MPC8533EVTANG - PowerPC e500v2 MPU 800MHz 783-FCBGA | NXP
N.º de pieza: MPC8533EVTANG ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168 | $1.680,00 |
| 100 | $152 | $15.200,00 |
| 500 | $138 | $69.000,00 |
| 1.000 | $125 | $125.000,00 |
MPC8533EVTANG Descripción general
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instructions fetched from memory and coordinating system peripherals. Within the embedded hierarchy, the MPC8533E sits between general-purpose application processors and microcontrollers, offering higher compute density than MCUs while retaining deterministic real-time behavior and rich industrial connectivity required by networking, storage, and telecom equipment. The MPC85xx family targets power-sensitive linecard and control-plane designs where integrated peripherals reduce BOM count.
Key features include a 32 KB instruction and 32 KB data L1 cache per core, 256 KB unified L2 cache, hardware virtualization support, and Trust Architecture 1.0 security. The integrated DDR2 memory controller supports up to 1 GB of addressable memory with ECC, while the four SerDes lanes can be routed to combinations of PCI Express, SGMII, or Serial RapidIO links depending on board design.
Typical applications include multi-service routers, Ethernet switches, linecards, network-attached storage (NAS), industrial automation controllers, and secure VPN/firewall appliances. The high peripheral integration and proven PowerQUICC architecture make it well suited for carrier-grade and industrial long-life-cycle designs.
When designing with this device, allocate adequate PCB area for the 783-ball FCBGA (1 mm pitch) - a 12-layer stack-up with continuous GND planes is recommended. Thermal management must dissipate up to 8-10 W under full load; a heatsink or thermal pad with adequate airflow is required. JTAG debug header access should be routed out for boundary-scan and code-debug support.
Alternativas directas para MPC8533EVTANG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8533EVTANG (mismo factor de forma y huella) — difiere en Core Architecture, Memory Controller, Package, Operating Temperature, L2 Cache.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8533EVTANGA
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$138 / unidad
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MPC8533EVJANGA
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MPC8533EVTANG Valores máximos y características eléctricas
| Core Architecture | PowerPC e500v2, 32-bit |
| Number of Cores | 1 |
| Maximum Core Frequency | 800 MHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB unified |
| Ancho del bus de datos | 32-bit |
| Encapsulado | 783-FCBGA (29x29 mm, 1 mm pitch) |
| Tensión de alimentación | 1.0 V (core) / 1.8 V / 2.5 V / 3.3 V (I/O) |
| Temperatura de funcionamiento | 0 °C to +90 °C (TA = NG suffix) |
| Memory Controller | DDR2 with ECC |
| Ethernet Interfaces | 4x Gigabit (SGMII / RGMII) |
| PCI Express | Yes (via SerDes) |
| Serial RapidIO | Yes (via SerDes) |
| Local Bus | Enhanced Local Bus Controller |
| Security | Trust Architecture 1.0 |
| Tipo de montaje | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-free BGA (per datasheet) |
Guía de configuración de pines de MPC8533EVTANG 783-fcbga (29x29 mm, 1 mm pitch)
Configuración de pines para MPC8533EVTANG (encapsulado 783-fcbga (29x29 mm, 1 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8533EVTANG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8533EVTANG es adecuado para 7 aplicacións: Multi-Service Router Control Plane, Ethernet Switch Linecard, Network-Attached Storage (NAS) Controller, Industrial Automation Controller, Secure VPN / Firewall Appliance, Telecom / Carrier-Grade Equipment, Embedded Computing Single-Board Computer (SBC).
Multi-Service Router Control Plane
The MPC8533EVTANG's 800 MHz PowerPC e500v2 core with 32 KB I-cache and 32 KB D-cache delivers deterministic throughput for routing-table lookup and forwarding-plane control. Its four integrated Gigabit Ethernet controllers (SGMII/RGMII) let a single chip terminate four WAN/LAN links without an external switch ASIC, reducing BOM cost for SMB router SKUs. The hardware floating-point unit accelerates IPSec / SSL handshake math, while Trust Architecture 1.0 secures boot and key storage. DDR2 with ECC protects the routing table against single-bit memory faults in carrier-grade deployments. Per the NXP datasheet, the integrated PCI Express and Serial RapidIO SerDes lanes also enable linecard interconnect to a co-located network processor.
Recomendado
Ethernet Switch Linecard
In managed Ethernet switch linecards, the MPC8533EVTANG serves as the management CPU, running the switching fabric control plane, SNMP/CLI agents, and L2/L3 management protocols. The four integrated Gigabit Ethernet ports let the device dual-purpose as both management CPU and low-port-count linecard termination for fixed-configuration switches. The enhanced local bus connects to a parallel PHY or switch ASIC for northbound uplinks. Hardware virtualization and Trust Architecture 1.0 enable secure multi-tenant network slicing. Per the NXP datasheet, the 783-FCBGA package's 1 mm pitch supports dense linecard layouts where board real estate is at a premium.
Recomendado
Network-Attached Storage (NAS) Controller
The MPC8533EVTANG fits as the main controller in mid-range NAS appliances, where the 800 MHz PowerPC e500v2 core handles file-system metadata, RAID management, and SMB/NFS protocol stacks. DDR2 with ECC protects user data against soft memory errors, and the PCI Express SerDes links to a SATA / SAS host-bus adapter for multi-drive bays. The four Gigabit Ethernet ports enable link-aggregation and multi-NIC configurations for high-throughput file serving. Per the NXP datasheet, the integrated DUART, I2C, and SPI simplify IPMI / BMC sideband management, common in rack-mount storage designs.
