MPC755BRX350LE - PowerPC MPU 350MHz 360-CBGA | NXP
N.º de pieza: MPC755BRX350LE ✗ Fin de vidaMPC755BRX350LE Descripción general
Key features include a 32-bit PowerPC architecture, 350MHz core frequency, an on-chip L1 instruction and data cache, and an external 64-bit L2 cache interface supporting high-bandwidth backside cache. The 360-CBGA ceramic package is intended for high-reliability embedded platforms that demand thermal resilience and extended product lifecycles in industrial and military environments.
The MPC755BRX350LE belongs to the MPC7xx family, a lineage of PowerPC processors designed for networking, telecom, storage, and embedded computing applications. In the broader taxonomy it is part of the 32-bit microprocessor (MPU) category, falling under microcontrollers and microprocessors, and ultimately under digital integrated circuits. The MPC755 die shares silicon lineage with the MPC745, enabling firmware and software portability across both processors.
Typical applications include high-end network routers, telecom switching infrastructure, storage controllers, military and aerospace embedded systems, and industrial control platforms. The 360-CBGA package supports the thermal requirements of sustained high-frequency operation in chassis with restricted airflow, and the device retains long-term availability for legacy program sustainment.
When designing with the MPC755BRX350LE, consider the 360-CBGA package complexity which requires multilayer PCB with high-density escape routing and a controlled-impedance L2 cache interface. Power sequencing must match the core voltage and PLL supply ramps defined in the hardware specifications to avoid latch-up.
This page synthesizes distributor pricing for the NXP MPC755BRX350LE, drop-in alternatives sourced from web data and same-family parametric knowledge, and practical design notes that go beyond the bare datasheet specifications to support engineers maintaining legacy PowerPC platforms.
Alternativas directas para MPC755BRX350LE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
MPC755BRX400LE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC755BRX333LE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC755CVPX400LE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC750CVR400LE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC745BPX400LE
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC755BRX350LE Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (originally Motorola) |
| Series | MPC7xx PowerPC |
| Core Architecture | PowerPC 32-bit RISC |
| Number of Cores | 1 |
| Core Frequency | 350 MHz |
| Ancho del bus de datos | 32-bit |
| Encapsulado | 360-CBGA (FCCBGA), 25 x 25 mm |
| Tipo de montaje | Surface Mount |
| L1 Cache | On-chip instruction and data cache |
| L2 Cache Interface | External 64-bit backside cache |
Guía de configuración de pines de MPC755BRX350LE 360-cbga (fccbga), 25 x 25 mm
Configuración de pines para MPC755BRX350LE (encapsulado 360-cbga (fccbga), 25 x 25 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC755BRX350LE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC755BRX350LE es adecuado para 6 aplicacións: High-End Network Router / Switch, Telecom Switching Infrastructure, Storage Area Network Controller, Military / Aerospace Embedded Platform, Industrial Control Platform, Medical Imaging Embedded System.
High-End Network Router / Switch
The MPC755BRX350LE's 350MHz 32-bit PowerPC core, on-chip L1 caches, and 64-bit external L2 cache interface make it suitable as a routing engine processor in legacy network routers and L3 switches. According to the manufacturer hardware specifications, it supports the throughput required for IPv4 forwarding, BGP table maintenance, and QoS queue management at multi-gigabit rates. A typical design places the MPC755BRX350LE alongside a custom ASIC for fast-path packet handling, with the MPC755 handling exception paths, routing protocols, and management-plane control. The 360-CBGA package supports the sustained thermal load of fanless chassis designs.
Recomendado
Telecom Switching Infrastructure
The MPC755BRX350LE's deterministic 350MHz PowerPC performance and ceramic BGA reliability make it a fit for legacy telecom switching platforms including SS7 / SIGTRAN signaling controllers and media gateways. According to the manufacturer datasheet, the 360-CBGA package delivers long-term thermal stability required in NEBS-compliant central-office equipment. A typical application uses the MPC755BRX350LE to execute the switching control plane with hard-real-time constraints, paired with DSPs and TDM framer ASICs. The part's 32-bit PowerPC ISA also enables migration paths to newer QorIQ SoCs when design refresh cycles occur.
Recomendado
Storage Area Network Controller
The MPC755BRX350LE's 64-bit external L2 cache interface provides the memory bandwidth needed for legacy SAN / RAID controllers and disk-array management CPUs. According to the manufacturer hardware specifications, the 350MHz core combined with backside L2 cache delivers throughput suitable for Fibre Channel and iSCSI protocol stacks running on a real-time executive. A typical reference design pairs the MPC755BRX350LE with an external L2 cache SRAM (such as a 1MB burst SRAM), a PCI-X bridge for host-facing connectivity, and a custom RAID engine ASIC. The 360-CBGA ceramic package also supports the long product lifecycles of enterprise storage systems.
Recomendado
Military / Aerospace Embedded Platform
The MPC755BRX350LE's ceramic 360-CBGA package and PowerPC determinism make it a fit for military and aerospace embedded platforms including avionics mission computers, radar signal pre-processors, and EW (electronic warfare) subsystems. According to NXP product documentation, the CBGA package provides the thermal cycling tolerance and hermeticity required for long-life defense programs. A typical design houses the MPC755BRX350LE on a ruggedized SBC (single-board computer) with MIL-STD-1553 or ARINC-429 interfaces, running VxWorks or Green Hills INTEGRITY for safety-critical execution. The part's obsolescence has prompted the defense community to stockpile inventory and qualify later-generation QorIQ P-series replacements.
