MPC8548ECVTAQGD - 1GHz PowerQUICC III e500 SoC | NXP
N.º de pieza: MPC8548ECVTAQGD ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118.75 | $11.875,00 |
| 250 | $108.4 | $27.100,00 |
| 500 | $99.85 | $49.925,00 |
MPC8548ECVTAQGD Descripción general
A PowerQUICC III SoC belongs to the broader category of communications processors - highly integrated devices that combine a CPU core with networking peripherals, security engines, and memory controllers on a single die. Within the system hierarchy, it sits between a general-purpose microprocessor and an ASIC/FPGA solution: it offers more application flexibility than a fixed-function ASIC but more on-chip I/O and protocol offload than a standalone CPU, making it a staple for mid-range routers, switches, and line cards. The MPC85xx family lineage traces back to Freescale's PowerQUICC II and was carried forward under NXP after the 2015 acquisition.
Key features of the MPC8548ECVTAQGD include its 1.0 GHz e500 core, hardware security engine (SEC 2.0) for IPSec and SSL acceleration, four Gigabit Ethernet MACs with SGMII support, dual PCI Express interfaces, a RapidIO endpoint, and dual DDR/DDR2 memory controllers supporting up to 1 GB of registered memory. Industrial-grade temperature range from -40 C to +105 C and RoHS-compliant Pb-free assembly qualify the device for harsh embedded environments. Revision 3.0 silicon adds errata fixes and improved power management versus earlier revisions.
Typical applications include enterprise routers and switches, multi-service access platforms, industrial control systems requiring deterministic networking, secure VPN gateways, and line cards for modular base stations. The integrated security engine and high-speed serial interfaces allow it to terminate IPSec tunnels and forward packets at line rate without external accelerators. Its PCI Express and RapidIO ports enable it to be paired with FPGAs or PHY modules in mixed-signal designs.
When designing with the MPC8548ECVTAQGD, ensure the FCBGA substrate uses a 12- or 16-layer PCB stack-up with matched-impedance traces for the high-speed SERDES lanes. Reference the NXP hardware documentation for DDR2 fly-by routing and decoupling guidelines. Thermal management must account for typical dissipation in the 5-10 W range under full SERDES utilization.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not aggregated on the manufacturer datasheet, providing information gain for engineers evaluating PowerQUICC III sourcing decisions as the family approaches end-of-life.
Alternativas directas para MPC8548ECVTAQGD — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8548ECVTAQGD (mismo factor de forma y huella) — difiere en Core Architecture, Package, Operating Temperature, RoHS Status, Ethernet.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8548ECVTAQGB
✅ Sustitución directa✓ En stock
$107.48 / unidad
Ver hoja de datos →MPC8548VTAQGD
✅ Sustitución directa✓ En stock
$98.75 / unidad
Ver hoja de datos →MPC8548EVTAVHD
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →MPC8548ECVTAJGD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8548EVTAUQD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8548ECVTAQGD Valores máximos y características eléctricas
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit Power Architecture |
| Core Frequency | 1.0 GHz |
| Co-Processors / DSP | Signal Processing Engine (SPE); Security Engine (SEC) |
| Memory Controllers | DDR, DDR2, SDRAM |
| Graphics Acceleration | No |
| Ethernet | Gigabit Ethernet (multiple MACs, SGMII) |
| PCI Interfaces | PCI, PCI-X, PCI Express |
| Serial RapidIO (SRIO) | Yes |
| Process Technology | 0.09 um CMOS |
| Tensión de alimentación | 1.8 V / 2.5 V / 3.3 V |
| Encapsulado | 783-pin FCBGA (29x29 mm) |
| Temperatura de funcionamiento | -40 C to +105 C |
| Silicon Revision | R3.0 |
| Series | MPC85xx (PowerQUICC III) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de MPC8548ECVTAQGD 783-pin fcbga (29x29 mm)
Configuración de pines para MPC8548ECVTAQGD (encapsulado 783-pin fcbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8548ECVTAQGD.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8548ECVTAQGD es adecuado para 6 aplicacións: Enterprise Routers and Switches, Industrial Control and Factory Networking, Secure VPN Gateway Appliances, Wireless Base Station Line Cards, Multi-Service Access Platforms, Storage Area Network Controllers.
Enterprise Routers and Switches
The MPC8548ECVTAQGD's 1 GHz e500 core, multi-port Gigabit Ethernet MACs with SGMII, and PCI Express lanes make it well-suited to mid-range enterprise routing and switching platforms. Its hardware SEC engine offloads IPSec/SSL termination, allowing line-rate packet forwarding in VPN concentrators and UTM appliances without CPU bottlenecks. The integrated DDR/DDR2 controller simplifies memory topology for line cards handling 1-2 Gbps aggregate throughput. Designers can route traffic between SGMII PHYs, the PCI-X bus, and the SRIO endpoint to fan-out to multiple backplane lanes.
