MPC8548ECVTAQGD - 1GHz PowerQUICC III e500 SoC | NXP
料号： MPC8548ECVTAQGD ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118.75 | $11,875.00 |
| 250 | $108.4 | $27,100.00 |
| 500 | $99.85 | $49,925.00 |
MPC8548ECVTAQGD 概述
A PowerQUICC III SoC belongs to the broader category of communications processors - highly integrated devices that combine a CPU core with networking peripherals, security engines, and memory controllers on a single die. Within the system hierarchy, it sits between a general-purpose microprocessor and an ASIC/FPGA solution: it offers more application flexibility than a fixed-function ASIC but more on-chip I/O and protocol offload than a standalone CPU, making it a staple for mid-range routers, switches, and line cards. The MPC85xx family lineage traces back to Freescale's PowerQUICC II and was carried forward under NXP after the 2015 acquisition.
Key features of the MPC8548ECVTAQGD include its 1.0 GHz e500 core, hardware security engine (SEC 2.0) for IPSec and SSL acceleration, four Gigabit Ethernet MACs with SGMII support, dual PCI Express interfaces, a RapidIO endpoint, and dual DDR/DDR2 memory controllers supporting up to 1 GB of registered memory. Industrial-grade temperature range from -40 C to +105 C and RoHS-compliant Pb-free assembly qualify the device for harsh embedded environments. Revision 3.0 silicon adds errata fixes and improved power management versus earlier revisions.
Typical applications include enterprise routers and switches, multi-service access platforms, industrial control systems requiring deterministic networking, secure VPN gateways, and line cards for modular base stations. The integrated security engine and high-speed serial interfaces allow it to terminate IPSec tunnels and forward packets at line rate without external accelerators. Its PCI Express and RapidIO ports enable it to be paired with FPGAs or PHY modules in mixed-signal designs.
When designing with the MPC8548ECVTAQGD, ensure the FCBGA substrate uses a 12- or 16-layer PCB stack-up with matched-impedance traces for the high-speed SERDES lanes. Reference the NXP hardware documentation for DDR2 fly-by routing and decoupling guidelines. Thermal management must account for typical dissipation in the 5-10 W range under full SERDES utilization.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not aggregated on the manufacturer datasheet, providing information gain for engineers evaluating PowerQUICC III sourcing decisions as the family approaches end-of-life.
直接替换替代料： MPC8548ECVTAQGD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8548ECVTAQGD （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, Operating Temperature, RoHS Status, Ethernet.
快速对比工具——选择替代料号进行并排对比：
MPC8548ECVTAQGB
✅ 直接替换✓ 有现货
$107.48 / 个
查看数据手册 →MPC8548VTAQGD
✅ 直接替换✓ 有现货
$98.75 / 个
查看数据手册 →MPC8548EVTAVHD
✅ 直接替换✓ 有现货
$165 / 个
查看数据手册 →MPC8548ECVTAJGD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8548EVTAUQD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8548ECVTAQGD 最大额定值与电气特性
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit Power Architecture |
| Core Frequency | 1.0 GHz |
| Co-Processors / DSP | Signal Processing Engine (SPE); Security Engine (SEC) |
| Memory Controllers | DDR, DDR2, SDRAM |
| Graphics Acceleration | No |
| Ethernet | Gigabit Ethernet (multiple MACs, SGMII) |
| PCI Interfaces | PCI, PCI-X, PCI Express |
| Serial RapidIO (SRIO) | Yes |
| Process Technology | 0.09 um CMOS |
| 电源电压 | 1.8 V / 2.5 V / 3.3 V |
| 封装 | 783-pin FCBGA (29x29 mm) |
| 工作温度 | -40 C to +105 C |
| Silicon Revision | R3.0 |
| Series | MPC85xx (PowerQUICC III) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
MPC8548ECVTAQGD 783-pin fcbga (29x29 mm) 引脚配置指南
MPC8548ECVTAQGD（783-pin fcbga (29x29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8548ECVTAQGD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8548ECVTAQGD 适用于 6 应用s: Enterprise Routers and Switches, Industrial Control and Factory Networking, Secure VPN Gateway Appliances, Wireless Base Station Line Cards, Multi-Service Access Platforms, Storage Area Network Controllers.
Enterprise Routers and Switches
The MPC8548ECVTAQGD's 1 GHz e500 core, multi-port Gigabit Ethernet MACs with SGMII, and PCI Express lanes make it well-suited to mid-range enterprise routing and switching platforms. Its hardware SEC engine offloads IPSec/SSL termination, allowing line-rate packet forwarding in VPN concentrators and UTM appliances without CPU bottlenecks. The integrated DDR/DDR2 controller simplifies memory topology for line cards handling 1-2 Gbps aggregate throughput. Designers can route traffic between SGMII PHYs, the PCI-X bus, and the SRIO endpoint to fan-out to multiple backplane lanes.
推荐
Industrial Control and Factory Networking
With an operating range of -40 C to +105 C and RoHS-compliant assembly, the MPC8548ECVTAQGD is qualified for industrial control cabinets and factory-floor networking equipment. Its deterministic PCI/PCI-X interfaces and RapidIO endpoint support deterministic control loops used in PLC backplanes and motor controllers. The integrated peripherals eliminate the need for separate bridge chips, reducing BOM and long-term supply risk in ruggedized environments. Reference NXP's hardware documentation for thermal design guidelines at full SERDES utilization.
