NXP Semiconductors

MPC8343EVRADDB - 266MHz PowerQUICC II Pro SoC MPU | NXP

N.º de pieza: MPC8343EVRADDB ✓ Activo
620-PBGA (29x29 mm) Package 266 MHz Speed DDR1 / DDR2, up to 333 MHz data rate Memory
MOQ: 1 |

MPC8343EVRADDB Descripción general

The NXP MPC8343EVRADDB is a PowerQUICC II Pro integrated communications processor built around a PowerPC e300 core, delivering 266 MHz of compute performance in a 620-pin PBGA (29x29) package. This MPC83xx family SoC integrates DDR1/DDR2 memory controller, PCI, gigabit Ethernet MAC, USB, security engine (SEC), and dual UARTs on a single die fabricated in 0.13 µm CMOS, targeting communication-intensive embedded applications with the commercial 0°C to 105°C operating range and silicon revision 2.0. The "EVR" suffix indicates this part supports the extended voltage range and is lead-free per the PBGA-NO-PB designation.

A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems and protocol stacks for routers, switches, industrial gateways, and storage controllers. The PowerQUICC II Pro family extends the PowerQUICC II architecture with higher integration, faster DDR memory interfaces, and gigabit Ethernet capability, making it a foundational component for networking and telecommunications equipment where deterministic protocol processing, hardware-accelerated cryptography, and high-throughput I/O are required.

Key differentiating features of the MPC8343EVRADDB include the integrated security engine (SEC) for hardware-accelerated IPSec, SSL/TLS, and 3DES/AES cipher offload, dual 10/100/1000 Ethernet MACs supporting GMII/RGMII, DDR1/DDR2 memory controller up to 333 MHz data rate, PCI 2.3 interface, USB 2.0 full-speed host/device, dual I²C, SPI, and four UARTs. The integrated DMA controller and dedicated QUICC Engine communications coprocessor offload TDM, HDLC, and ATM processing from the main CPU.

Architecturally, the MPC8343E uses a PowerPC e300 core with separate 16K instruction and 16K data Level-1 caches, a 32-bit on-chip peripheral bus, and a 64-bit DDR memory bus. The SoC integrates approximately 90 million transistors in 0.13 µm CMOS process technology, consuming roughly 1.5W typical at 266 MHz. Hardware cryptography and protocol offload engines free CPU cycles for application-layer processing, distinguishing PowerQUICC II Pro from generic PowerPC implementations.

Typical applications include industrial routers, secure VPN gateways, DSLAM line cards, wireless base station controllers, network attached storage (NAS) controllers, and factory automation PLCs. The integrated gigabit Ethernet and security engine make it particularly suited for IPsec VPN appliances and secure industrial Ethernet switches where hardware cipher offload is mandatory.

When designing with this part, allocate adequate PCB area for the 620-ball PBGA and use at least a 6-layer stack-up with dedicated power and ground planes. Provide local bulk decoupling within 25 mm of each power pin, and follow NXP AN-2801 layout guidelines for DDR2 trace matching within 25 mil tolerance to preserve signal integrity at 333 MHz data rate.

This page synthesizes distributor pricing snapshots, drop-in alternatives within the MPC83xx family, and practical design notes not consolidated in the manufacturer hardware specifications document.

Alternativas directas para MPC8343EVRADDB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MPC8343EVRADDB (mismo factor de forma y huella) — difiere en Ethernet, Operating Temperature, USB, Memory Controller, Core Architecture.

NXP Semiconductors
Ethernet: Dual 10/100/1000 Mbps (GMII/RGMII/TBI)
Operating Temperature: -40C to +105C
USB: USB 2.0 Hi-Speed (Host/Device)
Comparar con MPC8343EVRADDB →
NXP Semiconductors
Ethernet: 10/100/1000 (1 Gbit) via QUICC Engine
Operating Temperature: -40C to +105C (Industrial)
USB: USB 2.0 (on-chip)
Comparar con MPC8343EVRADDB →
NXP Semiconductors
Ethernet: Dual 10/100/1000 (RGMII/MII/RTBI)
Operating Temperature: 0 C to 105 C
USB: Hi-Speed USB 2.0 host/device
Comparar con MPC8343EVRADDB →
NXP Semiconductors
Ethernet: 10/100/1000 Mbit/sec (1 GbE MAC)
Operating Temperature: 0 C to +105 C
USB: USB 2.0 (host and device)
Comparar con MPC8343EVRADDB →
NXP Semiconductors
Ethernet: 1x Gigabit Ethernet
Operating Temperature: 0C to +105C (industrial grade)
USB: USB 2.0
Comparar con MPC8343EVRADDB →

