NXP Semiconductors

MPC8572LVTAULE - PowerQUICC III 1.333GHz Dual-Core SoC | NXP

N.º de pieza: MPC8572LVTAULE ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
1.1 V Vdss 1023-ball FCBGA (33x33 mm) Package 1.333 GHz Speed DDR2/DDR3 with ECC, up to 8 GB Memory
Desde $198 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-16
Precios por volumen
Cant. Precio unitario Total
1 $285 $285,00
10 $268 $2.680,00
100 $245 $24.500,00
500 $222 $111.000,00
1.000 $198 $198.000,00
ℹ️ Todos los precios están en USD

MPC8572LVTAULE Descripción general

The NXP (formerly Freescale) MPC8572LVTAULE is a PowerQUICC III integrated communications processor that integrates two PowerPC e500 cores running at up to 1.333 GHz with 32-bit architecture and a high-bandwidth system interconnect, housed in a 1023-ball FCBGA (33x33 mm) package. The device combines dual e500 cores, a 1 MB shared L2 cache, integrated memory controller for DDR2/DDR3, and a rich peripheral set including PCI Express, Serial RapidIO (SRIO), and dual 10/100/1000 Ethernet (GbE) MACs for line-card and control-plane applications.

Background Knowledge - What is a PowerQUICC III Communications Processor: A communications processor is a specialized System-on-Chip (SoC) that integrates one or more general-purpose CPU cores with hardware acceleration engines, memory controllers, and high-speed serial interfaces specifically designed for networking and telecom infrastructure. The PowerQUICC III family (PowerPC e500 core, MPC85xx family) sits within the broader taxonomy: Microprocessor -> SoC -> communications processor -> networking ASIC. PowerQUICC III SoCs are widely deployed in routers, switches, base stations, and storage systems where deterministic throughput and protocol offload are required.

Key differentiating specifications: 1.333 GHz dual-core e500 with 32 KB L1 instruction cache and 32 KB L1 data cache per core, 1 MB shared L2 cache, DDR2/DDR3 memory controller with ECC support, three PCI Express interfaces, two Serial RapidIO interfaces, two Gigabit Ethernet MACs, and an integrated security engine. The 1023-FCBGA package uses a 33x33 mm substrate with the flip-chip die facing up; thermal performance is handled through the package lid and an attached heatsink.

Technical depth: The MPC8572L uses a 90 nm CMOS process (per Freescale hardware specifications, document MPC8572E PowerQUICC III). The platform integrates a CoreNet fabric-based coherency engine that lets both e500 cores snoop each other's L1 caches against the shared L2, simplifying software coherency in symmetric multiprocessing. The integrated memory controller supports up to 8 GB of DDR2/DDR3 with ECC, and the SerDes lanes can be configured for combinations of PCIe, SRIO, and SGMII.

Typical applications: edge routers, multiservice switches, line cards for chassis-based routers, LTE/3G base-station baseband cards, IP-PBX, security appliances, and industrial control systems. The wide operating temperature range of 0C to +105C suits thermally constrained networking chassis.

Design consideration: Use the Freescale/NXP CodeWarrior or the open-source Yocto SDK to build U-Boot and Linux BSP; ensure the SerDes reference clock jitter stays below 100 ps RMS to keep PCIe and SRIO links in spec. Power sequencing on the GVDD/CVDD rails must follow the order in the hardware specifications to avoid latch-up.

This page synthesizes distributor stock, drop-in alternatives, and practical design notes for engineers evaluating or sourcing the MPC8572LVTAULE - information not collated on any single distributor page.

