MPC8555EVTAJD - PowerQUICC III e500 MPU 533MHz | NXP
N.º de pieza: MPC8555EVTAJD ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $155.33 | $155,33 |
| 10 | $148.5 | $1.485,00 |
| 100 | $140.2 | $14.020,00 |
| 500 | $132.75 | $66.375,00 |
| 1.000 | $125.4 | $125.400,00 |
MPC8555EVTAJD Descripción general
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory controller, and peripheral interfaces into one package. The PowerQUICC family sits in the broader taxonomy as an integrated communications processor - bridging general-purpose MPU cores with hardware acceleration for networking protocols. The MPC8555E extends this lineage by combining the e500 core with the system-on-chip PowerQUICC III platform architecture, enabling high-throughput packet processing alongside general-purpose compute.
Key features of the MPC8555EVTAJD include a 32-bit e500 core at 533 MHz, dual DDR memory controllers (32-bit DDR and 16-bit DDR2), integrated security engine, four Gigabit Ethernet controllers, and a 783-ball FCBGA package with 1.0 mm pitch. The device also integrates PCI Express and Serial RapidIO interfaces, making it suitable for high-bandwidth backplane and line-card designs. The e500 core includes dual-issue superscalar execution, hardware MMU, and dual 32 KB L1 caches.
The architecture pairs the e500 execution pipeline with the communications peripheral logic block, allowing deterministic packet handling without CPU intervention. The integrated security engine supports DES, 3DES, AES, and SHA-1/2, offloading cryptographic workloads from the host core. The dual DDR memory controllers can operate independently, supporting high-throughput parallel memory transactions critical for packet buffer management.
Typical applications include wireless base station line cards, routing and switching line cards, DSLAM equipment, edge routers, network attached storage controllers, and industrial embedded control. The integrated communications peripherals make the MPC8555E particularly well-suited for designs where board space, BOM cost, and time-to-market are critical constraints.
When designing with the MPC8555EVTAJD, ensure proper thermal management through the exposed-die BGA substrate and adequate PCB layer stack-up for high-speed DDR routing. JTAG boundary scan is supported for board-level test, and the device requires a compatible boot ROM and system PLL configuration at power-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineering decision support beyond raw specification listing.
Alternativas directas para MPC8555EVTAJD — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8555EVTAJD (mismo factor de forma y huella) — difiere en Mounting Type, Package, Core Architecture, Data Bus Width, Memory Controller.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8555EVTALF
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8555EVTAJJ
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8555ECPXAJD
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$58.4 / unidad
Ver hoja de datos →MPC8555EPXAJD
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8555EVTAJD Valores máximos y características eléctricas
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Frecuencia de reloj máxima | 533 MHz |
| Encapsulado | 783-FCPBGA (29x29 mm) |
| Tipo de montaje | Surface Mount |
| Series | PowerQUICC III |
| L1 Cache | 32 KB instruction + 32 KB data |
| Memory Controllers | Dual DDR/DDR2 |
| Ethernet Interfaces | 4x Gigabit Ethernet |
| High-Speed I/O | PCI Express, Serial RapidIO |
| Security Engine | DES, 3DES, AES, SHA-1/2 |
| Estado RoHS | Compliant per distributor listing |
Guía de configuración de pines de MPC8555EVTAJD 783-fcpbga (29x29 mm)
Configuración de pines para MPC8555EVTAJD (encapsulado 783-fcpbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8555EVTAJD.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8555EVTAJD es adecuado para 6 aplicacións: Wireless Base Station Line Cards, Edge Router and Routing Line Cards, DSLAM and Access Aggregation Equipment, Network Attached Storage Controllers, Industrial Embedded Control Platforms, Telecommunications Backplane Switch Controllers.
Wireless Base Station Line Cards
The MPC8555EVTAJD fits wireless base station line-card designs because its 533 MHz e500 core delivers the packet-processing throughput required for Layer 2/Layer 3 forwarding, while the four integrated Gigabit Ethernet controllers provide line-rate aggregation. The dual DDR/DDR2 memory controllers sustain the memory bandwidth needed for routing table lookups and packet buffer management. Hardware-accelerated DES, 3DES, AES, and SHA-1/2 offload encryption for IPSec and MACsec tunnels, enabling secure backhaul without burdening the host core. The PCI Express and Serial RapidIO interfaces connect to baseband DSP clusters or to switching fabric ASICs on the base station backplane.
Recomendado
Edge Router and Routing Line Cards
The MPC8555EVTAJD serves as the main processor on edge router line cards where deterministic packet handling and cryptographic acceleration are mandatory. Its e500 core handles routing protocol stacks (OSPF, BGP, MPLS) while the integrated communications peripheral logic processes packets independently, offloading CPU-intensive forwarding tasks. The Serial RapidIO interface connects to coprocessors or fabric switches at multi-gigabit rates. Four Gigabit Ethernet controllers support multiple WAN/LAN interfaces without external PHY bridges, reducing BOM cost. The hardware security engine sustains line-rate IPSec at typical edge-router throughput targets.
