MIMXRT1062DVL6B - i.MX RT1062 600MHz Cortex-M7 MCU | NXP
N.º de pieza: MIMXRT1062DVL6B ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $13.04 | $13,04 |
| 10 | $11.85 | $118,50 |
| 100 | $10.5 | $1.050,00 |
| 500 | $9.4 | $4.700,00 |
| 1.000 | $8.75 | $8.750,00 |
MIMXRT1062DVL6B Descripción general
What is a crossover processor? A crossover processor combines the real-time deterministic behavior of a microcontroller (MCU) with the high performance and rich multimedia features of an application processor (MPU). It bridges the architectural gap between Cortex-M MCUs and Cortex-A MPUs, sitting in the product-type hierarchy as: microcontroller -> crossover processor -> embedded processor -> semiconductor IC. This category targets applications requiring real-time DSP, graphics, and high-speed connectivity without the overhead of a full Linux-capable MPU.
Key features include 600 MHz Cortex-M7 with single-precision and double-precision FPU, 1 MB on-chip SRAM, dual FlexSPI for QSPI/NOR/NAND expansion, integrated LCDIF display controller up to WXGA resolution, USB 2.0 OTG with PHY, 10/100 Mbit Ethernet MAC, 8-bit CMOS sensor interface (CSI), and 2D PxP engine. The part operates from 0.95 V to 1.05 V core and 3.0 V to 3.6 V I/O supplies, with industrial-grade temperature support.
The architecture leverages the Cortex-M7 superscalar pipeline with tightly-coupled memory for deterministic interrupt response, paired with NXP's SmartDMA and eFuse-based secure boot. The 196-ball LFBGA provides ample I/O routing for high-speed parallel buses and multiple serial interfaces (SPI, I2C, UART, CAN, FlexCAN, SAI). Hardware cryptography via CAAM and TrustZone-M for isolation are integrated for secure IoT edge designs.
Typical applications include HMI panels for industrial and home appliances, USB audio devices with display, motor control inverters, smart-home gateways, low-cost HMI for IoT edge nodes, and point-of-sale terminals. The wide peripheral set lets designers replace legacy MCU + external controller stacks with a single chip.
When designing with this part, ensure the PCB provides sufficient thermal dissipation; the LFBGA package requires 6-layer stack-up with microvia-in-pad for reliable BGA assembly. SDRAM traces must be length-matched within 50 mils for DDR operation. Use the NXP MCUXpresso SDK and Config Tools for peripheral initialization and pin muxing.
This page synthesizes distributor pricing, pin-compatible i.MX RT1060 family drop-in alternatives, and practical design considerations not aggregated on a single manufacturer or distributor page.
Alternativas directas para MIMXRT1062DVL6B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MIMXRT1062DVL6B (mismo factor de forma y huella) — difiere en CAN, Core Architecture, Display Controller, Ethernet, Maximum CPU Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MIMXRT1062DVL6A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MIMXRT1061DVL6B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MIMXRT106FDVL6B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MIMXRT1060DVL6A
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX6Y1CVK05AB
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$13.9 / unidad
Ver hoja de datos →MIMXRT1062DVL6B Valores máximos y características eléctricas
| Core Architecture | Arm Cortex-M7 |
| Maximum CPU Frequency | 600 MHz |
| FPU | Single + Double Precision |
| On-chip SRAM | 1 MB |
| Cache | 16 KB I-cache + 16 KB D-cache |
| Operating Voltage (Core) | 0.95 V to 1.05 V |
| Operating Voltage (I/O) | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +105C (Industrial) |
| Encapsulado | 196-LFBGA (10x10 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| External Memory Bus | Dual FlexSPI (QSPI/Octal SPI/HyperBus) |
| Display Controller | LCDIF, up to WXGA (1366x768) |
| Graphics Accelerator | 2D PxP engine |
| Camera Interface | 8-bit CSI (parallel) |
| USB | 2x USB 2.0 OTG with integrated PHY |
| Ethernet | 10/100 Mbit MAC |
| CAN | 2x FlexCAN (CAN FD) |
| Security | CAAM, TrustZone-M, eFuse secure boot |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (168 hours) |
Guía de configuración de pines de MIMXRT1062DVL6B 196-lfbga (10x10 mm)
Configuración de pines para MIMXRT1062DVL6B (encapsulado 196-lfbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MIMXRT1062DVL6B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MIMXRT1062DVL6B es adecuado para 6 aplicacións: Industrial HMI Touch Panel, USB Audio Device with Display, Motor Control Inverter, Smart Home Gateway, Point-of-Sale Terminal, IoT Edge Sensor Node.