推荐
Secure VPN Gateway Appliances
The integrated SEC 2.0 hardware engine accelerates IPSec and SSL/TLS at wire speed, making the MPC8548ECVTAQGD a fit for branch-office VPN concentrators and secure gateways. Offloading AES, 3DES, SHA, and MD5 from the e500 core allows the CPU to focus on routing, NAT, and policy enforcement. Combined with the multi-port GbE and PCI Express, a single MPC8548E can serve as the SoC for a 200-500 Mbps encrypted tunnel appliance without external crypto silicon.
推荐
Wireless Base Station Line Cards
The MPC8548ECVTAQGD's SRIO endpoint and PCI Express lanes enable it to act as the baseband interface controller on wireless base-station line cards, paired with a PHY or DSP over SRIO. Its DDR2 controller sustains high-bandwidth sample buffering for LTE/WCDMA processing pipelines. Multi-port Gigabit Ethernet connects the line card to the backhaul network. The FCBGA-783 footprint and industrial temperature range suit controlled-environment base-station chassis.
推荐
Multi-Service Access Platforms
Carrier-grade multi-service access platforms (MSAPs) leverage the MPC8548ECVTAQGD's mix of legacy and modern interfaces - TDM/SONET interworking is bridged through PCI-X, while Ethernet aggregation runs over the integrated GbE MACs. The dual-role PCI/PCI-X/PCIe flexibility allows co-existence with both legacy and next-generation framer/MAC chips. Hardware SEC acceleration secures pseudowire and MPLS traffic without throughput loss.
推荐
Storage Area Network Controllers
The MPC8548ECVTAQGD can serve as the controller SoC in iSCSI or Fibre Channel-over-Ethernet SAN appliances, offloading TCP/IP and iSCSI protocol handling through its PCI-X and Gigabit Ethernet interfaces. DDR2 memory bandwidth supports RAID parity calculation and write-buffer management. Combined with the SEC engine for encrypted block storage and RapidIO for inter-controller communication, it scales into dual-controller storage head units.
推荐
推荐产品汇总
工程参考数据： MPC8548ECVTAQGD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8548ECVTAQGB | MPC8548VTAQGD | MPC8548EVTAVHD | MPC8548ECVTAJGD | MPC8548EVTAUQD |
|---|---|---|---|---|---|---|
| Package | 783-pin FCBGA (29x29) | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same | 783-pin FCBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.5 GHz | 1.0 GHz | 1.33 GHz |
| Security Engine (SEC) | Yes (SEC 2.0) | Yes (SEC 2.0) | No | Yes (SEC 2.0) | Yes (SEC 2.0) | Yes (SEC 2.0) |
| Signal Processing Engine (SPE) | Yes | Yes | No | Yes | Yes | Yes |
| Operating Temperature | -40 C to +105 C (Industrial) | 0 C to +105 C (Commercial/Extended) | -40 C to +105 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +105 C (Industrial) | -40 C to +105 C (Industrial) |
| Memory Controller | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM | DDR / DDR2 / SDRAM |
| Silicon Revision | R3.0 | R3.0 | R3.0 | R3.0 | R3.0 | R3.0 |
关键差异点
- Integrated hardware security engine (SEC 2.0) on the e500 core （对比 MPC8548VTAQGD)
- Industrial temperature range vs commercial variants （对比 MPC8548ECVTAQGB)
- Lower power dissipation vs higher-frequency variants （对比 MPC8548EVTAVHD)
设计说明
The 783-pin FCBGA package requires a 12- to 16-layer PCB stack-up with matched-impedance routing for the SERDES lanes (PCIe, SRIO, SGMII). Use a 1.0 mm BGA pitch land pattern per IPC-7351 and reference NXP hardware documentation for via-in-pad recommendations. Place decoupling capacitors on the opposite side directly under the power/ground ball array to minimize loop inductance. Length-match DDR2 traces within +/- 25 mil across the byte lanes to preserve signal integrity at the controller's 400 MHz equivalent clock rate.
Estimated: at 1.0 GHz core frequency with full SERDES utilization, typical power dissipation is in the 5-10 W range. Use a thermal resistance model with theta_JB of approximately 1.5 C/W and design the heatsink/PCB copper spreader to keep junction temperature below 110 C under worst-case industrial ambient (105 C). Place thermal vias under the die area and consider a small clip-on heatsink for sealed enclosures without forced airflow.
Do not assume pinout compatibility across the MPC8548 family despite the shared FCBGA-783 package - the QG vs QJ, and T vs V suffix codes denote meaningful silicon revisions and feature mixes (with/without SEC, with/without SPE). Verify the ball-map against the specific NXP reference manual for your chosen MPN before laying out the PCB. Also confirm whether your firmware expects R3.0 silicon or an earlier revision - some errata fixes require R3.0 or later.
合规信息
RoHS-compliant per NXP product brief. Lead-free FCBGA assembly. AEC-Q100 not applicable - this is an industrial/communications MPU, not an automotive-qualified MCU.
