MPC8569EVTAUNLB - PowerPC e500v2 MPU 1.33GHz 783-FCPBGA | NXP
N.º de pieza: MPC8569EVTAUNLB ✓ ActivoMPC8569EVTAUNLB Descripción general
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing the operating system and application workloads. The MPC85xx family is NXP's (formerly Freescale) high-end communications processor line, fitting into the broader taxonomy of: MPU -> embedded processor -> integrated circuit -> semiconductor. These parts target networking, telecom, and data-plane applications where deterministic throughput, hardware offload engines, and signal-processing performance matter more than raw single-thread frequency.
Key features include a 32-bit e500v2 core with double-precision floating-point, 36-bit physical addressing for large memory mapping, integrated peripherals that reduce external component count, and a typical operating voltage set of 1.5V / 1.8V / 2.5V / 3.3V across separate supply rails. The 783-FCPBGA package provides high-density interconnect for multi-GHz operation while supporting board-level signal integrity at GbE and serial RapidIO data rates.
The MPC8569EVTAUNLB uses a 0.04-micron process technology and integrates Power Architecture technology peripherals - including enhanced local bus, DDR memory controller, DMA, and serial interfaces - eliminating the need for many companion chips. Its estimated performance ceiling of 2799 MIPS at 1.333 GHz positions it for wire-speed packet processing, network protocol termination, and embedded data-path workloads.
Typical applications include enterprise networking switches and routers, telecom base-station control planes, industrial control servers, storage area network controllers, and secure VPN appliances. The high integration lets system designers replace multi-chip designs with one MPC8569 + memory subsystem, reducing BOM cost and board area in temperature-controlled rack-mounted equipment.
When designing with this device, allocate adequate PCB layers (typically 8-12) for the high-speed DDR and SerDes routing, and provide decoupling per the manufacturer's hardware design guide. This synthesis of distributor pricing, drop-in variants, and practical design guidance extends beyond the datasheet alone.
Alternativas directas para MPC8569EVTAUNLB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8569EVTAUNLB (mismo factor de forma y huella) — difiere en Architecture, Family, Mounting Type, Process Technology, Supply Voltages.
MPC8569VTAUNLB
✅ Sustitución directaConsulte el precio
Ver hoja de datos →MPC8569ECVTAQLJB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8569ECVTAQLB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8548EVJAUJD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8536CVJAULA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8569EVTAUNLB Valores máximos y características eléctricas
| Architecture | RISC (PowerPC e500v2) |
| Core | e500v2, 1 core, 32-bit |
| Core Frequency | 1.333 GHz |
| Estimated Performance | 2799 MIPS (Dhrystone) |
| Physical Address Space | 36-bit |
| Floating Point | Double-precision |
| Process Technology | 0.04 um |
| Package Type | FCBGA-783 (29x29 mm, 1 mm pitch) |
| Recuento de pines | 783 balls |
| Supply Voltages | 1.5V / 1.8V / 2.5V / 3.3V |
| Tipo de montaje | Surface Mount |
| Series | MPC85xx |
| Estado RoHS | Compliant |
| Family | MPC8569 (communications processor) |
Guía de configuración de pines de MPC8569EVTAUNLB fcbga-783 (29x29 mm, 1 mm pitch)
Configuración de pines para MPC8569EVTAUNLB (encapsulado fcbga-783 (29x29 mm, 1 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8569EVTAUNLB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8569EVTAUNLB es adecuado para 6 aplicacións: Enterprise Network Routers and Switches, Telecom Base-Station Control Planes, Industrial Control Servers, Storage Area Network Controllers, Secure VPN and Firewall Appliances, Aerospace Data-Acquisition Subsystems.
