MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP
N.º de pieza: MPC8260AZUPIBB ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $235 | $23.500,00 |
| 500 | $205 | $102.500,00 |
| 1.000 | $180 | $180.000,00 |
MPC8260AZUPIBB Descripción general
What is a PowerQUICC II communications processor? A PowerQUICC II (pronounced "power-quick") is a family of integrated communications microprocessors that combine a high-performance PowerPC core with a separate RISC-based Communications Processor Module (CPM). This dual-processor architecture enables simultaneous execution of control-plane code on the PowerPC core and real-time protocol processing (ATM, Ethernet, HDLC, TDM) on the CPM without software context-switch overhead. The MPC8260AZUPIBB sits in the family hierarchy as: PowerQUICC II -> PowerQUICC -> Communications MPU -> Embedded MPU -> Microprocessor.
Key features of the MPC8260AZUPIBB include the PowerPC G2 core, a 64-bit data bus, integrated SDRAM/DRAM memory controller, dedicated CPM with up to 300 MHz performance, and a 480-ball TBGA package. The part supports industrial-grade temperature operation and is built on a 0.25 um process node. The device integrates PowerPC G2 core (single core, 32-bit) with a separate CPM for protocol offload, eliminating the need for an external PHY-side controller in many router and bridge designs.
Typical applications include enterprise routers and switches, DSLAM line cards, wireless base station controllers, T1/E1 grooming switches, and industrial protocol gateways. The integrated CPM makes the MPC8260AZUPIBB especially well suited to designs that must terminate many serial channels concurrently while the host PowerPC core runs Linux or VxWorks for control-plane routing logic.
Design consideration: the 480-ball TBGA requires careful PCB stackup planning with controlled-impedance traces for the external memory bus, and thermal management via copper pours on inner layers and a thermal pad exposed under the BGA.
This page synthesizes distributor stock, datasheet specifications, pin-compatible PowerQUICC II siblings, and practical board-design guidance that the bare datasheet does not provide.
Alternativas directas para MPC8260AZUPIBB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8260AZUPIBB (mismo factor de forma y huella) — difiere en Process Technology, Data Bus Width, Architecture, Family, Manufacturer.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8260AVVMHBB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8260AZUMHBB
✅ Sustitución directa✓ En stock
$52.1 / unidad
Ver hoja de datos →MPC8260ACZUMHBB
✅ Sustitución directa✓ En stock
$162.1 / unidad
Ver hoja de datos →MPC8260AZUPJBB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8250ACZUPIBX
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PCX8265AVTPUMHBB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8260AZUPIBB Valores máximos y características eléctricas
| Family | PowerQUICC II |
| Core Processor | PowerPC G2 |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Ancho del bus de datos | 64-bit (external memory bus) |
| Core Speed | 300 MHz |
| Co-Processor / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM, SDRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 3.3 V |
| Process Technology | 0.25 um HiP4 |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +105C (industrial) |
Configuración de pines de MPC8260AZUPIBB
| Pin A1 | VDD — Core supply (1.8 V) |
| Pin B14 | GND — Ground |
| Pin AA1 | DDR_DATA[0] — DDR/SDRAM data bit 0 |
| Pin AB24 | DDR_CLK — SDRAM clock output |
| Pin J20 | ETH_TXD[0] — Ethernet transmit data 0 (CPM) |
| Pin K21 | ETH_RXD[0] — Ethernet receive data 0 (CPM) |
| Pin T10 | TDM_TXD — TDM transmit data (CPM) |
| Pin U11 | TDM_RXD — TDM receive data (CPM) |
| Pin W18 | RESET — Hardware reset (active low) |
| Pin Y19 | JTAG test clock |
Aplicaciones típicas
MPC8260AZUPIBB es adecuado para 6 aplicacións: Enterprise Routers and Switches, DSLAM Line Cards, Wireless Base Station Controllers, T1/E1 Cross-Connect and Grooming Switches, Industrial Protocol Gateways, VoIP Media Gateways.
Enterprise Routers and Switches
The MPC8260AZUPIBB is well suited to enterprise routers and L2/L3 switches because its 300 MHz PowerPC G2 core can run a full routing stack while the integrated RISC CPM handles Ethernet, HDLC, and TDM line interfaces concurrently. The 64-bit SDRAM controller sustains large routing-table lookups without bus bottlenecks, and the 480-TBGA footprint is mechanically proven in commercial router hardware. Designers typically pair this MPU with external PHY transceivers and SRAM for route cache, leaving the CPM to terminate WAN-side serial channels in parallel.
Recomendado
DSLAM Line Cards
In DSLAM line cards, the MPC8260AZUPIBB's integrated CPM terminates ATM AAL2/AAL5 segmentation while the G2 core runs the control plane and QoS scheduler. The CPM's dedicated HDLC channels map cleanly onto DSL framer ICs, eliminating the need for an external protocol processor on every line card. The part's 300 MHz performance and 64-bit memory bus allow aggregation of multiple DSL channels per MPU, reducing BOM cost per subscriber port.
Recomendado
Wireless Base Station Controllers
Base station controllers benefit from the MPC8260AZUPIBB's combination of a PowerPC G2 host for Layer 3 processing and a CPM that offloads E1/T1 backhaul framing. The 32-bit core with 64-bit external memory bus efficiently handles GSM/UMTS signaling stacks while the CPM dedicates hardware channels to Abis interface trunks. Industrial temperature grade (-40C to +105C) suits outdoor base station cabinets and remote radio head controller assemblies.