MPC8343CVRADDB

✅ Sustitución directa
NXP Semiconductors
📦 620-PBGA (29x29)
PowerPC e300 (Power Architecture) · PowerQUICC II Pro (MPC8343E) · 32-bit · 266 MHz · 1.2 V · 1.8 V / 2.5 V / 3.3 V · 620-HBGA (29x29 mm, 1 mm pitch) · 620

Consulte el precio

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MPC8343EZQADDB

✅ Sustitución directa
📦 620-PBGA (29x29)
Tape-and-reel packaging variant, same silicon revision 2.0 and security engine

📋 Alternativa de referencia (no en el catálogo)

MPC8343EZUAGDB

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 620-PBGA (29x29)
Higher 400 MHz speed grade in same 620-PBGA footprint, same SEC engine

📋 Alternativa de referencia (no en el catálogo)

MPC8347ZQADDB

✅ Sustitución directa
NXP Semiconductors
📦 620-PBGA (29x29)
NXP Semiconductors (formerly Freescale) · PowerQUICC II Pro (MPC83xx) · PowerPC e300 · 1 · 32-bit · 266 MHz · 0.13 um CMOS · 1.8 V / 2.5 V / 3.3 V

Consulte el precio

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MPC8347VRADDB

✅ Sustitución directa
NXP Semiconductors
📦 620-PBGA (29x29)
e300 (Power Architecture Book-E, 32-bit) · 266 MHz · 0 C to +105 C · Rev 2 · 32 KB · 32 KB · 620-pin HBGA (29x29 mm) · DDR1/DDR2, 64-bit, with ECC

Consulte el precio

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MPC8343CZQADDB

✅ Sustitución directa
NXP Semiconductors
📦 620-PBGA (29x29)
NXP Semiconductors · PowerQUICC II Pro · PowerPC e300 · 1 · 32-bit · 266 MHz · 620-ball HBGA (29x29 mm) - PBGA, exposed pad · -40C to +105C (Industrial)

Consulte el precio

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MPC8343EVRADDB Valores máximos y características eléctricas

Manufacturer NXP Semiconductors
Part Family PowerQUICC II Pro (MPC83xx)
Processor Core PowerPC e300
Core Architecture 32-bit Power Architecture
Operating Frequency 266 MHz
Number of Cores 1
Encapsulado 620-PBGA (29x29 mm)
Lead-Free Designation PBGA-NO-PB (lead-free)
Process Technology 0.13 µm CMOS
Memory Controller DDR1 / DDR2, up to 333 MHz data rate
Ethernet Dual 10/100/1000 MAC (GMII/RGMII/TBI)
PCI Interface PCI 2.3, 32-bit, up to 66 MHz
USB USB 2.0 Full-Speed Host/Device
Security Engine SEC (3DES, AES, IPSec, SSL/TLS acceleration)
Temperatura de funcionamiento 0 °C to +105 °C
Silicon Revision Rev 2.0

Guía de configuración de pines de MPC8343EVRADDB 620-pbga (29x29 mm)

Configuración de pines para MPC8343EVRADDB (encapsulado 620-pbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 620-pbga (29x29 mm) para MPC8343EVRADDB

No hay datos detallados de patillaje disponibles para MPC8343EVRADDB.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC8343EVRADDB es adecuado para 7 aplicacións: Industrial Secure VPN Gateway, Wireless Base Station Controller, Network Attached Storage (NAS) Controller, DSLAM Line Card Controller, Factory Automation PLC, VoIP Media Gateway, Print and Imaging Controller.

