MPC8560PXAQFC - PowerQUICC III MPU 1GHz PowerPC e500 783-BGA | NXP
N.º de pieza: MPC8560PXAQFC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $168.93 | $168,93 |
| 10 | $158.4 | $1.584,00 |
| 25 | $146.61 | $3.665,25 |
| 100 | $142.21 | $14.221,00 |
| 500 | $137.81 | $68.905,00 |
MPC8560PXAQFC Descripción general
A PowerQUICC III MPU is a specialized microprocessor family designed for networking and communications equipment. Within the broader taxonomy it is classified as an embedded microprocessor -> communications processor -> network processor -> integrated communications controller. The device targets telecom, datacom, and embedded routing/switching applications where deterministic I/O throughput, multi-protocol serial interfaces, and hardware offload engines are required.
Key features include the PowerPC e500 core with double-precision floating point, integrated security engine (SEC 2.0), DDR memory controller, dual gigabit Ethernet controllers, four triple-speed Ethernet controllers (TsECs), integrated PCI/PCI-X bridge, and the QUICC Engine subsystem supporting multichannel HDLC, POS (Packet over SONET), ATM, and UTOPIA interfaces. The 783-FCPBGA package with 29x29 mm body provides high-density interconnect for multi-rail power, multiple SerDes lanes, and large address/data buses. Operating voltage is 2.5V/3.3V.
The architecture pairs the e500 core with a 64-bit DDR memory controller that supports DDR1/DDR2 with ECC, enabling high-bandwidth memory access for packet processing. The QUICC Engine offload block implements microcode-driven protocol handling that previously required external ASICs, reducing BOM and PCB complexity while increasing deterministic latency on data-plane tasks. Security is accelerated by the integrated SEC 2.0 block handling IPSec, SSL/TLS, Kasumi, and bulk cryptographic primitives.
Typical applications include multiservice routers, DSLAM line cards, wireless base station controllers, IP-PBX systems, industrial embedded control, and enterprise edge routers. The integrated serial interfaces and protocol offload make it especially suitable for T1/E1/T3/E3 channelized aggregation and SONET/SDH framer interfacing.
When designing with this device, ensure the FCBGA substrate has matched impedance for SerDes lanes and that thermal vias are placed beneath the exposed die area. Power sequencing of the 2.5V core and 3.3V I/O rails must follow the manufacturer sequencing specification to avoid latch-up during power-up.
Alternativas directas para MPC8560PXAQFC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8560PXAQFC (mismo factor de forma y huella) — difiere en Mounting Type, RoHS Status, Core Architecture, Package, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8560PXAUFC
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MPC8560PXANFC
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MPC8560VTAQFC
✅ Sustitución directa✓ En stock
$178.9 / unidad
Ver hoja de datos →MPC8560VTANGFC
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MPC8560PXAQFCB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8560PXAQFC Valores máximos y características eléctricas
| Core Architecture | PowerPC e500, 32-bit RISC |
| Core Count | 1 |
| Maximum Core Frequency | 1.0 GHz |
| Series | MPC85xx (PowerQUICC III) |
| Encapsulado | 783-FCPBGA (29x29 mm) |
| Operating Voltage | 2.5 V / 3.3 V |
| Memory Controller | Integrated DDR / DDR2 with ECC |
| Ethernet Interfaces | Dual GbE + 4x TsEC (Triple-Speed Ethernet) |
| Communications Engine | QUICC Engine (microcode-driven protocol offload) |
| Security Engine | SEC 2.0 (IPSec, SSL/TLS, Kasumi, bulk crypto) |
| PCI/PCI-X Bridge | Integrated |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de MPC8560PXAQFC 783-fcpbga (29x29 mm)
Configuración de pines para MPC8560PXAQFC (encapsulado 783-fcpbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8560PXAQFC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8560PXAQFC es adecuado para 6 aplicacións: Multiservice Edge Router, DSLAM Line Card Processor, Wireless Base Station Controller, IP-PBX and Unified Communications Platform, Industrial Embedded Router / Gateway, Enterprise Edge Security Appliance.
Multiservice Edge Router
The MPC8560PXAQFC fits multiservice edge router line cards because it integrates the QUICC Engine for multichannel HDLC, POS, and ATM protocol termination alongside the PowerPC e500 core for control-plane routing protocols. At 1 GHz the e500 core sustains high packet throughput while the hardware offload engine handles T1/E1/T3/E3 channelized aggregation deterministically, eliminating the need for external protocol ASICs. The integrated dual GbE plus four TsECs provide ample Ethernet port density for service provider access routers, while SEC 2.0 accelerates IPSec VPNs for secure enterprise branch connectivity without burdening the main CPU.
Recomendado
DSLAM Line Card Processor
The MPC8560PXAQFC is well-suited for DSLAM (Digital Subscriber Line Access Multiplexer) line cards because its QUICC Engine handles ATM and frame relay termination across hundreds of subscriber ports with deterministic latency. The PowerPC e500 core at 1 GHz runs the bridging, VLAN, and traffic management control plane, while the integrated DDR/DDR2 controller with ECC provides high-bandwidth packet buffer memory. Hardware SEC 2.0 acceleration enables secure PPPoA/PPPoE session encryption for residential broadband deployments.