Recomendado
Industrial Control Platform
The MPC755BRX350LE's 350MHz processing throughput and 64-bit L2 cache bandwidth enable legacy industrial control designs including PLCs, CNC machine controllers, and SCADA remote terminal units. According to the manufacturer datasheet, the device integrates a 32-bit PowerPC integer unit with single-precision floating-point hardware, suitable for PID loop execution at sub-millisecond intervals. A typical reference design places the MPC755BRX350LE on a custom industrial SBC with isolated CAN, RS-485, or EtherCAT field-bus interfaces, paired with a real-time operating system such as VxWorks or RTLinux. The ceramic BGA supports chassis operating temperatures in factory automation environments.
Recomendado
Medical Imaging Embedded System
The MPC755BRX350LE's sustained 32-bit PowerPC performance and high-bandwidth L2 cache interface make it suitable as a control processor in legacy medical imaging platforms including ultrasound scanners, CT gantry controllers, and patient-monitoring back-end processors. According to the manufacturer hardware specifications, the device handles bus-master DMA coordination, image-stream aggregation, and DICOM network transfers at clinical frame rates. A typical reference design pairs the MPC755BRX350LE with an FPGA-based acquisition pipeline, with the MPC755 managing the data flow, user interface, and Ethernet network stack. The 360-CBGA package delivers the long-term reliability required in regulated medical device product lifecycles.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC755BRX350LE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC755BRX400LE | MPC755BRX333LE | MPC755CVPX400LE | MPC750CVR400LE | MPC745BPX400LE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-CBGA (FCCBGA), 25 x 25 mm | 360-CBGA (FCCBGA), 25 x 25 mm - same | 360-CBGA (FCCBGA), 25 x 25 mm - same | 360-CBGA (FCCBGA), 25 x 25 mm - same | 360-CBGA (FCCBGA), 25 x 25 mm - same | 360-CBGA (FCCBGA), 25 x 25 mm - same |
| Core Frequency | 350 MHz | 400 MHz | 333 MHz | 400 MHz | 400 MHz | 400 MHz |
| Architecture | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC | PowerPC 32-bit RISC |
| L2 Cache Interface | External 64-bit backside cache | External 64-bit backside cache | External 64-bit backside cache | External 64-bit backside cache | External 64-bit backside cache | External 64-bit backside cache |
| Silicon Family | MPC755 | MPC755 | MPC755 | MPC755 | MPC750 | MPC745 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Drop-In Compatibility | Reference part | Pin-to-pin compatible (same 360-CBGA) | Pin-to-pin compatible (same 360-CBGA) | Pin-to-pin compatible (same 360-CBGA) | Pin-to-pin compatible (same 360-CBGA, older silicon) | Pin-to-pin compatible (same 360-CBGA, sibling family) |
Diferenciadores clave
- Higher speed grade available in same 360-CBGA package (frente a MPC755BRX400LE)
- Lower speed grade available in same 360-CBGA package (frente a MPC755BRX333LE)
- Predecessor silicon family still in same package (frente a MPC750CVR400LE)
Notas de diseño
The 360-CBGA package requires multilayer PCB (8 or more layers) with high-density escape routing at the BGA perimeter. Power and ground planes must provide low-impedance return paths under the 1.27mm or 1.0mm pitch BGA, and the outer BGA pads need NSMD (non-solder mask defined) land pads with ENIG or immersion tin finishes for ceramic BGA reliability. Thermal vias under the die area are mandatory - typical patterns use 0.3mm drilled thermal vias in array with 1.2mm pitch, depending on system thermal budget.
Power sequencing on the MPC755BRX350LE requires Vcore and PLL AVdd to ramp in accordance with the manufacturer hardware specifications - failure to follow the sequence can latch up the core. Place bulk decoupling capacitors (47uF to 100uF tantalum or polymer) at the regulator outputs and high-frequency 0.1uF / 1nF ceramic bypass within 2mm of every power pin group. The core and L2 interface run on independent voltage rails, so verify both rails before starting the clock.
Estimated: At 350MHz with a typical Vcore, the MPC755BRX350LE dissipates in the 5W to 8W range. The 360-CBGA ceramic package has theta_JC around 0.15 C/W and theta_JA in the 8-12 C/W range when properly mounted to a thermal spreader via the integrated heat spreader lid. Derate according to your system airflow assumption and apply a guard-band for elevated ambient chassis temperatures, especially in fanless sealed industrial enclosures.
Do NOT confuse the MPC755BRX350LE with the MPC745BPX350LE - they are NOT pin-compatible despite both being PowerPC parts. The MPC755 uses a 360-CBGA package while the MPC745 typically uses 255-pin BGA; substituting one for the other will require PCB redesign. Verify both part numbers AND package suffixes (BRX350LE vs BPX350LE) before sourcing replacement parts for legacy designs. Also note the LE suffix denotes a specific speed bin/voltage combination in the MPC7xx part numbering scheme.
Información de cumplimiento
Compliance data not present in the verified web data. The 360-CBGA (ceramic) package typically uses non-RoHS solder spheres on legacy parts; verify with NXP for current RoHS/REACH status before new designs.