Recomendado
DSLAM and Access Aggregation Equipment
The MPC8555EVTAJD is well-matched to DSLAM line cards and access aggregation equipment because its combination of e500 compute and high-speed serial interfaces consolidates multiple functions onto one SoC. The PCI Express endpoint connects to DSL PHY front-end ASICs, while the four Gigabit Ethernet controllers aggregate subscriber traffic upstream. Hardware DES/3DES/AES acceleration secures subscriber authentication and traffic encryption at the access layer. The 533 MHz core runs subscriber management software stacks and TR-069 CPE management without external processor assistance, reducing board complexity and BOM cost.
Recomendado
Network Attached Storage Controllers
The MPC8555EVTAJD supports network attached storage (NAS) controller designs by combining the e500 core for filesystem and RAID processing with hardware-accelerated cryptography for encrypted volumes. The dual DDR2 controllers deliver the bandwidth needed for sequential read/write workloads typical of media streaming and backup operations. PCI Express links to SATA or SAS controller ASICs aggregate multiple disk channels. The four Gigabit Ethernet ports support link aggregation or multi-VLAN segmentation for SOHO and SMB NAS products. Hardware AES-XTS enables self-encrypting drive management without CPU performance penalty.
Recomendado
Industrial Embedded Control Platforms
The MPC8555EVTAJD serves industrial embedded platforms requiring deterministic real-time response alongside networking connectivity. Its e500 core runs VxWorks, Linux, or Green Hills INTEGRITY for SCADA, factory automation, and machine vision controllers. The integrated Gigabit Ethernet and PCI Express interfaces connect to industrial cameras, PLC backplanes, and fieldbus gateways. Hardware cryptography secures industrial IoT communication (TLS/DTLS) and protects firmware integrity. The 783-FCPBGA package provides the mechanical robustness and thermal performance required for industrial temperature environments and long-lifecycle deployments.
Recomendado
Telecommunications Backplane Switch Controllers
The MPC8555EVTAJD is suited as the control-plane processor on telecommunications backplane switch cards where high-speed serial fabric and deterministic packet handling are critical. The Serial RapidIO interface connects to the switching fabric ASIC at multi-gigabit rates, while PCI Express provides additional endpoint connectivity to co-processors or service cards. The 533 MHz e500 core handles routing protocol convergence, OAM (Operations, Administration, and Maintenance) processing, and control-plane management. Hardware-accelerated cryptography enables MACsec on backplane links and IPsec on inter-switch tunnels, providing defense-in-depth for telecom networks.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8555EVTAJD — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8555EVTALF | MPC8555EVTAJJ | MPC8555ECPXAJD | MPC8555EPXAJD |
|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Memory Controllers | Dual DDR/DDR2 | Dual DDR/DDR2 | Dual DDR/DDR2 | Dual DDR/DDR2 | Dual DDR/DDR2 |
| Gigabit Ethernet | 4x | 4x | 4x | 4x | 4x |
| High-Speed Serial I/O | PCIe, Serial RapidIO | PCIe, Serial RapidIO | PCIe, Serial RapidIO | PCIe, Serial RapidIO | PCIe, Serial RapidIO |
| Hardware Security Engine | DES/3DES/AES/SHA | DES/3DES/AES/SHA | DES/3DES/AES/SHA | DES/3DES/AES/SHA | DES/3DES/AES/SHA |
Diferenciadores clave
- Integrated hardware security engine with AES and SHA-2 acceleration (frente a MPC8536CVJAULA)
- Four Gigabit Ethernet controllers on-chip (frente a MPC8541EPXAJD)
- Dual DDR/DDR2 memory controllers (frente a MPC8541EPXAJD)
Notas de diseño
The 783-FCPBGA package dissipates significant power under full e500 core load with active Ethernet and Serial RapidIO links. Ensure the PCB includes a thermal via array directly beneath the exposed-die BGA substrate connected to inner copper planes. For enclosed chassis designs, forced-air cooling or a heatsink attached with thermal interface material is strongly recommended; consult the NXP MPC8555E hardware specifications for thermal design guidance.
High-speed DDR2 and Gigabit Ethernet interfaces require controlled-impedance PCB stack-up. Use 50 ohm single-ended impedance for SERDES and 100 ohm differential for RapidIO. Route DDR2 signals on inner layers with matched-length matching per the NXP MPC8555E design guide. Maintain solid ground planes beneath all high-speed signal traces and provide adequate decoupling with 0.1uF and 10uF capacitors placed close to each power pin.
The MPC8555EVTAJD requires correct boot ROM configuration and system PLL settings at power-up; verify your boot code against the NXP reference boot loader before production. The hardware security engine must be initialized with proper key loading sequences; incorrect setup will cause silent cryptographic failures. For JTAG boundary-scan testing, ensure TRST is properly pulled and the JTAG chain matches the BSDL file from NXP.
Serial RapidIO and PCI Express interfaces require AC-coupling capacitors on transmit pairs; place 0.1uF capacitors as close to the TX pins as possible. Maintain 100 ohm differential impedance on these serial links and avoid routing across plane splits. The Gigabit Ethernet SGMII interfaces also require 100 ohm differential routing with reference-plane continuity for return-current paths.
Información de cumplimiento
RoHS compliant per distributor listings; AEC-Q100 not applicable for MPU grade parts; lead-free package confirmed by NXP product marking scheme.