MPC8569CVTANKGB - PowerPC e500v2 MPU 800MHz | NXP | Networking
N.º de pieza: MPC8569CVTANKGB ✗ Fin de vidaMPC8569CVTANKGB Descripción general
A microprocessor (MPU) is a CPU-centric system-on-chip that integrates core processing, memory control, I/O peripherals, and accelerators into a single IC. The MPC85xx family is a NXP line of Power Architecture processors targeting wired and wireless networking equipment, where line-rate packet processing, deterministic interrupt latency, and high-throughput memory subsystems are mandatory. The QUICC Engine augments the e500 core by offloading TDM, HDLC, Ethernet, and ATM workloads, reducing software complexity and freeing CPU cycles for control-plane and management functions.
Key features include 32 KB instruction and 32 KB data L1 caches, a unified L2 cache configurable up to 512 KB, hardware ECC on external memory, integrated security (IEE, AES, DES/SHA, RNG), and four GbE ports plus a 5-GHz SerDes fabric that supports PCI Express, Serial RapidIO, and SGMII. Operating temperature range spans -40 °C to +105 °C (extended industrial) per NXP's MPC8569 documentation set.
The MPC8569 is built on a 90 nm CMOS process and is offered in multiple speed grades (533, 667, 800, 1000, and 1333 MHz). Memory interfaces include a 64-bit DDR2/DDR3 controller with ECC, an 8/16-bit local bus, and dedicated packet-buffer descriptors. Storage and peripherals include 2× USB 2.0, 2× SATA 2.0, multiple UARTs, I²C, SPI, timers, GPIOs, and a NAND flash controller for boot operation.
Typical applications include multiservice routers and gateways, DSLAM line cards, edge switches, industrial control, and secure networking. Engineers commonly pair it with NXP SFP PHYs, Vitesse/Marvell Ethernet transceivers, and DDR2 ECC memory to build line-card mezzanines for Layer 2–4 forwarding.
When designing with this device, allocate adequate copper for the FCBGA thermal envelope, follow NXP's DDR2/DDR3 layout guide for matched impedance, and respect the SerDes reference-clock jitter budget to preserve the 3.125 GBaud link budget.
This page synthesizes distributor pricing, lifecycle status, and same-family cross references that go beyond the manufacturer datasheet — useful for sourcing and second-source decisions on legacy NXP communications-processor designs.
Alternativas directas para MPC8569CVTANKGB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
MPC8569ECVTANKGB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8569CVTANJGB
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MPC8569CVTAQLB
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MPC8569CVTANLGB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8569CVTANBGB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8569CVTANKGB Valores máximos y características eléctricas
| Architecture | PowerPC e500v2 (32-bit) |
| Core Count | 1 |
| Operating Frequency | 800 MHz |
| MIPS | Up to 2799 MIPS at 1.33 GHz (estimated Dhrystone) |
| L1 Cache (I/D) | 32 KB / 32 KB |
| L2 Cache | Up to 512 KB (unified, configurable) |
| Physical Addressing | 36-bit |
| Co-Processor / DSP | QUICC Engine (communications accelerator) |
| Memory Controller | DDR2, DDR3, SDRAM with ECC |
| Ethernet Interfaces | 4× Gigabit Ethernet |
| Serial Interfaces | PCI Express, Serial RapidIO, SGMII (multiplexed SerDes) |
| Encapsulado | 783-FCBGA (29 × 29 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40 °C to +105 °C (extended) |
| Process Technology | 90 nm CMOS |
| Part Status | Obsolete per NXP product lifecycle |
Guía de configuración de pines de MPC8569CVTANKGB 783-fcbga (29 × 29 mm)
Configuración de pines para MPC8569CVTANKGB (encapsulado 783-fcbga (29 × 29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8569CVTANKGB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8569CVTANKGB es adecuado para 6 aplicacións: Multiservice Routers and Gateways, DSLAM Line Cards and Access Aggregation, Industrial Control and Substation Networking, Edge Switches and Network Appliances, Wireless Base-Station Controllers (Legacy), Printers, Imaging and Embedded Industrial Servers.
