package must be soldered to a PCB thermal pad connected to GND for both electrical grounding and heat dissipation. Place a continuous ground plane beneath the IC and stitch vias from the thermal pad to the inner ground plane. Avoid routing signal traces under the UQFN-4 footprint. Source: Microchip MCP1711 datasheet 20005415D recommended PCB land pattern.
Do not leave the SHDN pin floating - tie it to VIN if shutdown control is not needed. A floating SHDN can drift to mid-rail, causing unpredictable output behavior. The shutdown current is <0.1 uA only when SHDN is driven low; a mid-rail SHDN can pull significant bias current. Source: Microchip MCP1711 datasheet 20005415D. Also: although the output is capless-stable, a 0.1 uF X7R bypass close to VOUT can reduce noise pickup in RF applications.
Información de cumplimiento
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade -40 C to +85 C, not automotive). Halogen-free per Microchip environmental compliance statement.