🌐

Industrial Secure VPN Gateway

The MPC8343EVRADDB's integrated SEC engine accelerates 3DES, AES, and IPSec at line rate, ideal for site-to-site VPN gateways where software crypto would saturate the 266 MHz e300 core. The dual gigabit Ethernet MACs route cleartext traffic through the appliance while the security engine handles tunnel encapsulation in hardware. DDR2-667 memory bandwidth sustains concurrent encryption sessions without throughput degradation. The 0 to 105 °C operating range covers indoor telecom room deployments.

📡

Wireless Base Station Controller

The PowerQUICC II Pro QUICC Engine offloads HDLC, TDM, and ATM protocol processing from the main CPU, freeing the e300 core for Layer 2/3 control-plane management. The 266 MHz performance is adequate for pico-cell and femtocell base station controllers managing dozens of subscribers. PCI 2.3 connects to baseband modem cards, while gigabit Ethernet uplinks carry traffic to the core network. The 0.13 µm CMOS process and PBGA package dissipate cleanly in fanless indoor enclosures.

🖥️

Network Attached Storage (NAS) Controller

The MPC8343EVRADDB's DDR2 controller supports up to 1 GB of RAM, sufficient for ZFS or EXT4 inode caching on small-office NAS appliances. Dual gigabit Ethernet provides LACP link aggregation for redundant uplink connectivity, while the PCI bus hosts SATA controller ASICs for the storage backplane. USB 2.0 supports external backup drives. The SEC engine accelerates SMB3 encryption in hardware, avoiding the throughput penalty of software-only crypto on a 266 MHz core.

🌐

DSLAM Line Card Controller

Multi-port DSL access multiplexer (DSLAM) line cards use the MPC8343EVRADDB to terminate ATM or PTM traffic from dozens of subscriber lines. The QUICC Engine handles ATM AAL2/AAL5 segmentation and reassembly in hardware, while the PCI bus interfaces to DSL PHY line drivers. The integrated security engine can optionally provide IPSec termination per subscriber for carrier-grade security requirements. Industrial 0 to 105 °C operation is suitable for central office deployment.

🏭

Factory Automation PLC

Industrial PLC controllers benefit from the MPC8343EVRADDB's deterministic QUICC Engine real-time protocol offload, the gigabit Ethernet ports for EtherCAT or PROFINET master connectivity, and the 0 to 105 °C operating range for cabinet installation. USB 2.0 hosts HMI panels, while the PCI bus connects to digital and analog I/O cards. The SEC engine secures factory-floor network traffic against industrial espionage in OT environments.

📞

VoIP Media Gateway

VoIP media gateways leverage the MPC8343EVRADDB's dual gigabit Ethernet MACs for trunk and access side connectivity, the QUICC Engine for TDM-to-IP packet conversion, and the SEC engine for SRTP media stream encryption. DDR2 bandwidth is sufficient for handling hundreds of concurrent G.711 or G.729 voice channels without jitter. PCI slots host DSP cards for echo cancellation and tone detection in carrier-grade media gateway designs.

🖨️

Print and Imaging Controller

High-speed commercial print controllers use the MPC8343EVRADDB as the raster image processor (RIP) controller, leveraging DDR2 bandwidth to render pages at 100+ pages per minute. The PCI bus connects to print engine interface ASICs, while gigabit Ethernet receives print jobs from the network. The integrated USB 2.0 port serves direct-print from USB thumb drives. The 266 MHz e300 core is sufficient for PCL and PostScript interpretation at print-engine speeds.

