MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP
N.º de pieza: MPC603RRX266LC ✗ Fin de vidaMPC603RRX266LC Descripción general
What is a PowerPC MPU? A PowerPC microprocessor (MPU) is a 32-bit or 64-bit RISC processor core derived from the AIM (Apple-IBM-Motorola) PowerPC architecture. In the embedded hierarchy, a PowerPC MPU sits above microcontrollers (MCUs) in performance and integration: MPU -> embedded processor -> SoC -> computing platform. The 603e family specifically targets cost- and power-sensitive embedded designs where higher performance than an MCU is required but full desktop CPU features are unnecessary.
Key features include a 266 MHz core clock, 32-bit data and address paths, on-chip L1 instruction and data caches, a separate integer and floating-point unit, and a 2.5 V core supply. The FCCBGA package provides high-density interconnect for compact embedded modules and operates over industrial temperature ranges. The device also includes a JTAG IEEE 1149.1 boundary-scan test interface and supports multiprocessor configurations via dedicated address and data bus arbitration.
Architecturally, the MPC603e implements a four-stage pipeline with out-of-order execution and dynamic branch prediction, delivering roughly 3.5 SPECint95 per MHz. Its low-power features include doze, nap, and sleep modes that gate clocks to unused functional units. Compared to the original 603, the 603e added hardware assist for graphics and improved L2 cache support.
Typical applications include network routers and switches, industrial control systems, aerospace flight computers, telecom base stations, and legacy PowerPC embedded designs. The 266 MHz speed grade targets moderate-performance workloads requiring deterministic real-time behavior. Per Motorola PID7t-603e documentation, this part also carries extended-temperature grade for industrial use.
When designing with this part, provide a 2.5 V regulated core supply, a 3.3 V I/O supply, and proper PLL power filtering. Note that the MPC603RRX266LC is marked obsolete on most distributor pages; long-term designs should evaluate modern PowerQUICC or QorIQ replacements or source from authorized aftermarket channels.
This page synthesizes distributor stock data, parametric comparisons against related MPC603e speed grades, and design notes that extend beyond the manufacturer datasheet to support both legacy maintenance and new design feasibility checks.
Alternativas directas para MPC603RRX266LC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC603RRX266LC (mismo factor de forma y huella) — difiere en Lead Free Status, Mounting Type, Process Technology.
MPC603RRX300LC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC603RRX200LC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC603RRX233LC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC603RRX266HCR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC603RVG300LC
✅ Sustitución directaConsulte el precio
Ver hoja de datos →MPC603RRX266LCR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC603RRX266LC Valores máximos y características eléctricas
| Core Processor | PowerPC 603e |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Address Bus Width | 32-bit |
| Frecuencia de reloj máxima | 266 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.29 micron CMOS |
| Encapsulado / Carcasa | 255-BCBGA, FCCBGA (21x21 mm) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Estado RoHS | Non-Compliant |
| Temperatura de funcionamiento | Industrial grade |
| Series | MPC6xx |
Guía de configuración de pines de MPC603RRX266LC 255-bcbga, fccbga (21x21 mm)
Configuración de pines para MPC603RRX266LC (encapsulado 255-bcbga, fccbga (21x21 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC603RRX266LC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC603RRX266LC es adecuado para 6 aplicacións: Network Router Control Plane, Industrial Process Controller, Aerospace Flight Computer, Telecom Base Station Controller, Storage Area Network Controller, Medical Imaging Pre-processor.
Network Router Control Plane
The MPC603RRX266LC's 266 MHz PowerPC 603e core delivers enough processing throughput for routing-table lookup and packet-classification workloads in legacy mid-range routers. Its 32-bit data path and on-chip branch target buffer enable deterministic forwarding performance, while the 0.29 micron process keeps active power manageable for fanless chassis designs. The 2.5 V core / 3.3 V I/O split allows integration with standard telecom ASICs without extra level shifters, and the 255-FCCBGA package supports high-density backplane routing on compact line cards.
Recomendado
Industrial Process Controller
At 266 MHz with hardware-assisted floating point, the MPC603RRX266LC executes PID loops, motion-control sequences, and SCADA protocol stacks on factory-floor controllers. The FCCBGA ceramic package supports industrial temperature ranges and the vibration profiles typical of machine-mount enclosures. The PowerPC 603e's four-stage pipeline with branch prediction maintains low interrupt latency critical for deterministic control, while its doze/nap/sleep modes reduce power consumption during idle PLC scan cycles.
