MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP
N.º de pieza: MPC860DPZQ80D4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.2 | $242,00 |
| 100 | $19.75 | $1.975,00 |
| 500 | $16.4 | $8.200,00 |
| 1.000 | $13.85 | $13.850,00 |
MPC860DPZQ80D4 Descripción general
A PowerQUICC device is a category of system-on-chip that combines a general-purpose processor with hardware communications engines (serial, Ethernet, HDLC, ATM) so that wire-speed protocol handling does not stall application code. Within the broader taxonomy, the MPC860DPZQ80D4 sits inside microprocessor (MPU) -> embedded processor -> communications SoC -> integrated circuit. Its core architecture traces back to the PowerPC 603 line, but the silicon is purpose-built for routers, bridges, and remote-access equipment rather than desktop computing.
Key features include a single 80 MHz PowerPC core, dedicated CPM supporting up to four SCCs and two SMCs, 10/100 Mbps Fast Ethernet MAC, HDLC/SDLC/UART/SPI/I2C controllers, integrated memory controller (up to 4 banks of DRAM), 4-channel DMA, timers, and a system integration unit (SIU). The device integrates communications peripherals directly on-die, eliminating an external MAC or protocol-controller ASIC and reducing BOM cost on legacy networking hardware.
The MPC860DPZQ80D4 uses a 0.32 um CMOS process with 3.3 V I/O and a 2.2 V core voltage, providing lower power consumption than earlier 5 V PowerQUICC variants. The 357-pin PBGA package supports high-density board layouts while exposing the full peripheral set, and the part is footprint-compatible with other MPC860/MPC855T family members in the same BGA, simplifying board migration.
Typical applications include 10/100 Ethernet routers and switches, ISDN terminal adapters, DSLAM line cards, industrial serial bridges, SCADA/remote telemetry gateways, and legacy telecom controller cards. The integrated Fast Ethernet MAC and multi-protocol SCC/SMC channels let a single MPC860 terminate multiple WAN or LAN links without glue logic.
Design consideration: confirm thermal budget against the 357-BGA theta_JA on your specific PCB stack-up, validate DRAM timing against the SIU memory-controller parameters, and verify that unused balls on the BGA are properly tied per the NXP hardware specifications document. Power sequencing (3.3 V before 2.2 V) must be respected to prevent latch-up.
This page synthesizes verified distributor stock, drop-in PowerQUICC alternatives from web data, and engineering design notes that go beyond the official hardware specifications document, so procurement and design teams can make a side-by-side replacement decision in one place.
Alternativas directas para MPC860DPZQ80D4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860DPZQ80D4 (mismo factor de forma y huella) — difiere en RoHS Status, Core Architecture, Operating Temperature, Processor Type, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860DTZQ80D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860DPZQ66D4
✅ Sustitución directa✓ En stock
$25.28 / unidad
Ver hoja de datos →MPC860DTCZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TZQ80D4
✅ Sustitución directa✓ En stock
$24.4 / unidad
Ver hoja de datos →MPC862PZQ80B
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860DPZQ80D4 Valores máximos y características eléctricas
| Processor Type | MPC8xx PowerQUICC, 32-bit RISC MPU |
| Core Architecture | PowerPC 603-class single core |
| Maximum Core Clock | 80 MHz |
| Core Voltage | 2.2 V |
| I/O Voltage | 3.3 V |
| Process Technology | 0.32 um CMOS |
| Communications Processor Module (CPM) | Integrated 32-bit RISC CPM with SCC/SMC |
| Serial Communication Controllers (SCC) | Up to 4 channels (Ethernet, HDLC, UART) |
| Serial Management Controllers (SMC) | 2 channels (UART/SPI/I2C) |
| Ethernet MAC | 10/100 Mbps Fast Ethernet |
| DMA Channels | 4 channels |
| Memory Controller | Integrated, up to 4 DRAM banks |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Lead Status | Contains Lead |
| Estado RoHS | Non-Compliant |
Guía de configuración de pines de MPC860DPZQ80D4 357-pbga (25x25 mm)
Configuración de pines para MPC860DPZQ80D4 (encapsulado 357-pbga (25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC860DPZQ80D4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC860DPZQ80D4 es adecuado para 6 aplicacións: 10/100 Ethernet Router, ISDN Terminal Adapter, Industrial Serial Bridge / SCADA Gateway, Legacy Telecom Line Card, Remote Access Concentrator, Embedded Serial Protocol Controller.
10/100 Ethernet Router
The MPC860DPZQ80D4 fits legacy Ethernet router designs because it integrates a 10/100 Mbps Fast Ethernet MAC and up to four SCC channels directly on-die, so a single chip can terminate one WAN and one LAN link without external protocol-controller ASICs. With an 80 MHz PowerPC core, the device sustains forwarding throughput for sub-100 Mbps WAN services (DSL, cable, ISDN) while the CPM handles HDLC and PPP framing offloaded from the CPU. Compared with newer QorIQ parts, the MPC860 is preferred only when an installed firmware base or regulator/security cert is locked to this part family. Use 32-bit SDRAM controlled by the integrated SIU memory controller and apply proper 3.3 V/2.2 V power sequencing at turn-on.
Recomendado
ISDN Terminal Adapter
The MPC860DPZQ80D4 is a strong fit for ISDN terminal adapters because its CPM provides dedicated HDLC controllers and multiple SCCs that map directly to ISDN BRI (2B+D) and PRI (30B+D) channelization. At an 80 MHz core clock, the device handles Layer-2 LAPD framing in firmware with comfortable headroom, while a UART/SMC channel serves the analog voice codec interface. The 357-BGA footprint keeps board area small for desktop terminal adapters. Drop-in alternatives such as the MPC860DTZQ80D4 simplify extended-temperature deployment of the same platform, while the integrated SIU memory controller interfaces cleanly to a single bank of 32-bit SDRAM for buffer storage.