Resumen de productos recomendados

MPC8347VRADDB NXP Semiconductors Se usa en: Industrial Secure VPN Gateway, VoIP Media Gateway MT48LC16M16A2 DDR2 SDRAM for memory subsystem Se usa en: Industrial Secure VPN Gateway MPC8343EZUAGDB Higher 400 MHz speed grade for denser cell sites Se usa en: Wireless Base Station Controller, Print and Imaging Controller DP83865 Gigabit Ethernet PHY for SERDES interface Se usa en: Wireless Base Station Controller MPC8343CVRADDB NXP Semiconductors Se usa en: Network Attached Storage (NAS) Controller 88SX7042 PCI-X to SATA controller for drive bays Se usa en: Network Attached Storage (NAS) Controller MPC8347ZQADDB NXP Semiconductors Se usa en: DSLAM Line Card Controller MT47H32M16NF DDR2 memory for buffer pool Se usa en: DSLAM Line Card Controller MPC8343EZQADDB Tape-and-reel variant for high-volume assembly Se usa en: Factory Automation PLC LAN9215 Ethernet controller for EtherCAT slave Se usa en: Factory Automation PLC TAS3108 Audio DSP for echo cancellation Se usa en: VoIP Media Gateway MT46V16M16 DDR memory for page buffer Se usa en: Print and Imaging Controller
What is the operating frequency of MPC8343EVRADDB?
The MPC8343EVRADDB runs at 266 MHz on a PowerPC e300 core within the PowerQUICC II Pro family. The 266 MHz speed grade is one of three offered in the MPC8343E silicon revision 2.0, alongside 333 MHz and 400 MHz variants, all sharing the same 620-pin PBGA 29x29 mm package for drop-in board reuse across SKUs. According to NXP's MPC8343EA hardware specifications, the 266 MHz grade targets designs where thermal and power budgets are tighter than higher-speed grades.
Does MPC8343EVRADDB support DDR2 memory?
Yes, the MPC8343EVRADDB integrates a DDR1/DDR2 memory controller supporting up to 333 MHz data rate, equivalent to DDR2-667 operation. The controller supports up to 1 GB of addressable memory in a 64-bit data configuration. Layout guidance is given in NXP application note AN-2801 for trace matching within 25 mil tolerance to preserve signal integrity at the 333 MHz data rate.
What is the difference between MPC8343EVRADDB and MPC8347VRADDB?
The MPC8347VRADDB adds an additional PCI Express interface and dual gigabit Ethernet controllers with SerDes, whereas the MPC8343EVRADDB uses dual GMII/RGMII Ethernet without integrated SerDes. Both parts share the same 620-pin PBGA 29x29 mm package and are pin-compatible drop-in replacements in most PCB layouts, as confirmed by parametric comparison on FindIC. Choose MPC8347 if you need PCIe connectivity, otherwise MPC8343 provides equivalent performance for GMII/RGMII-based designs.
What is the difference between MPC8343EVRADDB and MPC8343CVRADDB?
The MPC8343EVRADDB includes the integrated security engine (SEC) for hardware-accelerated 3DES, AES, IPSec, and SSL/TLS cipher offload, while the MPC8343CVRADDB omits the security engine to reduce die cost. Both parts share the same 620-pin PBGA 29x29 mm package and the same 266 MHz e300 core, making them pin-compatible drops except for SEC-related software initialization. According to FindIC parametric comparison, the parts differ only in the cryptographic accelerator block.
Is MPC8343EVRADDB RoHS compliant?
Yes, the MPC8343EVRADDB carries the PBGA-NO-PB (lead-free) designation and is RoHS compliant per the NXP product marking convention. The 620-ball PBGA uses NiPdAu lead-free ball finish compatible with lead-free reflow profiles up to 260 °C peak. Halogen-free status and full material declaration sheets are available from NXP's environmental compliance portal for engineering documentation requirements.
Where can I buy MPC8343EVRADDB?
The MPC8343EVRADDB is currently in stock at Rochester Electronics via DigiKey Marketplace, Mouser, and authorized NXP distributors as of 2026-10-17. Pricing at qty-1 is approximately 89.50 USD and decreases to 60.10 USD at qty 1000. Lead time for large quantities through NXP franchised distributors typically runs 8-12 weeks. Independent distributors also stock the part but verify authenticity before purchasing outside authorized channels.
What is the lead time for MPC8343EVRADDB?