Recomendado
Aerospace Flight Computer
The MPC603RRX266LC's FCCBGA ceramic package and industrial temperature grading make it suitable for aerospace avionics subsystems where plastic-packaged MPUs are unacceptable. The PowerPC architecture is widely supported by RTOS vendors (VxWorks, Integrity, LynxOS) with DO-178C certification evidence, easing qualification of flight-control code. The on-chip floating-point unit accelerates inertial-navigation math, while JTAG 1149.1 boundary scan supports board-level test on flight hardware.
Recomendado
Telecom Base Station Controller
Legacy GSM/UMTS base-station controllers deployed the MPC603RRX266LC for Layer-2 processing, encryption, and backhaul aggregation. The processor's hardware cache-coherency protocol supports symmetric multiprocessing with a second 603e, doubling throughput for high-density cell sites. The 3.3 V I/O compatibility simplifies connection to legacy telecom ASICs, and the FCCBGA substrate dissipates HEAT effectively in sealed outdoor enclosures.
Recomendado
Storage Area Network Controller
The MPC603RRX266LC's 32-bit data path and L1 caches make it a fit for RAID-engine controller boards where it offloads command parsing and XOR compute from the host CPU. The PowerPC 603e's load/store architecture with write-back caches accelerates sequential and random I/O workloads, while the FCCBGA package supports the dense multi-channel layout of 8-16 port SATA/SAS controllers. The 2.5 V core also simplifies integration with modern ASICs designed for similar low-voltage rails.
Recomendado
Medical Imaging Pre-processor
In ultrasound and patient-monitoring pre-processor boards, the MPC603RRX266LC executes DSP-style preprocessing of sampled signals before forwarding to host CPUs. Its hardware floating-point unit accelerates FFT and convolution kernels, while deterministic interrupt response preserves the timing margins required for real-time signal acquisition. The FCCBGA ceramic package meets the long-term reliability expectations of medical device OEMs, and the 266 MHz speed grade is well-matched to mid-tier ultrasound channels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC603RRX266LC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC603RRX300LC | MPC603RRX200LC | MPC603RRX233LC | MPC603RVG300LC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 255-FCCBGA (21x21) | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-CBGA (21x21) - same |
| Core Frequency | 266 MHz | 300 MHz | 200 MHz | 233 MHz | 300 MHz |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process Technology | 0.29 micron CMOS | 0.29 micron CMOS | 0.29 micron CMOS | 0.29 micron CMOS | 0.29 micron CMOS |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Number of Cores | 1 | 1 | 1 | 1 | 1 |
| Package Substrate | Ceramic FCCBGA | Ceramic FCCBGA | Ceramic FCCBGA | Ceramic FCCBGA | Plastic CBGA |
| Core | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Drop-in speed-grade flexibility within the 603e family (frente a MPC603RRX200LC)
- Hermetic/Hi-Rel variant available for aerospace (frente a MPC603RRX266HCR)
- Ceramic FCCBGA substrate suitable for industrial temperature (frente a MPC603RVG300LC)
- Pin-compatible with all MPC603e FCCBGA speed grades (frente a PowerPC 745B (MPC745BPX300LE))
Notas de diseño
Estimated: at 266 MHz with all units active, the MPC603e core draws roughly 4 W from the 2.5 V rail; in doze mode the power drops by ~80%. Provide a switching regulator with at least 5 A capacity on the 2.5 V core rail and at least 2 A on the 3.3 V I/O rail. The PLL supply (AVDD) must be derived from the 2.5 V rail through a ferrite bead and decoupling capacitor per the Motorola PID7t-603e reference schematic to minimize jitter.
The 255-FCCBGA package has a theta-JA of approximately 12 C/W with adequate forced airflow (200 LFM). At full-load 4 W dissipation, junction temperature rises 48 C above ambient. Provide 200 LFM minimum airflow or a heatsink attached via thermal interface material for industrial chassis with no airflow. Use temperature sensors on the package top to monitor junction temperature during characterization.
The 255-FCCBGA uses a 1.27 mm ball pitch and requires ENIG surface finish for reliable assembly. Per IPC-7351, escape-routing the inner rows of the BGA demands microvia or HDI PCB technology with stacked vias. Place decoupling capacitors on the bottom side of the board directly under the BGA footprint, and dedicate at least 4 PCB layers to solid power and ground planes for return-path integrity.
The MPC603e 603e processor bus runs at 66 MHz synchronous to the CPU core. Match bus trace lengths to within 1.5 inches across address and data groups, and use 50 ohm controlled impedance. Series-stopp resistors may be required on heavily-loaded address lines to dampen reflections; consult the PID7t-603e hardware specification section on bus design for timing budgets.
Información de cumplimiento
Per DigChip datasheet listing 1459: 'Contains Lead' and RoHS non-compliant. Lead-bearing solder balls are typical of ceramic FCCBGA packages of this vintage. AEC-Q100 not applicable (this is a microprocessor, not an automotive analog IC).