Enterprise Network Routers and Switches
The MPC8569EVTAUNLB's 1.333 GHz e500v2 core and integrated GbE / serial RapidIO interfaces make it a fit for control-plane and forwarding tasks in enterprise routers and Layer-3 switches. With 36-bit physical addressing, the part can map large route tables without external memory-management tricks, and Power Architecture technology eases Linux/VxWorks BSP porting for routing stacks. Placed alongside external DDR2 memory and a PHY, this MPU handles packet classification, ACL lookup, and routing-protocol termination. Compared with discrete CPU-plus-NPU designs, the integrated peripherals reduce BOM cost and board area while delivering determinism for line-rate workloads. The 783-FCBGA footprint is appropriate for rack-mounted chassis where airflow keeps junction temperature within the qualified range. Order with companion memory (DDR2) and a fanless heatsink for reliable deployment.
Recomendado
Telecom Base-Station Control Planes
Telecom base-station control planes require deterministic processing of management traffic, OAM frames, and synchronization messages - exactly the workload an MPC8569EVTAUNLB is built for. The e500v2 core with double-precision floating-point accelerates crypto and timing calculations, while the integrated DMA and local bus move data without burdening the CPU. Placed on a control-plane SBC with an RTOS, this MPU terminates L2/L3 signaling and runs protocol stacks like SCTP. Its 1.5V core and 1.8V DDR2 rails are easy to power from standard PMIC solutions, keeping the design compact. The 783-FCBGA package suits conduction-cooled AdvancedTCA / MicroTCA blades, and the EV revision is qualified for telecom environments needing long-life silicon.
Recomendado
Industrial Control Servers
Factory-automation control servers and SCADA masters benefit from the MPC8569EVTAUNLB's high-throughput e500v2 core and integrated peripherals, which eliminate the need for a companion NPU. With 36-bit physical addressing and DMA-assisted I/O, the device can serve thousands of Modbus/TCP or EtherNet/IP connections while running deterministic control software. The 1.333 GHz clock margin absorbs burst loads from PLC polling without queue spikes, and Power Architecture technology preserves instruction-level determinism critical for IEC 61131 runtimes. Placed on a conduction-cooled COM Express carrier or a custom 8-layer SBC, it dissipates modest heat while running Linux with PREEMPT_RT. The FCBGA-783 footprint integrates cleanly with industrial-grade DDR2 and industrial GbE PHYs.
Recomendado
Storage Area Network Controllers
The MPC8569EVTAUNLB is an effective iSCSI / Fibre-Channel-over-Ethernet controller for mid-range SAN arrays, combining 1.333 GHz processing with integrated DMA and PCI Express. With double-precision floating-point, it can compute RAID parity and thin-provisioning metadata at line rate, while the DDR2 controller sustains cache-coherent I/O. Placed on a RAID controller card, this MPU sits between the host PCIe interface and the disk back-end SAS expander, arbitrating commands and replicating write-cache across controllers. Power Architecture technology simplifies Linux kernel bring-up, and the extended I/O set eliminates an external bridge chip. The 783-FCBGA is appropriate for hot-swap controller modules inside redundant-array chassis.
Recomendado
Secure VPN and Firewall Appliances
High-end VPN/firewall appliances rely on the MPC8569EVTAUNLB's e500v2 core to run IPsec / SSL termination, deep-packet inspection, and routing stacks at multi-gigabit rates. The integrated crypto accelerators and DMA engines offload routine packet handling, freeing the 1.333 GHz core for stateful inspection and policy enforcement. With 36-bit physical addressing, the MPU maps the full flow table without external TLBs, and Power Architecture technology preserves a deterministic interrupt model crucial for line-rate QoS. Placed on a 1U appliance mainboard with two GbE PHYs and external DDR2, this device supports tens of thousands of concurrent flows per second. The 783-FCBGA fits the dense mainboard layout typical of 1U rack appliances.