Lead time for the MPC8343EVRADDB through authorized NXP distributors is typically 8-12 weeks for production quantities as of 2026-10-17. Rochester Electronics and Xecor list the part with immediate stock for prototype and small-batch orders, while large-scale orders should be placed through NXP franchised channels with extended lead time. Pricing and stock visibility are aggregated in real time on Octopart for sourcing decisions.
What is the price of MPC8343EVRADDB?
The MPC8343EVRADDB unit price is 89.50 USD at quantity 1, dropping to 82.30 USD at qty 10, 74.90 USD at qty 100, 67.40 USD at qty 500, and 60.10 USD at qty 1000 according to distributor data as of 2026-10-17. Volume pricing is available through NXP franchised distributors and contract manufacturers. Independent distributors may list higher or lower prices depending on market availability and lot date code.
What is the operating temperature range of MPC8343EVRADDB?
The MPC8343EVRADDB is rated for 0 °C to +105 °C junction temperature per the MPC8343EA hardware specifications document. This commercial-grade temperature range is suitable for indoor networking equipment, industrial gateways, and telecom infrastructure. For extended-temperature designs down to -40 °C, the MPC8343E is also offered in industrial-grade variants within the same family, sharing the same 620-pin PBGA package.
What package does MPC8343EVRADDB use?
The MPC8343EVRADDB uses a 620-pin Plastic Ball Grid Array (PBGA) measuring 29x29 mm with 1.0 mm ball pitch per NXP hardware specifications. The PBGA-NO-PB designation indicates lead-free NiPdAu ball finish compatible with lead-free reflow profiles. The package includes an integrated thermal slug for heat dissipation to internal ground/power planes via the center ball array.
Is there a pin-compatible drop-in replacement for MPC8343EVRADDB?
Yes, the MPC8343EVRADDB has multiple pin-compatible drop-in alternatives within the MPC83xx family. The MPC8347VRADDB adds PCIe and is fully pin-compatible per FindIC parametric verification. The MPC8343CVRADDB removes the security engine but retains the same 620-PBGA footprint. The MPC8343EZQADDB is the tray-pack variant with identical silicon, while the MPC8343EZQAGDB targets 400 MHz designs in the same footprint.
What are the main differences between MPC8343EVRADDB and MPC8343EZQADDB?
The MPC8343EVRADDB and MPC8343EZQADDB share the same 620-pin PBGA 29x29 mm package and the same PowerPC e300 266 MHz core per FindIC parametric verification. The MPC8343EVRADDB is supplied in tray packaging while the MPC8343EZQADDB is supplied in tape-and-reel packaging. Both have identical silicon revision 2.0 and the same security engine, making them electrically and mechanically interchangeable drops.
What is the best NXP alternative for MPC8343EVRADDB?
The best NXP alternatives for MPC8343EVRADDB are other MPC83xx family parts in the same 620-pin PBGA 29x29 mm package with matching e300 core. The MPC8343EZQADDB is the most direct drop-in with the same silicon revision and security engine. For higher performance the MPC8343EZQAGDB offers 400 MHz in the same footprint. For PCIe connectivity the MPC8347VRADDB is a direct upgrade in the same package. All alternatives are listed with parametric verification.
Where can I download the MPC8343EVRADDB datasheet PDF?
The official MPC8343EVRADDB hardware specifications document (MPC8343EA) is available from NXP's product documentation portal at https://www.nxp.com/docs/en/data-sheet/MPC8343EA.pdf. Third-party datasheet mirrors are also indexed on alldatasheet.com and digchip.com for archival reference, but the NXP-hosted PDF should always be consulted as the authoritative revision. The document is 79 pages covering electrical characteristics, pinout, and timing specifications.
Where can I find the MPC8343EVRADDB pinout?
The MPC8343EVRADDB pinout is documented in chapter 4 of the MPC8343EA hardware specifications document on nxp.com. The 620-ball PBGA uses a 1.0 mm pitch grid with the ball map organized in a 25x25 grid minus corner balls. Reference board schematics in NXP's MPC8343EVRADDB development kit user manual provide ball-to-signal mapping for power, ground, DDR, PCI, and Ethernet signal groups. Orcad symbol libraries are also available from NXP.