Recomendado
Industrial Serial Bridge / SCADA Gateway
The MPC860DPZQ80D4 suits industrial serial-bridge and SCADA gateway designs because its on-chip SCCs and SMCs support multiple RS-232/485, SPI, and HDLC interfaces simultaneously, allowing one MPC860 to consolidate protocol conversion between legacy serial field buses (Modbus, DNP3, IEC 60870-5-101/104) and an upstream Ethernet link. The integrated 10/100 Ethernet MAC terminates the uplink while the CPM offloads framing, freeing the 80 MHz PowerPC core for application logic and store-and-forward buffering. The 357-BGA footprint with 0.32 um CMOS supports operation across industrial temperature ranges when paired with the MPC860DTZQ80D4 extended-temp drop-in variant. Designers should validate watchdog-timer behavior for unattended deployment.
Recomendado
Legacy Telecom Line Card
The MPC860DPZQ80D4 fits legacy telecom line-card applications where its CPM handles T1/E1 framing and HDLC encapsulation on up to four SCCs without an external framer IC. At 80 MHz, the PowerPC core performs per-channel control and alarm surveillance, while the integrated DMA engine moves payload data between the SCC FIFOs and external SDRAM managed by the SIU memory controller. The 357-BGA package provides dense I/O for backplane applications. For denser channel aggregation, the MPC862PZQ80B is a footprint-compatible upgrade in the same 357-PBGA, enabling up to 16 ATM channels through the enhanced ATM SAR inside the MPC862 CPM. Designers must respect 3.3 V-before-2.2 V power sequencing.
Recomendado
Remote Access Concentrator
The MPC860DPZQ80D4 supports remote-access concentrator designs because its integrated CPM provides multiple SCCs that terminate several analog modem, ISDN, or DSL links concurrently, while the PowerPC core runs the central RADIUS/authentication stack. The integrated 10/100 Ethernet MAC uplinks the concentrator to the aggregation router. At 0.32 um CMOS with a 2.2 V core, the part's typical power dissipation of 1.5-2.5 W (estimated from datasheet process and clock) is acceptable for rack-mounted line cards with forced-air cooling. Footprint-compatible drop-in alternatives such as the MPC860DTZQ80D4 simplify field-replacement when an extended temperature grade is needed for outdoor enclosures.
Recomendado
Embedded Serial Protocol Controller
The MPC860DPZQ80D4 is well suited as a standalone serial protocol controller where an embedded system needs to add multi-protocol HDLC/UART/SPI ports without redesigning the main processor. Its CPM runs independently of the PowerPC core, so protocol bit-banging and DMA movement occur offloaded from the host CPU. With 4 SCCs and 2 SMCs, a single MPC860 can replace two or three external protocol-controller ASICs, reducing BOM cost on legacy designs. Designers should size external SDRAM via the integrated SIU memory controller, and provide a watchdog timer in firmware because the part lacks a dedicated external-watchdog pin. The 357-BGA footprint requires careful PCB thermal via planning.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860DPZQ80D4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860DTZQ80D4 | MPC860DPZQ66D4 | MPC860DTCZQ50D4 | MPC860TZQ80D4 | MPC862PZQ80B |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 80 MHz | 80 MHz | 66 MHz | 50 MHz | 80 MHz | 80 MHz |
| Core Voltage | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| Temperature Grade | Standard | Extended | Standard | Extended | Standard | Standard |
| CPM Variant | MPC860 | MPC860 | MPC860 | MPC860 | MPC860T (enhanced) | MPC862 (ATM-capable) |
| Lifecycle | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Integrated Fast Ethernet MAC (frente a MPC860DTZQ80D4)
- Footprint-compatible BGA across the family (frente a MPC855TVR80D4)
- Higher clock speed for newer designs (frente a MPC860DTCZQ50D4)
Notas de diseño
The MPC860DPZQ80D4 requires sequenced power-on: the 3.3 V I/O rail must rise before the 2.2 V core rail to prevent internal latch-up. Typical power dissipation at 80 MHz under combined core and CPM load is in the 1.5-2.5 W range (Estimated: derived from 0.32 um CMOS process and 80 MHz clock published in the NXP hardware specifications document). Design the regulator with a 2.5 V pre-regulator feeding an LDO for the 2.2 V core, and decouple each supply pin with a 0.1 uF ceramic placed within 5 mm of the BGA ball.
The 357-BGA package requires at least 4 PCB layers with dedicated ground and power planes directly under the device. Use an 0.8 mm or finer BGA escape via pattern, and stitch the perimeter ground row with 0.3 mm vias every 1 mm. Keep DRAM traces length-matched within +/-2.5 cm on each byte lane per the SIU memory-controller timing budget in the NXP hardware specifications document. A thermal copper pour with thermal vias tied to ground is recommended to spread the 2 W dissipation.
Common MPC860 board-level pitfalls: (1) leaving JTAG pins floating causes intermittent boundary-scan failures - tie TEST/SRESET per datasheet reset circuit; (2) ignoring the HOLD and ABORT pin requirements during power-down can corrupt DRAM contents; (3) using the 357-BGA variant on a board originally designed for the QFP-packaged MPC860PVR80D4 will not work - the BGA-to-QFP pinout is not 1:1; (4) connecting both 5 V tolerant peripherals directly to the 3.3 V bus can damage I/O cells - clamp or level-shift external logic to 3.3 V.
Información de cumplimiento
RoHS non-compliant per DigiKey listing (Contains Lead). REACH, halogen-free, and conflict-mineral status not explicitly published by NXP for this obsolete part; treated as unknown. AEC-Q100 is not applicable for a communications MPU.