Recomendado
Industrial Automation Controller
In PLC and industrial automation controllers, the MPC8533EVTANG's deterministic PowerPC architecture and rich peripheral set (PCI Express, Gigabit Ethernet, DUART, I2C, SPI) replace multiple MCUs with a single integrated processor. The DDR2 controller with ECC supports long-runtime industrial applications. While the commercial 0-90 °C temperature grade (NG suffix) suits factory-floor enclosures, the MPC8533EVJANGA extended-temperature variant supports harsher environments. Per the NXP datasheet, the enhanced local bus connects to legacy industrial I/O modules, easing migration from older PowerQUICC II designs.
Recomendado
Secure VPN / Firewall Appliance
The MPC8533EVTANG accelerates VPN tunnel establishment and firewall rule processing with its 800 MHz e500v2 core and hardware floating-point unit. Trust Architecture 1.0 provides secure boot and cryptographic key storage required for FIPS 140-2 and Common Criteria certified appliances. The four Gigabit Ethernet ports segment WAN, LAN, DMZ, and management networks without an external switch. Per the NXP datasheet, hardware-accelerated encryption via the integrated SEC engine off-loads AES, 3DES, SHA, and RSA from the main CPU, sustaining line-rate IPsec throughput on GbE links.
Recomendado
Telecom / Carrier-Grade Equipment
The MPC8533EVTANG's PowerQUICC III heritage make it a long-lifecycle fit for telecom linecards, base-station controllers, and carrier-grade routers where 10+ year production support is required. The integrated PCI Express and Serial RapidIO SerDes interface with DSP arrays and network processors on adjacent linecards. ECC-protected DDR2 and Trust Architecture 1.0 meet carrier-grade reliability and security requirements. Per the NXP datasheet, the 783-FCBGA package's 1 mm pitch supports compact ATCA / AdvancedTCA linecard form factors with dense component placement behind a front-panel I/O connector.
Recomendado
Embedded Computing Single-Board Computer (SBC)
The MPC8533EVTANG powers embedded SBCs for transportation, military, and medical-imaging applications where its 800 MHz PowerPC e500v2 core offers a stable, long-life computing platform. The integrated DDR2 with ECC, four Gigabit Ethernet ports, and PCI Express eliminate the need for companion bridge chips, reducing SBC BOM and PCB area. Per the NXP datasheet, the enhanced local bus interfaces to FPGA co-processors for DSP and video pipeline acceleration. The 783-FCBGA package supports the dense component layout typical of 3U/6U VPX and VME single-board computer form factors.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8533EVTANG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8533EVTANGA | MPC8533EVTANGB | MPC8533EVJANGA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core | PowerPC e500v2, 32-bit, 1 core | PowerPC e500v2, 32-bit, 1 core | PowerPC e500v2, 32-bit, 1 core | PowerPC e500v2, 32-bit, 1 core |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Operating Temperature | 0 °C to +90 °C (NG, commercial) | 0 °C to +90 °C | 0 °C to +90 °C | Extended temperature grade |
| DDR2 Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Gigabit Ethernet Ports | 4 (SGMII/RGMII) | 4 (SGMII/RGMII) | 4 (SGMII/RGMII) | 4 (SGMII/RGMII) |
Diferenciadores clave
- Single-die PowerQUICC III integration (frente a MPC8533EVTANGB)
- Commercial temperature grade only (frente a MPC8533EVJANGA)
- Hardware floating-point + SIMD (frente a PowerQUICC II predecessors)
Notas de diseño
The 783-FCBGA package at 1.0 mm ball pitch requires a minimum 8-layer (preferably 10-12 layer) PCB stack-up with 0.4 mm / 0.5 mm trace-and-space design rules for signal breakout. Use laser-drilled microvias or sequential lamination for inner-row fan-out; conventional through-vias will not fit between balls. Per the NXP MPC8533E hardware specifications datasheet, all four SerDes lanes need 100-ohm differential routing with intra-pair skew below 1 ps per centimeter; reference NXP application note AN3949 for the recommended stack-up, decoupling, and length-matching rules.
Estimated: at 800 MHz with full peripheral utilization (4x GbE + DDR2 + PCI Express + SEC engine), the MPC8533EVTANG dissipates approximately 5-8 W. The 783-FCBGA thermal resistance (theta_JA) is around 8-12 C/W with a 4-layer JEDEC test board and 1-2 m/s airflow. For an enclosed chassis, attach a heatsink or thermal interface material (TIM) pad with at least 2 m/s forced airflow; without airflow, derate ambient by 15-20 C to keep the junction below 105 C. The NG suffix part is rated 0 to +90 C commercial operating range.
Per the NXP MPC8533E datasheet, the device requires four independent supply rails: 1.0 V (Vcore), 1.8 V (DDR2), 2.5 V (SerDes analog), and 3.3 V (I/O). All four rails must come up in the sequence specified by the datasheet - typically Vcore last - and the power-on-reset (POR) signal must remain asserted until all rails are stable. Use a multi-rail PMIC or discrete LDO + supervisor design; the 1.0 V Vcore rail in particular must deliver up to 6 A peak transients with less than 30 mVpp ripple under dynamic load.
Estimated: a common pitfall is mismatched SerDes reference-clock routing - the MPC8533E's PCI Express and SGMII links share a common reference clock input, but each lane's AC-coupling capacitors must be placed on the SoC side (not the PHY side) per the datasheet reference schematic. Another pitfall is forgetting to enable the DDR2 calibration sequence in the boot RCW (reset configuration word); without it, DDR2 initialization fails intermittently at first power-up. Always load a known-good RCW image into the boot ROM before attempting DDR2 access.
Información de cumplimiento
Lead-free BGA per datasheet package description. RoHS and REACH compliance indicated by NXP product page; halogen-free status not confirmed in verified data and marked unknown.