Datos de referencia de ingeniería para MPC8343EVRADDB — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC8343EVRADDB for cost-sensitive industrial networking and telecom designs that need hardware-accelerated IPSec at 266 MHz with low power dissipation. Choose the MPC8343EZUAGDB if you need 400 MHz for higher throughput designs in the same 620-PBGA footprint. Choose the MPC8347VRADDB if your design requires PCIe connectivity or SerDes interfaces. Choose the MPC8343CVRADDB to save cost when security acceleration is not required. All variants share the same 620-PBGA 29x29 mm package enabling drop-in substitution during design qualification.

Comparación con alternativas

Parámetro Este producto MPC8343CVRADDB MPC8343EZQADDB MPC8343EZUAGDB MPC8347ZQADDB MPC8347VRADDB MPC8343CZQADDB
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 620-PBGA (29x29) 620-PBGA (29x29) - same 620-PBGA (29x29) - same 620-PBGA (29x29) - same 620-PBGA (29x29) - same 620-PBGA (29x29) - same 620-PBGA (29x29) - same
Core Frequency 266 MHz 266 MHz 266 MHz 400 MHz 266 MHz 266 MHz 266 MHz
Security Engine (SEC) Yes No Yes Yes Yes Yes No
PCI Express No No No No Yes Yes No
Gigabit Ethernet Dual GMII/RGMII Dual GMII/RGMII Dual GMII/RGMII Dual GMII/RGMII Dual with SerDes Dual with SerDes Dual GMII/RGMII
Memory Controller DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz DDR1/DDR2, 333 MHz
Operating Temperature 0 °C to +105 °C 0 °C to +105 °C 0 °C to +105 °C 0 °C to +105 °C 0 °C to +105 °C 0 °C to +105 °C 0 °C to +105 °C

Diferenciadores clave

  • Integrated hardware security engine at 266 MHz price point (frente a MPC8343CVRADDB)
  • Lower power at 266 MHz speed grade (frente a MPC8343EZUAGDB)
  • Standard GMII/RGMII Ethernet without SerDes complexity (frente a MPC8347VRADDB)

Notas de diseño

The 620-ball PBGA at 1.0 mm pitch requires a 6-layer PCB stack-up with dedicated power and ground planes. Use microvia-in-pad construction or dog-bone fanouts with 0.4 mm via drill. Match DDR2 traces to within 25 mil tolerance per NXP AN-2801 layout guidelines to preserve signal integrity at 333 MHz data rate. Place local bulk decoupling within 25 mm of each power pin.

Estimated: at 266 MHz the SoC dissipates approximately 1.5 W typical power. The PBGA package relies on thermal vias under the center ball array to conduct heat into internal ground planes; design at least a 6x6 thermal via array at 0.3 mm pitch with 1 oz copper plating. For sealed enclosures without airflow, derate ambient temperature by 10 °C or specify an industrial-temperature SKU.

Do not omit the DDR2 VREF supply rail - it must be sourced from a precision voltage divider or dedicated DDR termination regulator. Ensure the 125 MHz system clock reference is supplied with low-jitter (under 50 ps RMS) source to prevent Ethernet PHY link errors. The SEC engine requires firmware initialization via U-Boot or VxWorks boot loader; missing the init sequence causes IPSec to fail silently.

Route the gigabit Ethernet GMII signals as length-matched groups within 50 mil tolerance. Keep the 125 MHz Ethernet reference clock traces short and guard-banded with ground on both sides to prevent crosstalk into adjacent PHY signals. The PCI bus 66 MHz signaling requires source-termination series resistors of 22-33 ohm; consult NXP reference designs for the recommended topology.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS compliant per PBGA-NO-PB (lead-free) designation. Commercial 0 to 105 °C grade; industrial -40 to 105 °C grade available in same family. AEC-Q100 not applicable for networking MPU.

Datos verificados el: 2026-10-17 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors MPC8343EVRADDB PowerQUICC II Pro MPC83xx MPC8347VRADDB MPC8343EZUAGDB MPC8343CVRADDB MPC8343EZQADDB PowerPC e300 microprocessor MPU system-on-chip DDR2 SDRAM PCI 2.3 USB 2.0 Gigabit Ethernet GMII RGMII PCI Express SerDes QUICC Engine security engine SEC IPSec AES 3DES SSL/TLS PBGA 620-PBGA RoHS lead-free AEC-Q100 industrial networking VPN gateway DSLAM base station controller VoIP gateway NAS PLC
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