MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP
N.º de pieza: MPC860TZQ80D4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $28.95 | $2.895,00 |
| 500 | $26.1 | $13.050,00 |
| 1.000 | $24.4 | $24.400,00 |
MPC860TZQ80D4 Descripción general
An MPU (Microprocessor Unit) is an integrated circuit that contains a CPU plus the peripherals and memory interfaces needed to run an embedded system, often in place of a full microcontroller when external memory and high-throughput I/O are required. The MPC860 PowerQUICC belongs to the broader taxonomy of microprocessor -> embedded processor -> PowerPC family -> communications controller. Its communications-centric integration makes it a foundational component of legacy telecom and networking equipment designs.
Key features include a 32-bit PowerPC core with 80 MHz bus speed, four SCC channels supporting Ethernet, HDLC, UART and transparent protocols, dual SPI ports, I2C interface, parallel ports, and a sophisticated memory controller with DRAM refresh and eight bank supports. The CPM offloads DMA, serial handling and protocol processing from the core, which is the architectural innovation that defines the PowerQUICC family.
The device is built on a 0.25-micron CMOS process with 3.3V core and I/O supply, integrating roughly 4.7 million transistors on a single die. The CPM contains its own RISC controller that handles low-level protocol processing, allowing the PowerPC core to focus on higher-level application logic while sustaining aggregate serial throughput exceeding 100 Mbps.
Typical applications include WAN routers, ISDN terminal adapters, Ethernet bridges, industrial control with networking, and legacy telecom infrastructure. The MPC860 is also commonly used in serial-backplane TDM systems and SCADA-style networked controllers where deterministic serial performance is required.
When designing with the MPC860TZQ80D4, ensure 3.3V supply decoupling within 25 mm of each power pin, route the 60x bus signals with controlled impedance, and use the on-chip PLL to derive the 80 MHz CPU clock from a low-frequency crystal. Proper JTAG boundary-scan probing should be enabled in production test fixtures.
This page synthesizes distributor inventory, drop-in pin-compatible alternatives, lifecycle signals, and practical layout notes that complement the manufacturer hardware specifications document rather than repeating it verbatim.
Alternativas directas para MPC860TZQ80D4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860TZQ80D4 (mismo factor de forma y huella) — difiere en Core Architecture, RoHS Status, Process Technology, Processor Type, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860TVR80D4
✅ Sustitución directa✓ En stock
$14.85 / unidad
Ver hoja de datos →MPC860PVR80D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TZR80D4
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC860TPR80D4
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC860SRVR80D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TZQ80D4 Valores máximos y características eléctricas
| Processor Type | MPC8xx PowerQUICC, 32-Bit |
| Core Architecture | PowerPC 32-bit |
| Core Frequency | 80 MHz |
| Bus Width | 32-bit |
| Operating Voltage | 3.3 V |
| Number of Cores | 1 |
| Serial Communications Controllers (SCC) | 4 channels |
| Serial Management Controllers (SMC) | 2 channels |
| SPI Controllers | 2 |
| I2C Interface | 1 |
| Encapsulado | 357-BGA (PBGA), 25 x 25 mm |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40 C to +95 C (industrial grade per suffix T) |
| Lead Status | Contains Lead (legacy PBGA) |
| Estado RoHS | RoHS non-compliant (legacy PBGA, contains lead) |
| Packaging | Tray |
| Process Technology | 0.25 micron CMOS |
Configuración de pines de MPC860TZQ80D4
| Pin A1 | [DATA_NEEDED: pin A1 function] — PBGA ball function per NXP PowerQUICC hardware specifications document; refer to datasheet for exact assignment |
| Pin B2 | [DATA_NEEDED: pin B2 function] — PBGA ball function per NXP PowerQUICC hardware specifications document; refer to datasheet for exact assignment |
Aplicaciones típicas
MPC860TZQ80D4 es adecuado para 6 aplicacións: WAN Router Control Plane, ISDN Terminal Adapter, Ethernet Bridge / LAN Switch, Industrial Serial Networking Controller, Legacy Telecom Line Card Controller, Set-Top Box and Cable Modem Control.
WAN Router Control Plane
The MPC860TZ80M4's four SCCs and on-chip CPM make it ideal for legacy branch-office WAN router control planes. Each SCC independently terminates an HDLC, PPP, or Ethernet link, while the PowerPC core runs the routing stack and management plane. At 80 MHz the device sustains aggregate WAN throughput exceeding 100 Mbps without engaging the core on serial framing. The 357-PBGA package and 3.3V supply simplify integration into mid-1990s/early-2000s router designs. The integrated memory controller interfaces directly to DRAM, SRAM and flash, eliminating external bridge logic and reducing BOM cost in cost-sensitive branch router SKUs.
Recomendado
ISDN Terminal Adapter
The MPC860TZ80M4's HDLC-capable SCCs and Time-Division Multiplexing support enable ISDN BRI and PRI terminal adapter implementations where deterministic serial latency is mandatory. The CPM handles ISDN D-channel HDLC transparently, offloading the PowerPC core so it can run upper-layer protocols. The industrial -40C to +95C temperature range suits customer-premises equipment deployed in uncontrolled environments. The 357-PBGA package fits standard ISDN adapter PCBs designed for the same footprint. NXP's PowerQUICC toolchain provides reference designs for ISDN TA firmware acceleration.
Recomendado
Ethernet Bridge / LAN Switch
The MPC860TZ80M4 serves as the management CPU in legacy Ethernet bridges and entry-level managed LAN switches. Each SCC can be configured as a 10/100 Ethernet MAC, allowing the device to terminate up to four switch ports in addition to a CPU-attached management port. The CPM accelerates packet forwarding while the core runs SNMP, spanning tree, and VLAN logic. The 3.3V supply and 357-PBGA footprint match established managed switch reference designs. The 80 MHz core clock provides sufficient headroom for Layer-2 control-plane firmware stacks typical of this era.
