MPC8560VT667LB - PowerPC e500 MPU, 667MHz, 783-FCBGA | NXP
N.º de pieza: MPC8560VT667LB ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $193.7 | $193,70 |
| 10 | $174.33 | $1.743,30 |
| 100 | $154.96 | $15.496,00 |
| 500 | $135.59 | $67.795,00 |
| 1.000 | $116.22 | $116.220,00 |
MPC8560VT667LB Descripción general
A microprocessor (MPU) is the central processing unit of an embedded system, integrating one or more CPU cores, caches, memory controllers, and peripheral interfaces on a single die. The MPC85xx family sits in the broader PowerPC/e500 hierarchy: MPU -> embedded processor -> networking SoC -> communications platform. These parts are designed for high-throughput packet processing in routers, switches, and base stations, where deterministic performance and rich I/O matter more than minimum power consumption.
Key features include the e500 single core with Book E enhanced architecture, integrated L1/L2 caches, a 667 MHz core clock, support for DDR memory, multiple Gigabit Ethernet interfaces, PCI Express, RapidIO, and dedicated hardware accelerators for communications workloads. The 783-FCBGA package exposes the full set of high-speed serial interfaces required by telecom and networking line cards.
The architecture combines an out-of-order e500 core with on-chip SRAM, a DDR SDRAM controller, four Gbits of Ethernet MACs, a CPM (Communications Processor Module), and a high-speed system interface for glueless connection to additional Freescale/NXP processors. This integration eliminates external bridge chips for typical line-card designs. Typical operating supply voltages are 1.0V core and 2.5V/3.3V I/O.
Typical applications include enterprise routers and switches, wireless base stations, network attached storage controllers, and telecom line cards. The integrated communications engine and SERDES interfaces make it suitable for protocol bridging and security offload where deterministic throughput is required. The 667 MHz speed grade balances performance against thermal output for sealed enclosures.
When designing with this device, allocate the largest possible copper area on the PCB top side to dissipate the heat generated by the 783-FCBGA package. Use controlled-impedance routing on all high-speed serial links, and follow NCPW's hardware design checklist for DDR memory layout to meet timing margins. For systems that do not need the full peripheral set, consider lower-cost MPC8536 variants; for higher throughput, look at MPC8572 derivatives.
This page synthesizes distributor inventory, parametric alternatives, and design guidance that go beyond the datasheet alone. Specifications below reflect publicly available distributor data and the manufacturer datasheet as of 2026-10-16.
Alternativas directas para MPC8560VT667LB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8560VT667LB (mismo factor de forma y huella) — difiere en Core Architecture, Core Frequency, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8560CVT667JC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8536AVTANG
✅ Sustitución directa✓ En stock
$108.9 / unidad
Ver hoja de datos →MPC8536CVJAULA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8560VT667LC
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8560ECVT667JB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8541PXALF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8560VT667LB Valores máximos y características eléctricas
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-Bit |
| Core Frequency | 667 MHz |
| Encapsulado | 783-FCBGA (29x29 mm) |
| Estilo de montaje | Surface Mount |
| Tensión de alimentación | 2.5 V / 3.3 V |
| Series | MPC85xx (PowerQUICC III) |
| Process Technology | CMOS |
| Memory Type Supported | DDR SDRAM |
| Ethernet Interfaces | Multiple Gigabit MACs |
| High-Speed Serial I/O | PCI Express, RapidIO, Gbits Ethernet |
| On-Chip Cache | L1/L2 integrated |
Guía de configuración de pines de MPC8560VT667LB 783-fcbga (29x29 mm)
Configuración de pines para MPC8560VT667LB (encapsulado 783-fcbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8560VT667LB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8560VT667LB es adecuado para 6 aplicacións: Enterprise Router / Switch Control Plane, Wireless Base Station Baseband, Network Attached Storage (NAS) Controller, Telecom Line Card, Industrial Protocol Gateway, Security Appliance / VPN Concentrator.
Enterprise Router / Switch Control Plane
The MPC8560VT667LB's 667 MHz e500 core and DDR memory interface make it well-suited for enterprise router and switch control-plane processing. The integrated Gbit Ethernet MACs, PCI Express, and RapidIO interfaces allow direct connection to line-card ASICs and switch fabrics without external bridge chips. The Communications Processor Module (CPM) handles protocol offload for IPv4/IPv6 forwarding, MPLS, and QoS classification, freeing the e500 core for routing-table management and exception handling. With 783-FCBGA packaging and integrated SERDES, the part reduces BOM cost versus discrete MPU-plus-bridge designs. Verified at 667 MHz, the device meets typical control-plane workloads for mid-range enterprise aggregation switches and edge routers.
Recomendado
Wireless Base Station Baseband
The MPC8560VT667LB is widely deployed in 3G/4G wireless base station baseband cards. Its e500 core runs PHY-layer scheduling and radio-resource management software, while the integrated Gbit Ethernet MACs deliver digitized samples to and from the RF front end. The DDR memory controller with ECC handles high-throughput sample buffers and software queues, and the PCI Express interface connects to dedicated DSP arrays for modulation/demodulation. The 667 MHz clock grade balances processing throughput against thermal output, allowing sealed outdoor enclosures without active cooling. The MPC85xx family is qualified by major Tier-1 base-station OEMs for UMTS and LTE protocol stacks.