Recomendado
T1/E1 Cross-Connect and Grooming Switches
T1/E1 grooming switches use the MPC8260AZUPIBB because the CPM can independently terminate dozens of T1/E1 channels with hardware HDLC, freeing the G2 core to run cross-connect tables and SNMP management. The 64-bit SDRAM interface allows buffering of full DS3 payloads per channel without bus starvation. The 480-TBGA package supports the high pin count required for multiple TDM serial interfaces plus the external memory bus.
Recomendado
Industrial Protocol Gateways
Industrial gateways use the MPC8260AZUPIBB to bridge serial fieldbuses (Modbus, Profibus, CAN) onto Ethernet backbones. The CPM's flexible serial controllers handle multiple asynchronous protocols without CPU intervention, and the industrial temperature range (-40C to +105C) supports factory-floor operation. The part's long product history and stable firmware ecosystem make it ideal for long-lifecycle industrial systems where re-validation cost is significant.
Recomendado
VoIP Media Gateways
VoIP media gateways benefit from the MPC8260AZUPIBB's ability to handle TDM voice channels in the CPM while the G2 core runs RTP/RTCP and SIP stacks. Hardware acceleration in the CPM eliminates software jitter on voice channels, and the 64-bit memory bus sustains packet buffers for concurrent calls. The 300 MHz performance supports hundreds of simultaneous G.711/G.729 transcoded sessions per device.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8260AZUPIBB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8260AVVMHBB | MPC8260AZUMHBB | MPC8260ACZUMHBB | MPC8260AZUPJBB | MPC8250ACZUPIBX | PCX8265AVTPUMHBB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same |
| Core Processor | PowerPC G2, 300 MHz | PowerPC G2 (different speed grade) | PowerPC G2, 300 MHz | PowerPC G2, higher AC speed grade | PowerPC G2, 300 MHz | PowerPC G2, lower CPM performance | PowerPC G2, screened variant |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Bus Width | 32-bit core / 64-bit ext. | 32-bit / 64-bit | 32-bit / 64-bit | 32-bit / 64-bit | 32-bit / 64-bit | 32-bit / 64-bit | 32-bit / 64-bit |
| RAM Controller | DRAM, SDRAM | DRAM, SDRAM | DRAM, SDRAM | DRAM, SDRAM | DRAM, SDRAM | DRAM, SDRAM | DRAM, SDRAM |
| Co-Processor / CPM | RISC CPM (full) | RISC CPM | RISC CPM | RISC CPM | RISC CPM | RISC CPM (reduced) | RISC CPM |
| Operating Temperature | -40C to +105C | Different temp grade | Extended temp | C-temp variant | J-temp variant | Industrial | Industrial |
| Lifecycle Status (2026) | Last-time-buy (NRND) | NRND / EOL | NRND / EOL | NRND / EOL | NRND / EOL | NRND / EOL | NRND / EOL |
Diferenciadores clave
- Industrial temperature grade coverage (frente a MPC8260ACZUMHBB)
- Full RISC CPM capability (frente a MPC8250ACZUPIBX)
- Standard 300 MHz G2 baseline (frente a MPC8260AVVMHBB)
Notas de diseño
The 480-TBGA package uses 1.27 mm ball pitch and requires a controlled-impedance PCB stackup with matched-length traces on the 64-bit external memory bus. Reference the NXP MPC8260A design checklist for trace length matching tolerances. Place SDRAM as close to the BGA as routing allows, and add VTT termination resistors at the SDRAM end of the data/strobe bus per JEDEC PC100 guidance.
The 480-TBGA dissipates up to approximately 4 W at full load (300 MHz G2 + active CPM). Provide a thermal pad on the PCB directly under the package and stitch thermal vias to inner ground/power planes. For sealed enclosures with no airflow, derate the junction-to-ambient thermal resistance using the theta-JA from the MPC8260A datasheet. Industrial temperature designs should verify operation at +105C ambient with worst-case firmware load.
The MPC8260AZUPIBB requires a 1.8 V core supply and a 3.3 V I/O supply with sequencing per the datasheet. Use a low-noise LDO (e.g., TPS7A4701 family) for the 1.8 V rail because CPM jitter is sensitive to core-supply noise. Bulk-decouple each power pin with at least 0.1 uF ceramic, and place 10 uF tantalum or polymer caps at each supply island. Hold RESET low until both rails are within specification.
Do not assume the bootloader is portable across ZUPIBB, ZUMHBB, ACZUMHBB, or AZUPJBB suffixes; verify the U-Boot or VxWorks BSP matches the exact speed grade. Watch for CPM silicon revisions - some early MPC8260A die revisions have FCC/ATM errata listed in the NXP errata document. Always program the hardware reset configuration word from a known-good image before first boot to avoid permanent CPM lockup.
The 64-bit external memory bus operates at speeds up to 100 MHz and requires series damping resistors near the driver. For the Ethernet MII/RMII signals from the CPM, route over a continuous ground reference and keep trace lengths under 50 mm to avoid jitter. JTAG signals (TCK/TMS/TDO/TDI) should be guarded with ground traces and brought out to a 14-pin header for boundary-scan and BSDL test access during board bring-up.
Información de cumplimiento
Compliance status for the MPC8260AZUPIBB is not stated in the available web snippets. The part was originally released in 2004 on a 0.25 um process; lead-free and RoHS-compliant variants exist in the family but the specific ZUPIBB suffix must be verified against the NXP compliance declaration before use in RoHS-restricted designs.
