MPC8260AZUPIBB vs MPC8260AZUMHBB Comparación
Comparación detallada lado a lado de MPC8260AZUPIBB por NXP Semiconductors y MPC8260AZUMHBB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP
MPC8260AZUPIBB ⚠ Última compraNXP Semiconductors
MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA
MPC8260AZUMHBB NrndComparación de especificaciones
| Parámetro | MPC8260AZUPIBB | MPC8260AZUMHBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $180,00 | $52,10 |
| Family | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Ancho del bus de datos | 64-bit (external memory bus) | 64-Bit |
| Core Speed | 300 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Supply Voltage (Core) | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 3.3 V | 3.3 V |
| Process Technology | 0.25 um HiP4 | 0.25 µm CMOS |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +105C (industrial) | [DATA_NEEDED: industrial/commercial junction range] |
| Estado RoHS | [DATA_NEEDED: RoHS status not stated in web snippets] | [DATA_NEEDED: per NXP product page] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Product Family | — | PowerQUICC II HIP4 (MPC82xx) |
| Architecture | — | RISC, PowerPC G2 |
| Core Clock Frequency | — | 266 MHz |
| Package Type | — | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Peripherals | — | Communication Processor Module (CPM), PCI, Ethernet, ATM, HDLC |
| Silicon Revision | — | Rev B (HIP4) |
| Tray Packaging | — | Yes (per distributor listings) |