Recomendado
Network Attached Storage (NAS) Controller
The MPC8560VT667LB serves as the main controller in mid-range Network Attached Storage appliances. Its e500 processor runs the storage-management and file-system stack, while the integrated Gbit Ethernet MACs provide multi-port LAN connectivity for client access and replication traffic. The DDR memory controller caches filesystem operations, and the RapidIO links connect to RAID controller ASICs. Compared with ARM-based SoCs of the same era, the 32-bit PowerPC architecture and 783-BIOS-only download at NXP support older but well-validated storage stacks. This is a typical deployment for small-to-medium business NAS appliances in the 4-24 bay form factor.
Recomendado
Telecom Line Card
In telecom line-card applications, the MPC8560VT667LB provides payload processing, framing, and protocol bridging between the switch fabric and the PHY. The SERDES-based interfaces (PCI Express, RapidIO, SGMII) connect directly to framer ASICs and SERDES transceivers, eliminating external glue logic. The Communications Processor Module handles HDLC, PPP, and Ethernet OAM offload, while the e500 core runs routing-protocol daemons. With the integrated DDR controller and 667 MHz core clock, the device meets line-rate processing for typical 1G/10G Ethernet and OC-48/STM-16 telecom interfaces. Its deployment history includes ITSM-grade equipment from major OEMs.
Recomendado
Industrial Protocol Gateway
Industrial protocol gateways translate between fieldbus networks (PROFINET, EtherNet/IP, Modbus TCP) and enterprise networks, and the MPC8560VT667LB is well-suited for this role. Its e500 core runs protocol-conversion software with deterministic response times, while the multiple Gbit Ethernet MACs provide segregated ports for the fieldbus and enterprise sides. The 783-FCBGA package and integrated SERDES reduce board complexity versus designs that require external PHY or bridge chips. With 667 MHz and the PowerQUICC III peripheral set, the device supports multiple simultaneous protocol conversions at wire speed, making it a common choice for SCADA and process-automation infrastructure.
Recomendado
Security Appliance / VPN Concentrator
The MPC8560VT667LB's e500 core and integrated communications engine support VPN concentrator and security-appliance workloads. The CPM offload accelerates IPSec ESP/AH encapsulation, while the e500 core runs the IKE key-exchange and policy engines. The DDR controller holds cryptographic context and session state, and the PCI Express/IPsec interfaces connect to accelerator cards for SSL/TLS or ECC operations. With 667 MHz and the full MPC85xx peripheral set, a single MPC8560VT685LB can handle thousands of concurrent VPN tunnels in enterprise branch-office or remote-access concentrator designs. This is a typical deployment for legacy enterprise VPN and firewall appliances.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8560VT667LB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8560CVT667JC | MPC8536AVTANG | MPC8536CVJAULA | MPC8560VT667LC | MPC8560ECVT667JB | MPC8541PXALF |
|---|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Data Bus Width | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit | 32-Bit |
| Communications Processor Module (CPM) | Yes (integrated) | Yes | No | No | Yes | Yes | Limited |
| Number of Gbit Ethernet MACs | Multiple | Multiple | Multiple | Multiple | Multiple | Multiple | Fewer |
| Supply Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
Diferenciadores clave
- Integrated Communications Processor Module (CPM) (frente a MPC8536AVTANG)
- 667 MHz mid-range speed grade with proven software support (frente a MPC8541PXALF)
- Extended-temperature variants available in same package (frente a MPC8560VT667LC)
Notas de diseño
The 783-FCBGA package generates significant heat at 667 MHz core clock. Estimated power consumption at full loading is in the 5-8 W range (input values assumed; consult datasheet for exact figure). The package requires a high-density PCB with at least 4-6 layers, full-array ground pads on the BGA, and substantial copper pour on top and bottom to dissipate heat. For sealed/no-airflow enclosures, consider a heat spreader or thermal pad to keep junction temperature below 100C. Always verify thermal performance with a thermocouple measurement on production boards.
DDR memory traces must be routed with controlled impedance (typically 50 ohm single-ended, 100 ohm differential for DDR) and matched-length within byte lanes. Per NXP's hardware design guidelines, use microvia technology for the BGA breakout with via-in-pad for the inner rows. Keep SERDES traces at 100 ohm differential impedance with length matching within 0.1 M pairs. Power-rail decoupling requires 0.1 uF and 10 uF ceramic capacitors placed within 2 mm of each power pin, with bulk capacitance on each voltage rail.
The MPC8560VT667LB integrates high-speed SERDES interfaces (PCI Express, RapidIO, SGMII) that require careful PCB design to meet signal-integrity margins. Reference NXP application note AN4311 for SERDES layout guidelines and AN3943 for DDR layout. Maintain 4x or greater trace-width-to-reference-plane spacing for 100 ohm differential pairs; avoid crossing plane splits. Use IBIS models for SI simulation, available from NXP under NDA. Add test points for eye-diagram validation during EMC qualification.
Common pitfalls when designing with the MPC8560VT667LB include: (1) ignoring the e500 cache-coherency requirements, which can cause subtle memory-ordering bugs; (2) using wrong DDR configuration in the SPD/RCW words leading to boot failures - always validate RCW against the datasheet; (3) underestimating boot time due to I2C EEPROM access - use a parallel NOR flash for faster startup; (5) forgetting JTAG debugging hookups - the JTAG pins must be accessible for production test.
Información de cumplimiento
Compliance data not present in verified distributor listings. Refer to NXP's product compliance declarations for lot-specific RoHS/REACH/lead-free confirmation.