Industrial HMI Touch Panel
The MIMXRT1062DVL6B fits industrial HMI panels because its 600 MHz Cortex-M7 core plus LCDIF display controller up to WXGA (1366x768) handles capacitive touch UI rendering without an external graphics controller. The 1 MB on-chip SRAM stores frame buffers and font tables for responsive UI; the 2D PxP engine accelerates blit operations for menu transitions. Placed as the sole processor on the panel PCB with a 4.3-inch TFT-LCD driven directly by LCDIF, it eliminates the need for an MPU + external controller stack. The -40C to +105C industrial temperature rating covers factory-floor enclosures. Trade-off: switching to a Cortex-A MPU only makes sense for full Linux HMI stacks above 7-inch panels.
Recomendado
USB Audio Device with Display
The MIMXRT1062DVL6B serves USB audio products such as DAC/headphone amplifiers and USB microphones because the dual USB 2.0 OTG ports with integrated PHY directly handle UAC2.0 audio streaming at up to 384 kHz/32-bit. The Cortex-M7's single-precision FPU executes biquad filters, DRC, and loudness compensation at zero host-CPU load, while SAI interfaces drive external DAC chips. The 1 MB SRAM stores multiple preset EQ tables; the LCDIF outputs to small OLED/LCD displays for status. Place between the USB-C connector and the SAI DAC; provide a dedicated 3.3 V LDO (e.g., LP5900TLX-1.8) for analog supply isolation to keep jitter below 50 ps RMS.
Recomendado
Motor Control Inverter
The MIMXRT1062DVL6B drives 3-phase PMSM and BLDC inverters because its Cortex-M7 DSP extensions plus single-precision FPU execute Field-Oriented Control loops in under 5 us, fitting within 10 kHz PWM switching periods. Dual FlexCAN ports handle CANopen or CAN FD communication to the motion controller; the eFlexPWM modules generate center-aligned PWM with dead-time insertion for the gate drivers. Industrial temperature grade supports outdoor EV charging and servo-drive environments. Position between the gate-driver board and the CAN bus; provide isolated 5 V supply (e.g., LTM2881 or ISO7762FDWR) for the high-voltage side. Trade-off: FOC precision degrades above 20 kHz PWM switching.
Recomendado
Smart Home Gateway
The MIMXRT1062DVL6B acts as a smart-home gateway controller because its Ethernet MAC plus USB OTG and multiple UART/SPI/I2C interfaces concurrently handle Wi-Fi/Bluetooth HCI, Zigbee/Thread host, and RS-485 sensor buses. The 1 MB SRAM runs Thread/Zigbee protocol stacks simultaneously; the Cortex-M7 DSP accelerates AES-128/256 encryption for secure commissioning. The CAAM crypto accelerator offloads TLS handshakes. Place as the central MCU between the Wi-Fi/BT module (e.g., LBEE5HY1MW-230) and the sub-GHz radio; provide a dedicated RTC domain (e.g., M41T65Q6F) for timekeeping during deep-sleep. Trade-off: requires external SDRAM for full Matter stack above 2 MB image size.
Recomendado
Point-of-Sale Terminal
The MIMXRT1062DVL6B suits compact POS terminals because its 600 MHz core handles payment processing, barcode decryption, and LCD UI updates concurrently, while the 2D PxP engine accelerates image rendering on receipt printers. The CSI camera interface supports 1D/2D barcode scanning via attached image sensor; FlexSPI enables fast firmware updates from external QSPI flash. Multiple UARTs connect to NFC readers, EMV chip-card interfaces, and thermal printer heads. Industrial temperature ensures reliability in retail environments. Position between the secure keypad and the printer driver; isolate the card-reader SPI bus with ISO7761DW for PCI compliance.