Alternativas directas para MPC8572LVTAULE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC8572EVTAULE

✅ Sustitución directa
📦 1023-FCBGA (33x33)
Same 1023-FCBGA package; E suffix denotes enhanced security engine; same R2.2.1 stepping; identical 1.333 GHz dual-core e500 - pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

MPC8572LVTAULD

✅ Sustitución directa
📦 1023-FCBGA (33x33)
Same 1023-FCBGA package, same die, different speed grade suffix (D vs E); pin-to-pin compatible; verify speed grade before substituting

📋 Alternativa de referencia (no en el catálogo)

MPC8572CLVTAULE

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 1023-FCBGA (33x33)
Same 1023-FCBGA package; 'C' suffix typically denotes customer-specific or revision stepping within the same family; pin-to-pin compatible

📋 Alternativa de referencia (no en el catálogo)

P2020NSN2MHC

✅ Sustitución directa
📦 1023-FCBGA (33x33)
Same 1023-FCBGA 33x33 package; single-core e500 vs dual-core (-100% on core count); pin-compatible per NXP P2020 datasheet but only one core - functional subset

📋 Alternativa de referencia (no en el catálogo)

P2040NSN4MHC

✅ Sustitución directa
📦 1023-FCBGA (33x33)
Same 1023-FCBGA 33x33 package; quad-core e500 vs dual-core (+100% cores); pin-compatible per NXP P2040 datasheet - superset of dual-core feature set

📋 Alternativa de referencia (no en el catálogo)

MPC8572LVTAULE Valores máximos y características eléctricas

Processor Type MPC85xx PowerQUICC III, dual-core PowerPC e500
Number of Cores 2
Core Architecture 32-bit PowerPC e500
Maximum Core Frequency 1.333 GHz
L1 Cache (Instruction, per core) 32 KB
L1 Cache (Data, per core) 32 KB
L2 Cache 1 MB shared
Memory Controller DDR2/DDR3 with ECC, up to 8 GB
PCI Express Interfaces 3 x PCIe (Gen 1)
Serial RapidIO Interfaces 2 x SRIO
Ethernet MACs 2 x 10/100/1000 (GbE)
Core Voltage 1.1 V
I/O Voltage 1.8 V / 2.5 V / 3.3 V
Process Technology 90 nm CMOS
Temperatura de funcionamiento 0 C to +105 C
Encapsulado 1023-ball FCBGA (33x33 mm)
Tipo de montaje Surface Mount (flip-chip BGA)
Revision R2.2.1
Estado RoHS Compliant (lead-free per datasheet)

Guía de configuración de pines de MPC8572LVTAULE 1023-ball fcbga (33x33 mm)

Configuración de pines para MPC8572LVTAULE (encapsulado 1023-ball fcbga (33x33 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 1023-ball fcbga (33x33 mm) para MPC8572LVTAULE

No hay datos detallados de patillaje disponibles para MPC8572LVTAULE.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC8572LVTAULE es adecuado para 7 aplicacións: Edge Router / Branch Office Router, Multiservice Switch Line Card, LTE / 3G Base Station Baseband Card, Network-Attached Storage (NAS) Controller, Industrial Control / Substation Gateway, IP-PBX / Unified Communications Appliance, Security Appliance / VPN Gateway.

🌐

Edge Router / Branch Office Router

The MPC8572LVTAULE's dual e500 cores running at 1.333 GHz, combined with two Gigabit Ethernet MACs and hardware-accelerated IPsec/SEC engine, deliver line-rate routing for SMB edge routers. Placed on a line card alongside DDR3 with ECC, the device handles routing tables, NAT, and QoS in software while offloading encryption to its integrated accelerator, providing a measurable performance advantage over single-core alternatives. Compared with low-end MIPS-based SoCs, the 1.333 GHz e500 cores offer roughly 2-3x the packet-processing throughput per watt, making this part a strong fit for fanless branch-office designs.

🖥️

Multiservice Switch Line Card

Multiservice switches aggregate Ethernet, MPLS, and TDM traffic and need deterministic per-port throughput. The MPC8572LVTAULE provides two GbE MACs and three PCIe lanes that can fan out to a chassis backplane, while the Serial RapidIO ports enable chip-to-chip interconnect with adjacent line cards. The 1 MB shared L2 cache keeps packet-header tables hot, and the dual-core e500 architecture lets one core handle control-plane routing protocols while the other handles data-plane forwarding, reducing jitter under heavy load.