Recomendado
Industrial Serial Networking Controller
For industrial automation and SCADA controllers that need deterministic serial backhaul, the MPC860TZ80M4 combines four SCCs, dual SPI, and I2C in one die. The CPM ensures sub-millisecond response on serial polling loops while the PowerPC core runs the application logic. The industrial -40C to +95C operating range tolerates factory floor temperature swings. The integrated memory controller supports burst-mode DRAM for protocol buffers and SRAM for deterministic response. The 357-PBGA footprint suits ruggedized industrial PCB layouts.
Recomendado
Legacy Telecom Line Card Controller
The MPC860TZ80M4 was widely deployed in T1/E1 line cards where its HDLC-capable SCCs handled per-channel framing and the CPM managed TDM time slots. At 80 MHz the device sustains multi-channel HDLC aggregation with deterministic per-channel latency, a critical requirement for voice-grade TDM switching. The 3.3V supply and 357-PBGA package align with established line-card PCB layouts. Legacy telecom infrastructure continues to rely on this device because of its proven reliability and long-term firmware maturity across carrier networks.
Recomendado
Set-Top Box and Cable Modem Control
The MPC860TZ80M4 served as the control processor in early-generation cable modem and set-top box designs that terminated Ethernet or HDLC channels to the headend while the host CPU ran the application layer. The CPM's on-chip DMA engine reduced external buffer memory requirements, lowering BOM cost in cost-sensitive consumer premises equipment. The 357-PBGA footprint and 3.3V operation matched the small-form-factor PCB designs typical of this product category. Some legacy designs persist in field-deployed units where service contracts require long-term availability.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860TZQ80D4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860TVR80D4 | MPC860PVR80D4 | MPC860TZR80D4 | MPC860TPR80D4 | MPC860SRVR80D4 |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm, ZQ) | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same | 357-PBGA (25x25 mm, ZQ) - same |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Frequency | 80 MHz | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same | 80 MHz - same |
| Cache Size | 8 KB unified | 8 KB unified - same | 16 KB unified - superset | 8 KB unified - same | 8 KB unified - same | 8 KB unified + crypto engine |
| Operating Voltage | 3.3 V | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same | 3.3 V - same |
| SCC Channels | 4 | 4 - same | 4 - same | 4 - same | 4 - same | 4 - same |
| Operating Temperature | -40 C to +95 C (industrial T) | -40 C to +95 C - same | -40 C to +95 C - same | -40 C to +95 C - same | -40 C to +95 C - same | -40 C to +95 C - same |
| RoHS Compliance | Non-compliant (legacy PBGA) | Non-compliant - same | Non-compliant - same | Non-compliant - same | Non-compliant - same | Non-compliant - same |
Diferenciadores clave
- Highest frequency grade in the Mayether T industrial family at 80 MHz (frente a MPC860TZR66D4)
- Telecom-optimized feature set with HDLC framing on all four SCCs (frente a MPC860PVR80D4)
- CPM offload architecture maintains core utilization below 30% at 100 Mbps aggregate serial throughput (frente a Generic ARM7-based MCU)
Notas de diseño
The MPC860TZ80M4 requires a tightly regulated 3.3V supply with bulk decoupling placed within 25 mm of each power pin pair. Use a 100 uF low-ESR bulk capacitor plus 0.1 uF ceramic bypass on every VDD/VSS ball pair. The PLL supply pin requires an additional ferrite-bead-isolated 3.3V rail filtered by 10 uF + 0.1 uF to minimize jitter on the 80 MHz output. Power sequencing is not required between core and I/O rails on the T variant, but maintain monotonic ramp on initial power-up.
The 357-PBGA at 1.27 mm pitch demands 4-layer PCB with continuous ground plane beneath the BGA footprint. Route the 60x bus signals on the top layer with microstrip topology and matched-length pairing within 50 ps of the bus clock. Place the external DRAM within 50 mm of the BGA to maintain signal integrity on the memory bus, and provide at least 6 ground vias in the BGA thermal pad region for thermal dissipation. Avoid routing signals across BGA splits in the ground plane.
Estimated: at 3.3V VDD and 80 MHz core clock with full CPM activity, the MPC860TZ80M4 dissipates approximately 1.8W typical, 2.5W peak. With the 357-PBGA theta_JA of approximately 18 C/W on a 4-layer JEDEC test board, junction temperature rise is 45 C above ambient typical. At 70 C ambient, the junction reaches 115 C, well within the 125 C maximum. For sealed enclosures with limited airflow, derate ambient by 10-15 C or implement a thermal via array under the BGA to lower effective theta_JA by 2-3 C/W.
Common pitfalls when designing with the MPC860TZ80M4 include: (1) failing to configure the on-chip PLL with the correct multiplication factor for the chosen crystal frequency, causing the core to run at half or double the intended 80 MHz; (2) neglecting to enable the on-chip DRAM refresh in UPM mode, which can corrupt external SDRAM contents during idle periods; (3) leaving JTAG TAP signals floating rather than tying them through pull resistors to defined logic levels, which can interfere with boundary-scan operation; and (4) using non-3.3V tolerant peripherals on the bus, since the Mayether T does not include 5V tolerance on its parallel I/O.
Información de cumplimiento
Legacy 357-PBGA package contains lead solder balls and is not RoHS compliant per DigiKey distributor data. Reach compliance status inferred from NXP product page disclosure. AEC-Q100 not relevant for this communications-processor class.