Recomendado
IoT Edge Sensor Node
The MIMXRT1062DVL6B serves battery-powered IoT edge nodes because the Cortex-M7's low-power modes drop quiescent current below 5 uA in deep-sleep retention, while bursting to 600 MHz for sensor fusion and ML inference at the edge. The 1 MB SRAM stores TinyML models (e.g., CMSIS-NN) for keyword spotting or vibration analysis; the LCDIF output can drive small status displays. TrustZone-M isolates the secure boot and OTA update domain. Place as the central MCU between MEMS sensors (I2C/SPI) and the radio module; use a buck-boost converter (e.g., LTC3335) for energy harvesting from solar or thermal sources.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MIMXRT1062DVL6B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MIMXRT1062DVL6A | MIMXRT1061DVL6B | MIMXRT106FDVL6B | MIMXRT1060DVL6A | MCIMX6Y1CVK05AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LFBGA (10x10 mm) | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same | 196-LFBGA (10x10 mm) - same |
| Core | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-M7 | Cortex-A7 |
| Max Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 500 MHz |
| On-chip SRAM | 1 MB | 1 MB | 512 KB | 1 MB | 256 KB | 256 KB |
| Temperature Grade | Industrial (-40C to +105C) | Industrial | Industrial | Industrial | Consumer (0C to +70C) | Industrial |
| LCDIF Display Controller | Yes (up to WXGA) | Yes | Yes | Yes | Yes | Yes (LCDIF + MIPI-DSI) |
| USB 2.0 OTG | 2x with PHY | 2x with PHY | 2x with PHY | 2x with PHY | 2x with PHY | 1x with PHY + 1x HSIC |
Diferenciadores clave
- Largest on-chip SRAM in i.MX RT1060 family at 1 MB (frente a MIMXRT1061DVL6B)
- Industrial temperature grade for harsh environments (frente a MIMXRT1060DVL6A)
- Same-package drop-in versus Cortex-A MPU (frente a MCIMX6Y1CVK05AB)
Notas de diseño
Estimated: at 600 MHz full-clock with all peripherals active, the MIMXRT1062DVL6B draws approximately 350 mA from the 1.0 V core rail and 60 mA from the 3.3 V I/O rail, giving ~0.55 W total power dissipation. The 196-ball LFBGA 10x10 mm package has typical theta_JA of 28 C/W, which means a 15C temperature rise above ambient. For industrial enclosures at 85C ambient, this keeps the junction below 100C - adequate but with limited margin. Add thermal vias under the center ball array and a copper pour on top/bottom layers for headroom above 70C ambient.
The 196-ball LFBGA with 0.65 mm pitch requires PCB microvia-in-pad (stacked or staggered) on a 6-layer stack-up. Standard JEDEC Type-3 land pads with NSMD (Non-Solder-Mask-Defined) openings of 0.30 mm improve assembly yield. Use a 1.2 mm PCB thickness with high-Tg (FR-4 Tg>150C) material to survive reflow. Per IPC-7351, place decoupling caps directly under their associated balls on the opposite layer with via-in-pad. SDRAM and FlexSPI flash must use length-matched routing within 50 mil tolerance for reliable DDR-like timing.
Do not exceed the absolute maximum VDD_ARM of 1.05 V or VDD_SOC of 1.05 V - even a 50 mV overshoot during load transients will cause long-term reliability degradation. Ensure the external DC-DC converter (e.g., LTM4622 or TPS62840) has tight load regulation below +/-1%. The boot configuration pins (BOOT_CFG0/1) must be held stable during POR with 10 kΩ pull resistors; floating boot pins will cause intermittent boot failures. Always initialize the SDRAM controller with the correct calibration routine from NXP MCUXpresso SDK before any code execution that depends on external RAM.
FlexSPI signals to external QSPI/Octal SPI flash operate at up to 166 MHz SDR (333 MB/s). Route these traces on an inner layer with a continuous reference ground plane; use differential pair routing for the data strobe (DQS) signal. Add 33 ohm series-termination resistors at the MIMXRT1062DVL6B end of each FlexSPI line to dampen reflections. The CSI camera interface and LCDIF parallel bus should similarly use controlled-impedance (50 ohm single-ended) routing with series-termination when trace length exceeds 50 mm.
Place the MIMXRT1062DVL6B centrally on the top layer with all high-speed peripherals (FlexSPI, SDRAM, USB, Ethernet) routed on inner layers beneath a continuous ground plane. Keep the analog supply (VDDA_1P8) island isolated from digital switching; use a ferrite bead or pi-filter (10 uH + 1 uF + 0.1 uF) between VDD_SOC and VDDA_1P8. USB DP/DN traces must be 90 ohm differential with length matching within 150 mil. The 32.768 kHz crystal traces should be short (<5 mm) and guarded with ground.
Información de cumplimiento
RoHS and REACH compliant per NXP product page (https://www.nxp.com/part/MIMXRT1062DVL6B). Not AEC-Q100 qualified - choose MIMXRT1062DVL6A automotive suffix variants for vehicle applications. Lead-free and halogen-free per IPC-1752 material declaration.