Multiservice Routers and Gateways
The MPC8569CVTANKGB targets multiservice routers and residential gateways where deterministic packet processing, hardware protocol offload, and high-throughput memory subsystems are mandatory. Its 800 MHz e500v2 core delivers up to 2799 MIPS scaling headroom while the QUICC Engine handles TDM, HDLC, ATM, and Ethernet workloads in parallel, freeing the CPU for control-plane and forwarding software. The 4× integrated GbE ports plus SerDes fabric (PCI Express, Serial RapidIO, SGMII) simplify line-card design, and the DDR2/DDR3 ECC controller sustains wire-rate forwarding with low jitter. Compared with software-only routing stacks, the QUICC Engine offload reduces CPU interrupts by up to 60 percent on PPPoE / IPsec workloads, making the MPC8569 ideal for SOHO to SMB gateway appliances.
Recomendado
DSLAM Line Cards and Access Aggregation
DSLAM line cards and access-aggregation nodes require deterministic latency, hardware-assisted ATM/PTM offload, and small-form-factor line-card designs. The MPC8569CVTANKGB integrates exactly these capabilities: the QUICC Engine accelerates ATM AAL2, AAL5, PPP, MLPPP, and HDLC, the DDR2/DDR3 memory controller buffers per-subscriber traffic, and four GbE ports aggregate traffic upstream to the uplink switch. With 36-bit physical addressing the device can map full subscriber address tables and per-flow QoS policies in external memory. The QUICC Engine parallelism allows the MPC8569 to scale to higher-density DSLAM line cards than previous MPC8555-class parts while sharing the same software drivers, accelerating time-to-market for telecom OEMs.
Recomendado
Industrial Control and Substation Networking
Industrial control and substation-automation networks require deterministic Ethernet, low-latency control loops, and extended operating temperature ranges. The MPC8569CVTANKGB's -40 °C to +105 °C industrial temperature range, ECC-protected DDR2 memory controller, and Serial RapidIO support make it appropriate for IEC 61850 substation gateways, programmable automation controllers (PACs), and remote terminal units (RTUs) with IEC 62439 PRP/HSR redundancy. Its hardware security engine provides AES/DES/SHA acceleration for authenticated control messages, and its QUICC Engine can run legacy serial protocols used in SCADA. Compared to industrial SBCs that use ARM Cortex-A cores, the MPC8569's deterministic interrupt latency and hardened industrial temperature rating provide a clear advantage for grid applications.
Recomendado
Edge Switches and Network Appliances
Small to mid-range edge switches and network appliances benefit from the MPC8569CVTANKGB's mix of multi-protocol I/O, hardware cryptography, and integrated GbE ports. Designers can build compact L2/L3 switches or security appliances using one MPC8569 to handle the control plane while the data plane uses external NPUs or switches. The PCI Express port connects to external 10 GbE / switching fabric, while the QUICC Engine handles management interfaces and legacy WAN protocols. Hardware AES/DES/SHA acceleration supports IPsec VPN throughput that software implementations cannot match, and the DDR2/DDR3 ECC controller sustains high-bandwidth encrypted traffic without overheating. Compared with x86-based small-form-factor appliances, the MPC8569 platform delivers lower BOM cost and lower power for the same VPN throughput.
Recomendado
Wireless Base-Station Controllers (Legacy)
Legacy wireless base-station controllers and BTS aggregation nodes use the MPC8569CVTANKGB to process TDM backhaul, Abis/Abis-over-IP traffic, and sector-side serial interfaces. The QUICC Engine's HDLC and ATM AAL2 acceleration aligns with the 3GPP backhaul stack, while the 800 MHz e500v2 CPU runs protocol stacks for the O&M/RAN side. Four GbE ports provide IP-side connectivity, and the DDR2 ECC controller buffers bursty session traffic during HSDPA/LTE handovers. With extended industrial temperature grading and a 90 nm CMOS process qualified for long-life deployments, the MPC8569 remains a stable platform for operators maintaining 3G/early-LTE sites.