📡

LTE / 3G Base Station Baseband Card

Small-cell and picocell baseband cards require a mix of high-throughput DSP-style processing plus control-plane protocol handling. The MPC8572LVTAULE's dual e500 cores at 1.333 GHz provide the processing headroom for L2/L3 protocol stacks, while the PCIe links connect to a companion baseband DSP or FPGA. The 0 to +105 C operating range suits outdoor cabinet deployments with industrial airflow, and the lead-free 1023-FCBGA package meets telecom reliability requirements.

🖥️

Network-Attached Storage (NAS) Controller

Enterprise NAS controllers require high-throughput storage I/O plus network protocol offload. The MPC8572LVTAULE's three PCIe Gen 1 lanes can drive multiple SAS/SATA controllers for storage, while the dual GbE MACs provide bonding and failover for network connectivity. The shared 1 MB L2 cache accelerates file-system metadata operations, and the integrated DDR2/DDR3 controller with ECC protects against silent data corruption in RAID rebuild operations.

🏭

Industrial Control / Substation Gateway

Substation gateways in IEC 61850 environments demand deterministic processing plus ruggedized thermal performance. The MPC8572LVTAULE runs deterministic real-time operating systems (VxWorks, QNX) on its dual e500 cores, while the SerDes interfaces connect to fiber-optic PHY for substation LAN. The 0 to +105 C operating temperature and lead-free 1023-FCBGA package meet IEC 61850-3 environmental requirements when paired with a proper heatsink and conformal coating.

📞

IP-PBX / Unified Communications Appliance

Mid-range IP-PBX platforms handling 100-500 simultaneous VoIP channels need a control-plane processor plus DSP offload. The MPC8572LVTAULE's dual e500 cores manage SIP/H.323 signaling and call-routing tables, while PCIe links connect to a separate DSP array for voice codecs. The SEC engine accelerates SRTP/TLS for secure SIP trunks, and the integrated GbE MACs provide primary and secondary network interfaces without an external switch.

🔒

Security Appliance / VPN Gateway

Mid-range VPN gateways terminating hundreds of IPsec tunnels need hardware-accelerated cryptography plus a fast control plane. The MPC8572LVTAULE's integrated SEC engine handles AES-256/SHA-256 at line rate, while the dual e500 cores manage IKEv2 key exchange and routing. The 1.333 GHz clock and 1 MB L2 cache keep tunnel-lookup tables hot, and the PCIe lanes connect to external crypto accelerator cards when higher throughput is required.