Recomendado
Wireless Base Station Controller
The MPC8560PXAQFC serves wireless base station controllers where the PowerPC e500 core at 1 GHz runs the Layer 2/3 radio network controller, and the QUICC Engine terminates the Abis/Iub backhaul links. The integrated Kasumi cipher support in SEC 2.0 is purpose-built for 3GPP mobile network air-interface encryption, offloading bulk crypto from the main CPU. The 783-FCBGA package provides the thermal headroom needed for environmentally controlled but thermally constrained cellular cabinet deployments.
Recomendado
IP-PBX and Unified Communications Platform
The MPC8560PXAQFC powers IP-PBX systems because the QUICC Engine provides hardware-accelerated T1/E1 PRI (Primary Rate Interface) and BRI termination, supporting legacy PSTN trunking alongside SIP/VoIP packet processing. The e500 core at 1 GHz runs Asterisk, FreeSWITCH, or commercial PBX control software, while SEC 2.0 handles SRTP/TLS encryption for secure SIP trunks. The integrated DDR2 controller with ECC ensures voice packet buffer reliability for enterprise telephony deployments.
Recomendado
Industrial Embedded Router / Gateway
The MPC8560PXAQFC fits industrial routers and protocol-conversion gateways where deterministic networking and long-lifecycle parts are critical. The PowerPC e500 core runs embedded Linux or VxWorks, the QUICC Engine handles serial protocol conversion (Modbus, DNP3, IEC 60870-5), and SEC 2.0 secures SCADA communications. The mature NXP PowerQUICC III lifecycle and 783-FCBGA package support long-term industrial deployments with predictable obsolescence planning.
Recomendado
Enterprise Edge Security Appliance
The MPC8560PXAQFC supports small-to-medium enterprise edge security appliances where SEC 2.0 provides wire-speed IPSec and SSL/TLS termination for VPN gateway and firewall products. The 1 GHz e500 core handles the stateful packet inspection policy engine, while the QUICC Engine offloads legacy WAN interface aggregation. The integrated DDR2 controller with ECC supports deep connection-state tables for moderate-scale enterprise deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8560PXAQFC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8560PXAUFC | MPC8560PXANFC | MPC8560VTAQFC | MPC8560VTANGFC | MPC8560PXAQFCB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 1.0 GHz | Up to 1 GHz | Up to 1 GHz | Up to 1 GHz | Up to 1 GHz | 1.0 GHz |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| QUICC Engine | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Security Engine | SEC 2.0 | SEC 2.0 | SEC 2.0 | SEC 2.0 | SEC 2.0 | SEC 2.0 |
| Ordering Suffix Variant | PXAQFC | PXAUFC | PXANFC | VTAQFC | VTANGFC | PXAQFCB |
| Parametric Match | 100% | ~95% | ~95% | ~90% | ~90% | 100% |
Diferenciadores clave
- Integrated QUICC Engine protocol offload (frente a MPC8569CVJAQLJB)
- Integrated SEC 2.0 hardware security (frente a MPC8560 base part)
- Dual integrated DDR memory controllers (frente a MPC8555 series predecessors)
Notas de diseño
The 783-FCPBGA package dissipates significant power at 1 GHz due to the PowerPC e500 core and QUICC Engine. Recommended: provide a thermal management solution with thermal vias beneath the die area and sufficient airflow. Per NXP PowerQUICC III hardware design guidelines, peak junction temperature must remain within the operating range specified in the device datasheet. Use thermal interface material and a heatsink for closed-enclosure designs.
PCB layout for the 783-FCBGA must use microvia or stacked-via technology to fan out the 0.8 mm ball pitch. DDR/DDR2 traces require matched impedance (typically 50 ohm single-ended, 100 ohm differential for clock) and length matching within ±25 mils per byte lane. SerDes lanes for GbE and PCI Express need 100 ohm differential impedance, length matching within ±5 mils, and AC-coupling capacitors as specified in the datasheet. Reference planes should be continuous under high-speed traces to maintain controlled impedance.
Power sequencing of the 2.5V core rail and 3.3V I/O rail must follow the NXP MPC8560 power sequencing specification to prevent latch-up. Decoupling capacitors: place 0.1uF and 10uF ceramics close to each power pin pair, with bulk decoupling at the regulator outputs. Use a 4-layer PCB minimum with dedicated power and ground planes. Voltage ripple must remain within the tolerance specified in the device electrical characteristics section.
DDR memory layout requires careful attention to keep address, command, and clock traces matched. Place the DDR chips on the same side of the PCB as the MPU when possible to minimize via stubs. The QUICC Engine serial interface traces (TDM, UTOPIA) should be length-matched within the timing budget specified in the MPC8560 reference manual. Clock generation should use a low-jitter oscillator compliant with the device's jitter specification.
Información de cumplimiento
RoHS compliant per NXP product compliance documentation. Not AEC-Q100 qualified - this part targets telecom/networking/industrial embedded applications rather than automotive. Lead-free FCBGA package supports lead-free assembly profiles.