Recomendado
Industrial Control and Factory Networking
With an operating range of -40 C to +105 C and RoHS-compliant assembly, the MPC8548ECVTAQGD is qualified for industrial control cabinets and factory-floor networking equipment. Its deterministic PCI/PCI-X interfaces and RapidIO endpoint support deterministic control loops used in PLC backplanes and motor controllers. The integrated peripherals eliminate the need for separate bridge chips, reducing BOM and long-term supply risk in ruggedized environments. Reference NXP's hardware documentation for thermal design guidelines at full SERDES utilization.
Recomendado
Secure VPN Gateway Appliances
The integrated SEC 2.0 hardware engine accelerates IPSec and SSL/TLS at wire speed, making the MPC8548ECVTAQGD a fit for branch-office VPN concentrators and secure gateways. Offloading AES, 3DES, SHA, and MD5 from the e500 core allows the CPU to focus on routing, NAT, and policy enforcement. Combined with the multi-port GbE and PCI Express, a single MPC8548E can serve as the SoC for a 200-500 Mbps encrypted tunnel appliance without external crypto silicon.
Recomendado
Wireless Base Station Line Cards
The MPC8548ECVTAQGD's SRIO endpoint and PCI Express lanes enable it to act as the baseband interface controller on wireless base-station line cards, paired with a PHY or DSP over SRIO. Its DDR2 controller sustains high-bandwidth sample buffering for LTE/WCDMA processing pipelines. Multi-port Gigabit Ethernet connects the line card to the backhaul network. The FCBGA-783 footprint and industrial temperature range suit controlled-environment base-station chassis.
Recomendado
Multi-Service Access Platforms
Carrier-grade multi-service access platforms (MSAPs) leverage the MPC8548ECVTAQGD's mix of legacy and modern interfaces - TDM/SONET interworking is bridged through PCI-X, while Ethernet aggregation runs over the integrated GbE MACs. The dual-role PCI/PCI-X/PCIe flexibility allows co-existence with both legacy and next-generation framer/MAC chips. Hardware SEC acceleration secures pseudowire and MPLS traffic without throughput loss.
Recomendado
Storage Area Network Controllers
The MPC8548ECVTAQGD can serve as the controller SoC in iSCSI or Fibre Channel-over-Ethernet SAN appliances, offloading TCP/IP and iSCSI protocol handling through its PCI-X and Gigabit Ethernet interfaces. DDR2 memory bandwidth supports RAID parity calculation and write-buffer management. Combined with the SEC engine for encrypted block storage and RapidIO for inter-controller communication, it scales into dual-controller storage head units.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8548ECVTAQGD — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8548ECVTAQGB | MPC8548VTAQGD | MPC8548EVTAVHD | MPC8548ECVTAJGD | MPC8548EVTAUQD |
|---|---|---|---|---|---|---|
| Package | 783-pin FCBGA (29x29) | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.5 GHz | 1.0 GHz | 1.33 GHz |
| Security Engine (SEC) | Yes (SEC 2.0) | Yes (SEC 2.0) | No | Yes (SEC 2.0) | Yes (SEC 2.0) | Yes (SEC 2.0) |
| Signal Processing Engine (SPE) | Yes | Yes | No | Yes | Yes | Yes |
| Operating Temperature | -40 C to +105 C (Industrial) | 0 C to +105 C (Commercial/Extended) | -40 C to +105 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) |
| Memory Controller | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM |
| Silicon Revision | R3.0 | R3.0 | R3.0 | R3.0 | R3.0 | R3.0 |
Diferenciadores clave
- Integrated hardware security engine (SEC 2.0) on the e500 core (frente a MPC8548VTAQGD)
- Industrial temperature range vs commercial variants (frente a MPC8548ECVTAQGB)
- Lower power dissipation vs higher-frequency variants (frente a MPC8548EVTAVHD)
Notas de diseño
The 783-pin FCBGA package requires a 12- to 16-layer PCB stack-up with matched-impedance routing for the SERDES lanes (PCIe, SRIO, SGMII). Use a 1.0 mm BGA pitch land pattern per IPC-7351 and reference NXP hardware documentation for via-in-pad recommendations. Place decoupling capacitors on the opposite side directly under the power/ground ball array to minimize loop inductance. Length-match DDR2 traces within +/- 25 mil across the byte lanes to preserve signal integrity at the controller's 400 MHz equivalent clock rate.
Estimated: at 1.0 GHz core frequency with full SERDES utilization, typical power dissipation is in the 5-10 W range. Use a thermal resistance model with theta_JB of approximately 1.5 C/W and design the heatsink/PCB copper spreader to keep junction temperature below 110 C under worst-case industrial ambient (105 C). Place thermal vias under the die area and consider a small clip-on heatsink for sealed enclosures without forced airflow.
Do not assume pinout compatibility across the MPC8548 family despite the shared FCBGA-783 package - the QG vs QJ, and T vs V suffix codes denote meaningful silicon revisions and feature mixes (with/without SEC, with/without SPE). Verify the ball-map against the specific NXP reference manual for your chosen MPN before laying out the PCB. Also confirm whether your firmware expects R3.0 silicon or an earlier revision - some errata fixes require R3.0 or later.
Información de cumplimiento
RoHS-compliant per NXP product brief. Lead-free FCBGA assembly. AEC-Q100 not applicable - this is an industrial/communications MPU, not an automotive-qualified MCU.