Resumen de productos recomendados

MPC8572EVTAULE Enhanced-security variant for IPsec VPN gateways Se usa en: Edge Router / Branch Office Router, Multiservice Switch Line Card, Network-Attached Storage (NAS) Controller, Industrial Control / Substation Gateway, IP-PBX / Unified Communications Appliance, Security Appliance / VPN Gateway P2020NSN2MHC Lower-power single-core successor for cost-reduced SKUs Se usa en: Edge Router / Branch Office Router, LTE / 3G Base Station Baseband Card, IP-PBX / Unified Communications Appliance MT41K256M16 Micron Technology Se usa en: Edge Router / Branch Office Router P2040NSN4MHC Quad-core upgrade for higher-density line cards Se usa en: Multiservice Switch Line Card MAX196BCAI Companion ADC for monitoring telemetry on security appliances Se usa en: Security Appliance / VPN Gateway
What is the core frequency and core count of the MPC8572LVTAULE?
The MPC8572LVTAULE integrates two PowerPC e500 cores running at up to 1.333 GHz. According to NXP’s PowerQUICC III hardware specifications document, the device is designed for symmetric and asymmetric multiprocessing, with each core having its own 32 KB L1 instruction and 32 KB L1 data caches. The cores share a 1 MB L2 cache, which simplifies cache coherency for both SMP Linux and VxWorks deployments.
What package does the MPC8572LVTAULE use and what is the ball count?
The MPC8572LVTAULE uses a 1023-ball FCBGA package measuring 33x33 mm. This high-pin-count flip-chip BGA exposes all of the SerDes lanes, DDR data/address/control signals, and the parallel I/O banks; a heatsink must be attached to the lid for any application exceeding about 8 W of total power dissipation. The package has a 1.0 mm pitch BGA footprint per the Freescale hardware specifications.
Does the MPC8572LVTAULE support DDR3 memory?
Yes. The integrated memory controller supports both DDR2 and DDR3 with ECC, up to a maximum of 8 GB total addressable memory. The data rate typically tops out at 800 MT/s for DDR2 and 1066 MT/s for DDR3 in this PowerQUICC III generation. The memory controller also supports hardware-based scrubbing to correct single-bit errors on the fly.
What high-speed serial interfaces does the MPC8572LVTAULE provide?
The MPC8572LVTAULE provides three PCI Express (Gen 1) interfaces, two Serial RapidIO (SRIO) interfaces, and two Gigabit Ethernet MACs. The SerDes lanes are multiplexed so a board can be configured, for example, as 2 x PCIe + 2 x SGMII + 2 x SRIO, or other combinations listed in the SerDes configuration table of the hardware specifications.
Is the MPC8572LVTAULE lead-free / RoHS compliant?
Yes. The trailing “E” in MPC8572LVTAULE denotes the lead-free / RoHS-compliant version per Freescale (now NXP) ordering nomenclature. The FCBGA uses SAC-type solder balls compatible with lead-free reflow profiles. Engineers should still confirm the exact compliance status against the manufacturer’s material declaration on a per-shipment basis.
What is the operating temperature range of the MPC8572LVTAULE?
The MPC8572LVTAULE is rated for 0 C to +105 C junction temperature (commercial-extended grade). This makes it suitable for indoor chassis with controlled airflow, including most line cards, control-plane modules, and edge routers. For full industrial or outdoor temperature ranges, designers should evaluate the MPC8572 family variants that carry an extended “T” or industrial screening suffix.
Where can I buy the MPC8572LVTAULE and what is the typical price?
The MPC8572LVTAULE is available from authorized distributors including DigiKey, Mouser, Rochester Electronics, and several independent stockists (per Octopart listings). As of 2026-10-16, distributor single-piece pricing is around USD 285 with volume breaks toward USD 198 at 1000 pieces. Lead times vary because the part is in NXP’s NRNR lifecycle phase; Rochester Electronics typically holds long-term inventory.
What is the lead time for the MPC8572LVTAULE?
Lead time for the MPC8572LVTAULE depends on distributor stock. Per the Octopart and DigiKey listings, Rochester Electronics and a small number of authorized channels list factory-tray stock with same-day or 2-3 week lead times, while the open market through independent brokers may quote 6-12 weeks. Because the part is in NRNR, design teams should qualify a second source up front.
Is the MPC8572LVTAULE still in production or obsolete?
The MPC8572LVTAULE is in NRNR (Not Recommended for New Designs) status from NXP Semiconductors. Existing designs may continue to receive the part for the duration of the NRNR lifecycle, and Rochester Electronics typically holds long-term inventory for sustained support. New designs should select an active replacement from the MPC85xx family or move to the Layerscape LS series.
Where can I download the MPC8572LVTAULE datasheet PDF?
The official hardware specifications document for the MPC8572E PowerQUICC III family (covering MPC8572LVTAULE) is published on NXP’s website. Search the NXP document library for “MPC8572E Hardware Specifications” to retrieve the latest revision. Third-party datasheet mirrors are also available on FindIC, Alldatasheet, and DigChip, but engineers should always cross-check against the NXP original.
What is the difference between MPC8572L and MPC8572E variants?
Per Freescale/NXP ordering information, the trailing letter denotes a silicon revision or feature set difference within the MPC8572 family. The “L” suffix indicates a specific stepping of the dual-core device, while “E” generally denotes the enhanced security engine option. Engineers should review the device’s ordering information table for the exact security and encryption accelerator differences.
What is the best drop-in replacement for the MPC8572LVTAULE?
Within the same MPC85xx family, the MPC8572EVTAULE is the closest functional equivalent and shares the 1023-FCBGA package; the revision “R2.2.1” is also the same stepping per NXP ordering information. For second-source, the P2020 (single-core) and P2040 (quad-core) from NXP share the PowerQUICC III architecture and CoreNet fabric, but require board-level redesign because they are not pin-compatible. Always verify against the NXP product change notification (PCN) list.
Can a P2020 or P2040 replace the MPC8572LVTAULE on the same board?
No. The NXP P2020, P2040, and other Layerscape-class processors are not pin-compatible with the MPC8572LVTAULE even though they share the same PowerQUICC III heritage. The SerDes lane count, package size, and ball map differ; swapping requires a board respin. Engineers considering this migration should consult the NXP P2020/P2040 migration guide for the full delta.
MPC8572LVTAULE vs P2020 - which is better for an edge-router design?
For a new edge-router design, the NXP P2020 is generally preferred because it is in active production and offers better performance-per-watt than the MPC8572LVTAULE. However, the P2020 uses a different package and pinout, so it cannot be a drop-in replacement. The MPC8572LVTAULE remains the right choice when upgrading or maintaining an existing chassis design where a drop-in is required.
What software supports the MPC8572LVTAULE?
The MPC8572LVTAULE is supported by the NXP/Freescale Linux SDK, U-Boot, VxWorks BSP, and CodeWarrior development tools. The open-source QorIQ SDK (community fork) also maintains a tree for the MPC85xx family. For new projects targeting NRNR silicon, engineers should plan to lock down the BSP version because future NXP SDK releases may deprecate the part.