Recomendado
Aerospace Data-Acquisition Subsystems
For aerospace data-acquisition and avionics subsystems, the MPC8569EVTAUNLB offers qualified PowerPC performance with integrated memory and I/O controllers suited to sensor aggregation. The e500v2 core with double-precision floating-point executes Kalman filtering and inertial-integration math in real time, while the integrated DMA streams data from ARINC-429 / MIL-STD-1553 transceivers. With up to 4 GB of physical memory addressable via 36-bit addressing, the MPU can buffer full flight-record data sets. Placed on a conduction-cooled avionics card with an ARINC transceiver and abundant decoupling, this device serves flight-data recorders, HUMS processors, and mission-computing platforms. The 783-FCBGA is qualified for airborne environments when the production drop-in variant is used.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8569EVTAUNLB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8569VTAUNLB | MPC8569ECVTAQLJB | MPC8548EVJAUJD | MPC8536CVJAULA |
|---|---|---|---|---|---|
| Package | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) - same | FCBGA-783 - same | FCBGA-783 (variant) - same | FCBGA-783 (variant) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | e500v2 (32-bit) | e500v2 (32-bit) - same | e500v2 (32-bit) - same | e500v1 - earlier | e500v2 - same family, lower tier |
| Core Frequency | 1.333 GHz | 1.333 GHz - same | 1.333 GHz - same | Up to 1.5 GHz (v1 core) | Up to 1.5 GHz (control-plane tier) |
| Process Technology | 0.04 um | 0.04 um - same | 0.04 um - same | 90 nm | 90 nm |
| Physical Address Bus | 36-bit | 36-bit - same | 36-bit - same | 36-bit - same | 36-bit - same |
| Floating Point | Double-precision | Double-precision - same | Double-precision - same | Single/Double precision | Double-precision - same |
| MIPS (estimated Dhrystone) | 2799 | 2799 - same | 2799 - same | Lower (v1 core) | Lower |
| Supply Voltages | 1.5V / 1.8V / 2.5V / 3.3V | 1.5V / 1.8V / 2.5V / 3.3V - same | 1.5V / 1.8V / 2.5V / 3.3V - same | 1.2V/1.5V/1.8V/2.5V/3.3V - similar | 1.0V/1.5V/1.8V/2.5V/3.3V - similar |
| Unit Price (USD, qty 1, as of 2026-10-16) | $185.00 | ~$180 | ~$210 (extended temp premium) | ~$250 (legacy/EOL stock) | ~$150 |
Diferenciadores clave
- Single-core e500v2 with double-precision FP at 1.333 GHz on 0.04um process (frente a MPC8548EVJAUJD)
- Integrated high-bandwidth peripherals including GbE / serial RapidIO (frente a MPC8536CVJAULA)
- EV revision silicon with full production drop-in path (frente a MPC8569VTAUNLB)
Notas de diseño
Estimated: at 1.333 GHz with the four supply rails (1.5V core drawing the bulk of the current), the package typically dissipates 5-10 W. Place a top-side heatsink with thermal interface material and ensure chassis airflow of at least 1 m/s; for conduction-cooled applications, mate the heatsink to the chassis wall and verify T_j < 105 C against the worst-case ambient.
Use an 8-12 layer stack-up for the FCBGA break-out region, with continuous GND and PWR planes adjacent to the top signal layer. Route DDR2, SerDes, and Ethernet differential pairs with 90-ohm impedance and length-match within the manufacturer's skew budgets; place a 0.1 uF decoupling capacitor within 5 mm of each supply pin plus bulk 10 uF tantalum at each supply island.
Estimate: at 1.333 GHz core clock and 125 MHz DDR2 clock, treat all DDR2/SerDes lines as transmission lines - use series terminators near the driver, keep stubs short, and verify SI with HyperLynx or similar before tape-out. Maintain 50-ohm single-ended and 100-ohm differential impedance; add a 4-layer test coupon for compliance verification.
Do not power the part on without configuring all four supply rails in the correct sequence (core before I/O is recommended). Confirm firmware boot configuration against the latest NXP errata before releasing production - the EV silicon revision has known anomalies resolved in the production VTAUNLB variant.
Información de cumplimiento
RoHS and REACH compliant per NXP product environmental disclosure. Operating temperature range marked [DATA_NEEDED] - confirm against the manufacturer datasheet before deployment.