Recomendado
Printers, Imaging and Embedded Industrial Servers
Industrial printing and imaging systems leverage the MPC8569CVTANKGB for high-throughput image-pipeline controllers, RIP processing, and embedded web-management interfaces. The 800 MHz e500v2 core plus QUICC Engine delivers parallel processing of concurrent image data and communications, and the DDR2/DDR3 controller accommodates high-bandwidth pixel data paths. PCI Express connectivity drives external image-acquisition DSPs or FPGA accelerators, while 4× GbE enables clustered printer fleets. ECC memory and the extended -40 °C to +105 °C temperature range suit industrial shop-floor environments. Compared with separate CPU + Ethernet-controller designs, the MPC8569's single-chip integration reduces BOM cost and long-term MTBF exposure.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8569CVTANKGB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8569ECVTANKGB | MPC8569CVTANJGB | MPC8569CVTAQLB | MPC8569CVTANLGB | MPC8569CVTANBGB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29 × 29 mm) | 783-FCBGA (29 × 29 mm) - same | 783-FCBGA (29 × 29 mm) - same | 783-FCBGA (29 × 29 mm) - same | 783-FCBGA (29 × 29 mm) - same | 783-FCBGA (29 × 29 mm) - same |
| Core Architecture | PowerPC e500v2 (1 core, 32-bit) | PowerPC e500v2 (1 core, 32-bit) | PowerPC e500v2 (1 core, 32-bit) | PowerPC e500v2 (1 core, 32-bit) | PowerPC e500v2 (1 core, 32-bit) | PowerPC e500v2 (1 core, 32-bit) |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| QUICC Engine | Enabled | Enabled | Enabled | Enabled | Enabled | Enabled |
| Extended Temperature | Industrial, -40 to +105 °C | Yes (full -40 to +125 °C) | Industrial, -40 to +105 °C | Industrial, -40 to +105 °C | Industrial, -40 to +105 °C | Industrial, -40 to +105 °C |
| RoHS Status | Compliant per NXP product data | Compliant | Compliant | Lead-free only | Compliant | Compliant |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Integrated QUICC Engine communications accelerator (frente a MPC8555EVTAPF)
- DDR2/DDR3 ECC controller with 36-bit physical addressing (frente a MPC8560VT833LC)
- Extended temperature grading on the same die (frente a MPC8569CVTANKGB vs MPC8569ECVTANKGB)
- Hardware security engine (IEE/AES/DES/SHA/RNG) (frente a MPC8555EVTAPF)
Notas de diseño
The 783-FCBGA (29 × 29 mm) package requires a 1 oz copper heat-spreading layer directly under the die and 4+ thermal vias connecting to inner copper planes. Estimated: at full CPU + QUICC Engine utilization the part dissipates roughly 4–6 W; without forced airflow, case temperature must stay below 105 °C to remain within the industrial spec window. Adhere to the NXP AN4188 thermal-management application note when laying out the heat-sink attach.
Route the 64-bit DDR2/DDR3 ECC memory interface with matched impedance of 50 Ω single-ended / 100 Ω differential, with maximum 6-layer controlled-impedance stack-up. Bypass each VDD/VSS pair with 0.1 µF X7R MLCC in the package keepout. Reference NXP application note AN3367 for topology and derating guidance. Keep SerDes lanes matched within 0.025 mm and use length-matched ground shielding.
Use a TXCO-grade crystal or external clock driver for the DIFF_SYSCLK input; cumulative jitter must remain under 5 ps RMS to hold 3.125 GBaud SerDes. For multi-PHY designs, follow the NXP layout guide for the parallel Differential-pair length matching and avoid stubs on SerDes lines. Estimated: at maximum SerDes rate, 20–30 ps of deterministic jitter leaves margin for 0.7 UI of total budget on the receiver end.
Do not attempt to substitute cross-family QorIQ parts without re-spinning the boot loader and SERDES configuration — pinout differs across the MPC85xx, P-series, and T-series. Do not exceed 1.05 V core voltage during ramp; soft-start sequencing is hardware-managed but the 1.0 V rail must reach spec within 50 ms. Confirm CorAid/CopyBack fuse settings before committing the firmware to OTP, as IC revisions differ between fuse-stamped variants.
Información de cumplimiento
RoHS and REACH compliant per NXP MPC8569 product page. Not AEC-Q100 qualified — this is an industrial telecommunications/MPU part, not an automotive IC. Backed by Rochester Electronics' certified surface as obsolete-lifecycle authorized aftermarket stock.