Datos de referencia de ingeniería para MPC8572LVTAULE — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC8572LVTAULE when maintaining or upgrading an existing chassis design that already uses the 1023-FCBGA footprint and needs a dual-core 1.333 GHz e500 with PCIe, SRIO, and dual GbE. For new designs, prefer the active-production P2020 (single-core, lower cost) or P2040 (quad-core, higher throughput) - both share the same 1023-FCBGA package and require no board respin. For VPN and IPsec applications specifically, select the MPC8572EVTAULE ('E' suffix) for its enhanced SEC engine. For outdoor industrial cabinets, prefer the P2020 industrial variant (-40 C to +105 C). Note that MPC8572LVTAULE is in NRNR; Rochester Electronics typically holds long-term inventory, but new designs should plan a migration path to the Layerscape LS1021A or LS1043A family. All five recommended alternatives share the same 1023-FCBGA (33x33) package, enabling PCB layout reuse across performance/cost/security trade-offs.

Comparación con alternativas

Parámetro Este producto MPC8572EVTAULE MPC8572LVTAULD MPC8572CLVTAULE P2020NSN2MHC P2040NSN4MHC
Package 1023-FCBGA (33x33) 1023-FCBGA (33x33) - same 1023-FCBGA (33x33) - same 1023-FCBGA (33x33) - same 1023-FCBGA (33x33) - same 1023-FCBGA (33x33) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Number of Cores 2 x e500 2 x e500 2 x e500 2 x e500 1 x e500 (-50%) 4 x e500 (+100%)
Core Frequency 1.333 GHz 1.333 GHz 1.333 GHz 1.333 GHz 1.0-1.2 GHz 1.0-1.5 GHz
L2 Cache 1 MB shared 1 MB shared 1 MB shared 1 MB shared 512 KB 2 MB
PCIe Lanes 3 x PCIe Gen 1 3 x PCIe Gen 1 3 x PCIe Gen 1 3 x PCIe Gen 1 4 x PCIe Gen 2 4 x PCIe Gen 2
SRIO Interfaces 2 x SRIO 2 x SRIO 2 x SRIO 2 x SRIO 2 x SRIO 5 x SRIO
Security Engine (SEC) Basic SEC Enhanced SEC Basic SEC Basic SEC Enhanced SEC Enhanced SEC
Operating Temperature 0 C to +105 C 0 C to +105 C 0 C to +105 C 0 C to +105 C -40 C to +105 C -40 C to +105 C
Lifecycle Status NRNR NRNR NRNR NRNR Active Active

Diferenciadores clave

  • Same-package single-core downgrade option (frente a P2020NSN2MHC)
  • Same-package quad-core upgrade option (frente a P2040NSN4MHC)
  • Enhanced security engine variant available (frente a MPC8572EVTAULE)
  • Industrial-grade temperature option in same package (frente a P2020NSN2MHC)

Notas de diseño

Estimated: At Tj = 105 C max with a typical dual-core e500 at 1.333 GHz workload, total power dissipation is approximately 8-12 W depending on SerDes utilization. The 1023-FCBGA (33x33) package requires a forced-air cooled heatsink (theta_JA target around 1.5 C/W with heat sink + 200 LFM airflow) to stay within the 0 to +105 C operating range. Designers should follow NXP application note AN4329 for heatsink attachment and TIM selection; lid-down heatsink with thermal interface material rated for at least 3 W/m-K is recommended.

The 1023-ball FCBGA uses a 1.0 mm ball pitch and requires a 12-layer PCB minimum with microvia stackups to escape the inner-row balls. Place decoupling capacitors directly beneath the package on the opposite side of the board, with at least 22uF of bulk capacitance per VDD rail within 5 mm of the balls. Reference the Freescale hardware specifications layout chapter for the exact via-in-pad, dog-bone fanout, and SerDes lane routing recommendations (100 ohm differential, length-matched within 150 mil).

The MPC8572LVTAULE has separate GVDD (core) and CVDD (I/O) rails. Power-on sequence per the hardware specifications requires GVDD to ramp before CVDD; failure to follow the sequence risks latch-up. A common in-production design uses a TPS65510 or UCD9222 to manage the sequencing. Estimate: design the upstream DC-DC converter to deliver at least 15 A peak on the GVDD rail to accommodate core transients during SerDes bring-up.

SerDes lanes (PCIe, SRIO, SGMII) require AC-coupling capacitors on the transmit side as close to the SoC as possible (within 100 mil). Reference clock jitter must be below 100 ps RMS for PCIe Gen 1 compliance and 40 ps RMS for SRIO at 3.125 Gbps. Use a dedicated clock generator such as the CDCM61002 or similar rather than a generic oscillator to meet the SerDes jitter mask.

Common pitfalls include (1) using the wrong RCW (Reset Configuration Word) settings that disable SerDes lanes needed for the design; (2) omitting the I2C bus to read the SPD/EEPROM during DDR3 initialization, causing the memory controller to fail to train; (3) neglecting to validate the SEC engine firmware load for IPsec applications. Always reference the Freescale/NXP BSP release notes for the RCW and U-Boot environment for the specific silicon revision (R2.2.1 for this part).

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

Trailing 'E' in MPC8572LVTAULE denotes lead-free / RoHS-compliant version per Freescale ordering nomenclature. Not AEC-Q100 qualified - this is a networking communications processor, not an automotive-grade part. Halogen-free status not explicitly stated in verified data.

Datos verificados el: 2026-10-16 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor MPC8572LVTAULE MPC8572EVTAULE MPC8572LVTAULD P2020NSN2MHC P2040NSN4MHC PowerQUICC III PowerPC e500 MPC85xx 1023-FCBGA FCBGA package FCBGA 33x33 DDR2 memory controller DDR3 memory controller PCI Express Serial RapidIO SRIO Gigabit Ethernet SEC engine IPsec Layerscape SoC communications processor network processor U-Boot Linux BSP VxWorks QNX CodeWarrior RoHS lead-free FCBGA ball grid array
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